SE9803180L - cellular phone - Google Patents
cellular phoneInfo
- Publication number
- SE9803180L SE9803180L SE9803180A SE9803180A SE9803180L SE 9803180 L SE9803180 L SE 9803180L SE 9803180 A SE9803180 A SE 9803180A SE 9803180 A SE9803180 A SE 9803180A SE 9803180 L SE9803180 L SE 9803180L
- Authority
- SE
- Sweden
- Prior art keywords
- plastic material
- metal
- cellular phone
- deposition
- covered
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Telephone Set Structure (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The present invention relates to a method for applying conductive lines, preferably power lines, on the plastic casing of a mobile phone. The phone casing (100) is covered by a first plastic material (200) rejecting deposition of a metal, and then covered by a second plastic material (300) in strings on the first plastic material corresponding to the desired conductive lines, wherein the second plastic material (300) accept the deposition of metal, after which the metal is deposited on the second plastic material (300).
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9803180A SE9803180L (en) | 1998-09-18 | 1998-09-18 | cellular phone |
EEP200100094A EE200100094A (en) | 1998-09-18 | 1999-09-16 | A method of applying guide strips to a cellular phone body |
EP99951306A EP1133903A1 (en) | 1998-09-18 | 1999-09-16 | Method for applying conductive lines on the casing of mobile phone |
JP2000571725A JP2002525881A (en) | 1998-09-18 | 1999-09-16 | Method of forming a conductor wire on a casing of a mobile phone |
CN99810845A CN1318272A (en) | 1998-09-18 | 1999-09-16 | Method for applying conductive lines on casing of mobile phone |
BR9913796-8A BR9913796A (en) | 1998-09-18 | 1999-09-16 | Processes for applying conductive lines to a detail, and for applying a conductive circuit pattern to a detail |
PCT/SE1999/001551 WO2000018200A1 (en) | 1998-09-18 | 1999-09-16 | Method for applying conductive lines on the casing of mobile phone |
AU63768/99A AU6376899A (en) | 1998-09-18 | 1999-09-16 | Method for applying conductive lines on the casing of mobile phone |
KR1020017003047A KR20010086392A (en) | 1998-09-18 | 1999-09-16 | Method for applying conductive lines on the casing of mobile phone |
HK02102754.0A HK1041153A1 (en) | 1998-09-18 | 2002-04-11 | Method for applying conductive lines on the casing of mobile phone |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9803180A SE9803180L (en) | 1998-09-18 | 1998-09-18 | cellular phone |
Publications (2)
Publication Number | Publication Date |
---|---|
SE9803180D0 SE9803180D0 (en) | 1998-09-18 |
SE9803180L true SE9803180L (en) | 2000-03-19 |
Family
ID=20412645
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE9803180A SE9803180L (en) | 1998-09-18 | 1998-09-18 | cellular phone |
Country Status (10)
Country | Link |
---|---|
EP (1) | EP1133903A1 (en) |
JP (1) | JP2002525881A (en) |
KR (1) | KR20010086392A (en) |
CN (1) | CN1318272A (en) |
AU (1) | AU6376899A (en) |
BR (1) | BR9913796A (en) |
EE (1) | EE200100094A (en) |
HK (1) | HK1041153A1 (en) |
SE (1) | SE9803180L (en) |
WO (1) | WO2000018200A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101133312B1 (en) * | 2010-08-13 | 2012-04-04 | 삼성전기주식회사 | Electronic device having transmission line pattern embeded in case and method for manufacturing the same |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2391392A1 (en) * | 1977-05-16 | 1978-12-15 | Skf Cie Applic Mecanique | SELF-CENTERING CLUTCH STOPPER WITH GUIDING MEANS |
FR2629665B1 (en) * | 1988-03-30 | 1991-01-11 | Bendix Electronics Sa | ELECTRONIC CIRCUIT BOX |
US5693209A (en) * | 1989-09-14 | 1997-12-02 | Atotech Deutschland Gmbh | Process for metallization of a nonconductor surface |
-
1998
- 1998-09-18 SE SE9803180A patent/SE9803180L/en not_active Application Discontinuation
-
1999
- 1999-09-16 WO PCT/SE1999/001551 patent/WO2000018200A1/en not_active Application Discontinuation
- 1999-09-16 AU AU63768/99A patent/AU6376899A/en not_active Abandoned
- 1999-09-16 KR KR1020017003047A patent/KR20010086392A/en not_active Application Discontinuation
- 1999-09-16 EE EEP200100094A patent/EE200100094A/en unknown
- 1999-09-16 BR BR9913796-8A patent/BR9913796A/en not_active IP Right Cessation
- 1999-09-16 EP EP99951306A patent/EP1133903A1/en not_active Withdrawn
- 1999-09-16 JP JP2000571725A patent/JP2002525881A/en active Pending
- 1999-09-16 CN CN99810845A patent/CN1318272A/en active Pending
-
2002
- 2002-04-11 HK HK02102754.0A patent/HK1041153A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2002525881A (en) | 2002-08-13 |
KR20010086392A (en) | 2001-09-10 |
SE9803180D0 (en) | 1998-09-18 |
WO2000018200A1 (en) | 2000-03-30 |
BR9913796A (en) | 2001-05-29 |
CN1318272A (en) | 2001-10-17 |
HK1041153A1 (en) | 2002-06-28 |
AU6376899A (en) | 2000-04-10 |
EE200100094A (en) | 2002-06-17 |
EP1133903A1 (en) | 2001-09-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NAV | Patent application has lapsed |