SE8802700L - HARDWARE EPOXY RESIN MIXTURES - Google Patents

HARDWARE EPOXY RESIN MIXTURES

Info

Publication number
SE8802700L
SE8802700L SE8802700A SE8802700A SE8802700L SE 8802700 L SE8802700 L SE 8802700L SE 8802700 A SE8802700 A SE 8802700A SE 8802700 A SE8802700 A SE 8802700A SE 8802700 L SE8802700 L SE 8802700L
Authority
SE
Sweden
Prior art keywords
epoxy resin
hardware
image
resin mixtures
compositions
Prior art date
Application number
SE8802700A
Other languages
Swedish (sv)
Other versions
SE8802700D0 (en
Inventor
R Schmid
A Renner
W Stauffer
Original Assignee
Ciba Geigy Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ciba Geigy Ag filed Critical Ciba Geigy Ag
Publication of SE8802700D0 publication Critical patent/SE8802700D0/en
Publication of SE8802700L publication Critical patent/SE8802700L/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02—Compounds containing oxirane rings
    • C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
    • C07D303/18—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by etherified hydroxyl radicals
    • C07D303/20—Ethers with hydroxy compounds containing no oxirane rings
    • C07D303/24—Ethers with hydroxy compounds containing no oxirane rings with polyhydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3236—Heterocylic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols

Abstract

Hot-curable compositions which are stable on storage contain, in specified proportions, a) polyglycidyl ether of the formula I <IMAGE> in which X is a group <IMAGE> R is hydrogen or methyl and n is an integer from 2 to 4, b) an epoxy resin having a functionality of 2-2.5, c) a diphenol curing agent, and d) an accelerator. The compositions are particularly suitable for the production of prepregs for fibre-reinforced composite materials or for the preparation of adhesive films. They have a low viscosity even at room temperature and can therefore easily be applied. The cured mouldings are distinguished by a high glass transition temperature and high impact strength.
SE8802700A 1987-07-23 1988-07-21 HARDWARE EPOXY RESIN MIXTURES SE8802700L (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH2789/87A CH672492A5 (en) 1987-07-23 1987-07-23

Publications (2)

Publication Number Publication Date
SE8802700D0 SE8802700D0 (en) 1988-07-21
SE8802700L true SE8802700L (en) 1989-01-24

Family

ID=4241626

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8802700A SE8802700L (en) 1987-07-23 1988-07-21 HARDWARE EPOXY RESIN MIXTURES

Country Status (10)

Country Link
JP (1) JPS6465117A (en)
BR (1) BR8803679A (en)
CH (1) CH672492A5 (en)
DE (1) DE3824676A1 (en)
ES (1) ES2007540A6 (en)
FR (1) FR2618442A1 (en)
GB (1) GB2208231A (en)
IT (1) IT1226284B (en)
NL (1) NL8801857A (en)
SE (1) SE8802700L (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5179139A (en) * 1988-10-24 1993-01-12 Mitsubishi Rayon Co., Ltd. Dihydroxybiphenyl-advanced epoxy resin blends
JP2829369B2 (en) * 1988-10-24 1998-11-25 三菱レイヨン株式会社 Epoxy resin composition
US5106947A (en) * 1989-04-17 1992-04-21 Ciba-Geigy Corporation Curable composition based on cycloaliphatic epoxy resins
DE69222670T2 (en) * 1991-02-26 1998-03-12 Toray Industries Epoxy resin composition for encapsulating a semiconductor device
CN105093630A (en) * 2008-04-24 2015-11-25 日东电工株式会社 Transparent substrate
US20110313081A1 (en) 2009-03-04 2011-12-22 Markus Schroetz Thermosettable composition containing a glycidylether based on trimethyolpropane octadecaethoxilate
JP5416546B2 (en) 2009-10-23 2014-02-12 日東電工株式会社 Transparent substrate
CN103429632B (en) * 2011-03-23 2016-07-06 日产化学工业株式会社 Multi-functional epoxy compound
ITTO20130926A1 (en) * 2013-11-15 2015-05-16 Alenia Aermacchi Spa EPOXY RESIN WITH LOW HUMIDITY CONTENT

Also Published As

Publication number Publication date
ES2007540A6 (en) 1989-06-16
IT8821455A0 (en) 1988-07-22
JPS6465117A (en) 1989-03-10
NL8801857A (en) 1989-02-16
GB2208231A (en) 1989-03-15
CH672492A5 (en) 1989-11-30
SE8802700D0 (en) 1988-07-21
IT1226284B (en) 1990-12-27
GB8817080D0 (en) 1988-08-24
FR2618442A1 (en) 1989-01-27
BR8803679A (en) 1989-02-14
DE3824676A1 (en) 1989-02-02

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Legal Events

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NAV Patent application has lapsed

Ref document number: 8802700-8

Effective date: 19900629