SE9003359L - Equipment for producing circuit board - solders electronic components by melting process at pre-tinned points on printed circuit - Google Patents
Equipment for producing circuit board - solders electronic components by melting process at pre-tinned points on printed circuitInfo
- Publication number
- SE9003359L SE9003359L SE9003359A SE9003359A SE9003359L SE 9003359 L SE9003359 L SE 9003359L SE 9003359 A SE9003359 A SE 9003359A SE 9003359 A SE9003359 A SE 9003359A SE 9003359 L SE9003359 L SE 9003359L
- Authority
- SE
- Sweden
- Prior art keywords
- points
- circuit board
- temp
- solder
- tinned
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title abstract 5
- 238000010309 melting process Methods 0.000 title 1
- 241001062472 Stokellia anisodon Species 0.000 abstract 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract 2
- 230000008018 melting Effects 0.000 abstract 2
- 238000002844 melting Methods 0.000 abstract 2
- 239000007789 gas Substances 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229910001092 metal group alloy Inorganic materials 0.000 abstract 1
- 229910052757 nitrogen Inorganic materials 0.000 abstract 1
- 230000001681 protective effect Effects 0.000 abstract 1
- 230000005855 radiation Effects 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacture And Refinement Of Metals (AREA)
Abstract
Pre-tinned locations are provided on the printed circuit using meltable solder, and the circuit points are heated with the respective electronic components placed in position. Heating is by means of a smelt bath, the temp. of which is not below that of the melting point of the solder. The smelt bath uses the same metal or metal alloy as in the solder points, or a temp. stable salt which is heated to a temp. which at least slightly exceeds the melting temp. of the solder at the component points. The circuit board is pre-heated by infrared radiation before being placed above the smelt bath, and the completed circuit board is rapidly cooled after being removed from the smelt bath. Soldering takes place in a protective gas atmosphere, e.g. nitrogen.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9003359A SE9003359L (en) | 1990-10-22 | 1990-10-22 | Equipment for producing circuit board - solders electronic components by melting process at pre-tinned points on printed circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9003359A SE9003359L (en) | 1990-10-22 | 1990-10-22 | Equipment for producing circuit board - solders electronic components by melting process at pre-tinned points on printed circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
SE9003359D0 SE9003359D0 (en) | 1990-10-22 |
SE9003359L true SE9003359L (en) | 1992-04-23 |
Family
ID=20380700
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE9003359A SE9003359L (en) | 1990-10-22 | 1990-10-22 | Equipment for producing circuit board - solders electronic components by melting process at pre-tinned points on printed circuit |
Country Status (1)
Country | Link |
---|---|
SE (1) | SE9003359L (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021140381A1 (en) * | 2020-01-10 | 2021-07-15 | Ghsp, Inc. | Circuit board for stator windings having integral securing structures |
-
1990
- 1990-10-22 SE SE9003359A patent/SE9003359L/en not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021140381A1 (en) * | 2020-01-10 | 2021-07-15 | Ghsp, Inc. | Circuit board for stator windings having integral securing structures |
Also Published As
Publication number | Publication date |
---|---|
SE9003359D0 (en) | 1990-10-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NAV | Patent application has lapsed |
Ref document number: 9003359-8 |