SE7804535L - Tenn-nickellegering - Google Patents

Tenn-nickellegering

Info

Publication number
SE7804535L
SE7804535L SE7804535A SE7804535A SE7804535L SE 7804535 L SE7804535 L SE 7804535L SE 7804535 A SE7804535 A SE 7804535A SE 7804535 A SE7804535 A SE 7804535A SE 7804535 L SE7804535 L SE 7804535L
Authority
SE
Sweden
Prior art keywords
tenn
nickel alloy
nickel
alloy
Prior art date
Application number
SE7804535A
Other languages
English (en)
Inventor
M H Pollack
Original Assignee
Nasglo Int Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nasglo Int Corp filed Critical Nasglo Int Corp
Publication of SE7804535L publication Critical patent/SE7804535L/sv

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/60Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/244Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • H05K3/3473Plating of solder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
SE7804535A 1973-08-20 1978-04-20 Tenn-nickellegering SE7804535L (sv)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US38957973A 1973-08-20 1973-08-20
US48227974A 1974-06-24 1974-06-24

Publications (1)

Publication Number Publication Date
SE7804535L true SE7804535L (sv) 1978-04-20

Family

ID=27012758

Family Applications (2)

Application Number Title Priority Date Filing Date
SE7410531A SE413910B (sv) 1973-08-20 1974-08-19 Sett och bad for elektrolytisk utfellning av en legering av nickel och tenn
SE7804535A SE7804535L (sv) 1973-08-20 1978-04-20 Tenn-nickellegering

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SE7410531A SE413910B (sv) 1973-08-20 1974-08-19 Sett och bad for elektrolytisk utfellning av en legering av nickel och tenn

Country Status (10)

Country Link
JP (1) JPS5072838A (sv)
CA (1) CA1045577A (sv)
CH (1) CH592167A5 (sv)
DE (1) DE2439656C2 (sv)
FR (1) FR2241632B1 (sv)
GB (1) GB1484575A (sv)
IL (1) IL45382A (sv)
IT (1) IT1057888B (sv)
NL (1) NL7411119A (sv)
SE (2) SE413910B (sv)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL189310C (nl) * 1984-05-18 1993-03-01 Toyo Kohan Co Ltd Beklede stalen plaat met verbeterde lasbaarheid en werkwijze voor de vervaardiging.
EP2233611A1 (de) * 2009-03-24 2010-09-29 MTV Metallveredlung GmbH & Co. KG Schichtsystem mti verbesserter Korrosionsbeständigkeit
ES2764394T3 (es) * 2014-12-15 2020-06-03 Senju Metal Industry Co Aleación de soldadura para galvanización y componentes electrónicos

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2141940C2 (de) * 1971-08-21 1977-02-10 Bergische Metallwarenfabrik Dillenberg & Co Kg, 5601 Gruiten Galvanisches bad zum abscheiden von zinn/nickel-, zinn/kobalt- oder zinn/nickel/kobalt-schichten und zugehoeriges galvanisierverfahren

Also Published As

Publication number Publication date
NL7411119A (nl) 1975-02-24
IL45382A0 (en) 1974-11-29
JPS5072838A (sv) 1975-06-16
DE2439656C2 (de) 1983-06-16
SE7410531L (sv) 1975-02-21
FR2241632B1 (sv) 1979-08-03
CH592167A5 (sv) 1977-10-14
IT1057888B (it) 1982-03-30
SE413910B (sv) 1980-06-30
GB1484575A (en) 1977-09-01
FR2241632A1 (sv) 1975-03-21
CA1045577A (en) 1979-01-02
IL45382A (en) 1976-09-30
DE2439656A1 (de) 1975-03-06

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