SE7709165L - GAS SETTING OF ALUMINUM AND ALUMINUM OXIDE - Google Patents

GAS SETTING OF ALUMINUM AND ALUMINUM OXIDE

Info

Publication number
SE7709165L
SE7709165L SE7709165A SE7709165A SE7709165L SE 7709165 L SE7709165 L SE 7709165L SE 7709165 A SE7709165 A SE 7709165A SE 7709165 A SE7709165 A SE 7709165A SE 7709165 L SE7709165 L SE 7709165L
Authority
SE
Sweden
Prior art keywords
aluminum
gas setting
aluminum oxide
oxide
gas
Prior art date
Application number
SE7709165A
Other languages
Swedish (sv)
Inventor
S I J Ingrey
H J Nentwich
R G Poulsen
Original Assignee
Northern Telecom Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=4106655&utm_source=***_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=SE7709165(L) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Northern Telecom Ltd filed Critical Northern Telecom Ltd
Publication of SE7709165L publication Critical patent/SE7709165L/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31105—Etching inorganic layers
    • H01L21/31111—Etching inorganic layers by chemical means
    • H01L21/31116—Etching inorganic layers by chemical means by dry-etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31144—Etching the insulating layers by chemical or physical means using masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
    • H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
    • H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
    • H01L21/32136—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
    • H01L21/32139—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer using masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Inorganic Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • ing And Chemical Polishing (AREA)
SE7709165A 1976-08-16 1977-08-12 GAS SETTING OF ALUMINUM AND ALUMINUM OXIDE SE7709165L (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA259,126A CA1059882A (en) 1976-08-16 1976-08-16 Gaseous plasma etching of aluminum and aluminum oxide

Publications (1)

Publication Number Publication Date
SE7709165L true SE7709165L (en) 1978-02-17

Family

ID=4106655

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7709165A SE7709165L (en) 1976-08-16 1977-08-12 GAS SETTING OF ALUMINUM AND ALUMINUM OXIDE

Country Status (7)

Country Link
JP (1) JPS5322836A (en)
CA (1) CA1059882A (en)
DE (1) DE2730156C2 (en)
FR (1) FR2362216A1 (en)
GB (1) GB1554335A (en)
NL (1) NL7706627A (en)
SE (1) SE7709165L (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54118172A (en) * 1978-03-06 1979-09-13 Nichiden Varian Kk Method of dry etching aluminum
US4208241A (en) * 1978-07-31 1980-06-17 Bell Telephone Laboratories, Incorporated Device fabrication by plasma etching
US4226665A (en) * 1978-07-31 1980-10-07 Bell Telephone Laboratories, Incorporated Device fabrication by plasma etching
US4256534A (en) * 1978-07-31 1981-03-17 Bell Telephone Laboratories, Incorporated Device fabrication by plasma etching
DE2924475A1 (en) * 1979-06-18 1981-01-15 Siemens Ag Metallising of semiconductor crystals - where semiconductor is covered with metal and then with metal oxide which aids the adhesion of photolacquer masks
JPS5623745A (en) * 1979-08-01 1981-03-06 Hitachi Ltd Plasma etching device
DE3030814C2 (en) * 1979-08-17 1983-06-16 Tokuda Seisakusyo, Ltd., Zama, Kanagawa Process for plasma etching a workpiece
JPS5747876A (en) * 1980-09-03 1982-03-18 Toshiba Corp Plasma etching apparatus and method
DE3103177A1 (en) * 1981-01-30 1982-08-26 Siemens AG, 1000 Berlin und 8000 München METHOD FOR PRODUCING POLYSILIZIUM STRUCTURES UP TO THE 1 (MY) M AREA ON SUBSTRATES CONTAINING INTEGRATED SEMICONDUCTOR CIRCUITS BY PLASMA
US4426246A (en) * 1982-07-26 1984-01-17 Bell Telephone Laboratories, Incorporated Plasma pretreatment with BCl3 to remove passivation formed by fluorine-etch
JP2861785B2 (en) * 1994-02-15 1999-02-24 日本電気株式会社 Method for forming wiring of semiconductor device
US9520303B2 (en) * 2013-11-12 2016-12-13 Applied Materials, Inc. Aluminum selective etch

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3615956A (en) * 1969-03-27 1971-10-26 Signetics Corp Gas plasma vapor etching process
US3757733A (en) * 1971-10-27 1973-09-11 Texas Instruments Inc Radial flow reactor

Also Published As

Publication number Publication date
JPS5745310B2 (en) 1982-09-27
FR2362216A1 (en) 1978-03-17
DE2730156A1 (en) 1978-02-23
JPS5322836A (en) 1978-03-02
DE2730156C2 (en) 1986-01-16
CA1059882A (en) 1979-08-07
GB1554335A (en) 1979-10-17
NL7706627A (en) 1978-02-20

Similar Documents

Publication Publication Date Title
SE405961C (en) DEVICE FOR ORIENTATION AND FORMATION OF CLOSE OR CAPS
NO774380L (en) PROCEDURE FOR MANUFACTURE OF ALUMINUM CAN
SE7701465L (en) PROCEDURE FOR SURFACE TREATMENT OF ALUMINUM AND ALUMINUM ALLOYS
SE7511388L (en) PROCEDURE FOR THE PREPARATION OF FINISHED OXIDES OF METALS AND / OR OF SILICONE
IT1060717B (en) SPHEROIDAL ALUMINUM PARTICLES AND MANUFACTURING PROCEDURE
SE7709165L (en) GAS SETTING OF ALUMINUM AND ALUMINUM OXIDE
SE431746B (en) PROCEDURE FOR THE PREPARATION OF D-PHENYLGYLICINAMIDE OR D-PHENYLGYLINE AND L-PHENYLGYLINE
SE411100B (en) PROCEDURE PREPARATION OF STABILIZED GAMMA ALUMINUM OXIDE
PL204858A1 (en) METHOD OF OBTAINING PURE ALUMINUM OXIDE
PL204859A1 (en) METHOD OF OBTAINING PURE ALUMINUM OXIDE
SE423410B (en) FERRIT ALLOY AND USE OF THIS
SE7607429L (en) USE OF ALUMINUM ALLOY
SE416823B (en) ELECTRICAL LEADER OF ALUMINUM ALLOY AND PROCEDURE FOR ITS MANUFACTURING
SE7713183L (en) SELECTIVE DIFFUSION OF ALUMINUM
SE7704002L (en) DETERMINATION OF CATECHOLAMINS
NO147035C (en) MAGNESIUM OXIDE BASE GLASS SEPARATOR AND USE OF SAME
NO782209L (en) METHOD AND DEVICE FOR THE MANUFACTURE OF ALUMINUM
SE7806719L (en) YELLOW EXPLOSION COMPOSITIONS SENSITIZED WITH ALUMINUM AND AMINNITRATE
SE7708516L (en) CATALYTIC PRECIPITATION OF ALUMINUM
SE421863B (en) DAM-FREE ALUMINUM POWDER AND PROCEDURE FOR PREPARING THE SAME
SE7808528L (en) PROCEDURE FOR PROTECTIVE COATING OF ALUMINUM AND ALUMINUM ALLOYS
SE7602718L (en) DEVICE FOR COMPRESSION AND CONDENSATION OF GASES
SE416962B (en) PROCEDURE FOR PREPARATION OF ALUMINUM AND ALUMINUM ALLOYS FOR COLD FORMING
AT362941B (en) MANUFACTURE OF EXTRUDED AND STOVED-PAINTED ALUMINUM CAN
SE7510568L (en) PROCEDURE AND DEVICE FOR ELECTROLYTIC METAL COATS OF ALUMINUM TRADE