SE9003359L - Equipment for producing circuit board - solders electronic components by melting process at pre-tinned points on printed circuit - Google Patents

Equipment for producing circuit board - solders electronic components by melting process at pre-tinned points on printed circuit

Info

Publication number
SE9003359L
SE9003359L SE9003359A SE9003359A SE9003359L SE 9003359 L SE9003359 L SE 9003359L SE 9003359 A SE9003359 A SE 9003359A SE 9003359 A SE9003359 A SE 9003359A SE 9003359 L SE9003359 L SE 9003359L
Authority
SE
Sweden
Prior art keywords
points
circuit board
temp
solder
tinned
Prior art date
Application number
SE9003359A
Other languages
Swedish (sv)
Other versions
SE9003359D0 (en
Inventor
L E Borg
Original Assignee
Bofors Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bofors Ab filed Critical Bofors Ab
Priority to SE9003359A priority Critical patent/SE9003359L/en
Publication of SE9003359D0 publication Critical patent/SE9003359D0/en
Publication of SE9003359L publication Critical patent/SE9003359L/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacture And Refinement Of Metals (AREA)

Abstract

Pre-tinned locations are provided on the printed circuit using meltable solder, and the circuit points are heated with the respective electronic components placed in position. Heating is by means of a smelt bath, the temp. of which is not below that of the melting point of the solder. The smelt bath uses the same metal or metal alloy as in the solder points, or a temp. stable salt which is heated to a temp. which at least slightly exceeds the melting temp. of the solder at the component points. The circuit board is pre-heated by infrared radiation before being placed above the smelt bath, and the completed circuit board is rapidly cooled after being removed from the smelt bath. Soldering takes place in a protective gas atmosphere, e.g. nitrogen.
SE9003359A 1990-10-22 1990-10-22 Equipment for producing circuit board - solders electronic components by melting process at pre-tinned points on printed circuit SE9003359L (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SE9003359A SE9003359L (en) 1990-10-22 1990-10-22 Equipment for producing circuit board - solders electronic components by melting process at pre-tinned points on printed circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9003359A SE9003359L (en) 1990-10-22 1990-10-22 Equipment for producing circuit board - solders electronic components by melting process at pre-tinned points on printed circuit

Publications (2)

Publication Number Publication Date
SE9003359D0 SE9003359D0 (en) 1990-10-22
SE9003359L true SE9003359L (en) 1992-04-23

Family

ID=20380700

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9003359A SE9003359L (en) 1990-10-22 1990-10-22 Equipment for producing circuit board - solders electronic components by melting process at pre-tinned points on printed circuit

Country Status (1)

Country Link
SE (1) SE9003359L (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021140381A1 (en) * 2020-01-10 2021-07-15 Ghsp, Inc. Circuit board for stator windings having integral securing structures

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021140381A1 (en) * 2020-01-10 2021-07-15 Ghsp, Inc. Circuit board for stator windings having integral securing structures

Also Published As

Publication number Publication date
SE9003359D0 (en) 1990-10-22

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