SE9604412D0 - Förfarande och anordning vid montering av elektronik - Google Patents

Förfarande och anordning vid montering av elektronik

Info

Publication number
SE9604412D0
SE9604412D0 SE9604412A SE9604412A SE9604412D0 SE 9604412 D0 SE9604412 D0 SE 9604412D0 SE 9604412 A SE9604412 A SE 9604412A SE 9604412 A SE9604412 A SE 9604412A SE 9604412 D0 SE9604412 D0 SE 9604412D0
Authority
SE
Sweden
Prior art keywords
circuit board
earth
carrier
legs
circuit
Prior art date
Application number
SE9604412A
Other languages
English (en)
Other versions
SE510980C2 (sv
SE9604412L (sv
Inventor
Leif Bergstedt
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9604412A priority Critical patent/SE510980C2/sv
Publication of SE9604412D0 publication Critical patent/SE9604412D0/sv
Priority to AU52362/98A priority patent/AU5236298A/en
Priority to PCT/SE1997/001910 priority patent/WO1998024279A1/en
Publication of SE9604412L publication Critical patent/SE9604412L/sv
Publication of SE510980C2 publication Critical patent/SE510980C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Reversible Transmitting Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
SE9604412A 1996-11-29 1996-11-29 Anordning för montering av en kapsel på ett monteringsunderlag samt förfarande för tillverkning av dylik anordning SE510980C2 (sv)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SE9604412A SE510980C2 (sv) 1996-11-29 1996-11-29 Anordning för montering av en kapsel på ett monteringsunderlag samt förfarande för tillverkning av dylik anordning
AU52362/98A AU5236298A (en) 1996-11-29 1997-11-13 An apparatus for mounting electronics and a method of manufacturing such an apparatus
PCT/SE1997/001910 WO1998024279A1 (en) 1996-11-29 1997-11-13 An apparatus for mounting electronics and a method of manufacturing such an apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9604412A SE510980C2 (sv) 1996-11-29 1996-11-29 Anordning för montering av en kapsel på ett monteringsunderlag samt förfarande för tillverkning av dylik anordning

Publications (3)

Publication Number Publication Date
SE9604412D0 true SE9604412D0 (sv) 1996-11-29
SE9604412L SE9604412L (sv) 1998-05-30
SE510980C2 SE510980C2 (sv) 1999-07-19

Family

ID=20404813

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9604412A SE510980C2 (sv) 1996-11-29 1996-11-29 Anordning för montering av en kapsel på ett monteringsunderlag samt förfarande för tillverkning av dylik anordning

Country Status (3)

Country Link
AU (1) AU5236298A (sv)
SE (1) SE510980C2 (sv)
WO (1) WO1998024279A1 (sv)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE502007003871D1 (de) * 2007-09-28 2010-07-01 Eberspaecher Controls Gmbh & C Stromschiene mit Wärmeableitung
JP2016025229A (ja) * 2014-07-22 2016-02-08 株式会社オートネットワーク技術研究所 回路構成体

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3939444A (en) * 1974-01-11 1976-02-17 Amp Incorporated Printed circuit mountable, self grounding, multiple filter module
JPS59191761U (ja) * 1983-06-07 1984-12-19 日本電気株式会社 プリント板
US4553114A (en) * 1983-08-29 1985-11-12 Amp Incorporated Encapsulated printed circuit board filter
FR2617650B1 (fr) * 1987-07-03 1992-12-11 Orega Electro Mecanique Procede de connexion entre un circuit imprime et un substrat metallique
US4821005A (en) * 1987-12-22 1989-04-11 Amp Incorporated Electrical circuit component assembly for circuit boards
JPH066101A (ja) * 1992-06-18 1994-01-14 Nec Corp 通過帯域ろ波器取付基板
FR2702594B1 (fr) * 1993-03-12 1995-04-28 Thomson Csf Procédé de montage de connexion de transistor bipolaire.
DE69422968T2 (de) * 1993-12-22 2000-06-29 Murata Mfg. Co., Ltd. Montageanordnung für elektronisches Bauteil

Also Published As

Publication number Publication date
AU5236298A (en) 1998-06-22
WO1998024279A1 (en) 1998-06-04
SE510980C2 (sv) 1999-07-19
SE9604412L (sv) 1998-05-30

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Legal Events

Date Code Title Description
NUG Patent has lapsed