SE7608988L - Passiverade och kapslade halvledare samt sett att framstella dessa - Google Patents
Passiverade och kapslade halvledare samt sett att framstella dessaInfo
- Publication number
- SE7608988L SE7608988L SE7608988A SE7608988A SE7608988L SE 7608988 L SE7608988 L SE 7608988L SE 7608988 A SE7608988 A SE 7608988A SE 7608988 A SE7608988 A SE 7608988A SE 7608988 L SE7608988 L SE 7608988L
- Authority
- SE
- Sweden
- Prior art keywords
- semiconducers
- passivated
- enclosed
- manufactured
- enclosed semiconducers
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/492—Bases or plates or solder therefor
- H01L23/4924—Bases or plates or solder therefor characterised by the materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01014—Silicon [Si]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01019—Potassium [K]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01023—Vanadium [V]
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- H01L2924/01029—Copper [Cu]
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- H01L2924/0103—Zinc [Zn]
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- H01L2924/01039—Yttrium [Y]
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- H01L2924/01042—Molybdenum [Mo]
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- H01L2924/01047—Silver [Ag]
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- H01L2924/01051—Antimony [Sb]
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- H01L2924/01—Chemical elements
- H01L2924/01073—Tantalum [Ta]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
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- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13062—Junction field-effect transistor [JFET]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/604,722 US3996602A (en) | 1975-08-14 | 1975-08-14 | Passivated and encapsulated semiconductors and method of making same |
Publications (1)
Publication Number | Publication Date |
---|---|
SE7608988L true SE7608988L (sv) | 1977-02-15 |
Family
ID=24420755
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE7608988A SE7608988L (sv) | 1975-08-14 | 1976-08-11 | Passiverade och kapslade halvledare samt sett att framstella dessa |
Country Status (12)
Country | Link |
---|---|
US (1) | US3996602A (xx) |
JP (1) | JPS5237772A (xx) |
BR (1) | BR7605354A (xx) |
CA (1) | CA1057420A (xx) |
DE (1) | DE2636580A1 (xx) |
ES (1) | ES450690A1 (xx) |
FR (1) | FR2321192A1 (xx) |
GB (1) | GB1510294A (xx) |
IE (1) | IE44200B1 (xx) |
IT (1) | IT1062666B (xx) |
NL (1) | NL7609034A (xx) |
SE (1) | SE7608988L (xx) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4187599A (en) * | 1975-04-14 | 1980-02-12 | Motorola, Inc. | Semiconductor device having a tin metallization system and package containing same |
US4198444A (en) * | 1975-08-04 | 1980-04-15 | General Electric Company | Method for providing substantially hermetic sealing means for electronic components |
JPS531469A (en) * | 1976-06-26 | 1978-01-09 | Hitachi Ltd | Glass seal type semiconductor device |
JPS5819125B2 (ja) * | 1976-08-11 | 1983-04-16 | 株式会社日立製作所 | 半導体装置の製造方法 |
US4161746A (en) * | 1978-03-28 | 1979-07-17 | Westinghouse Electric Corp. | Glass sealed diode |
GB2031223A (en) * | 1978-09-22 | 1980-04-16 | Gen Instrument Corp | Method for bonding a refractory metal contact member to a semiconductor body |
US4571093A (en) * | 1983-11-04 | 1986-02-18 | Burroughs Corporation | Method of testing plastic-packaged semiconductor devices |
US4564885A (en) * | 1984-09-10 | 1986-01-14 | General Instrument Corporation | Rectifier with slug construction and mold for fabricating same |
USRE32829E (en) * | 1984-09-10 | 1989-01-10 | General Instrument Corp. | Rectifier with slug construction and mold for fabricating same |
NL8503023A (nl) * | 1985-11-05 | 1987-06-01 | Philips Nv | Diode en metalen stud daarvoor. |
US4745455A (en) * | 1986-05-16 | 1988-05-17 | General Electric Company | Silicon packages for power semiconductor devices |
US4888634A (en) * | 1987-07-24 | 1989-12-19 | Linear Technology Corporation | High thermal resistance bonding material and semiconductor structures using same |
US4987476A (en) * | 1988-02-01 | 1991-01-22 | General Instrument Corporation | Brazed glass pre-passivated chip rectifier |
US5151118A (en) * | 1988-07-08 | 1992-09-29 | Kabushiki Kaisha Goto Seisakusho | Method for producing a package-type semiconductor assembly |
US5008735A (en) * | 1989-12-07 | 1991-04-16 | General Instrument Corporation | Packaged diode for high temperature operation |
US5304429A (en) * | 1992-03-24 | 1994-04-19 | General Instrument Corporation | Semiconductor devices having copper terminal leads |
US5439849A (en) * | 1994-02-02 | 1995-08-08 | At&T Corp. | Encapsulation techniques which include forming a thin glass layer onto a polymer layer |
US6099783A (en) * | 1995-06-06 | 2000-08-08 | Board Of Trustees Operating Michigan State University | Photopolymerizable compositions for encapsulating microelectronic devices |
US5751061A (en) * | 1995-12-18 | 1998-05-12 | Motorola, Inc. | Semiconductor diode device with non-planar heatsink and method of manufacture |
US6111316A (en) * | 1997-08-29 | 2000-08-29 | Motorola, Inc. | Electronic component encapsulated in a glass tube |
DE102007041229A1 (de) * | 2007-08-31 | 2009-03-05 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Schaltungsanordnung und ein Verfahren zum Verkapseln derselben |
WO2019027893A1 (en) * | 2017-07-31 | 2019-02-07 | Corning Incorporated | LAMINATE ARTICLE HAVING A CENTRAL NON-GLASS PART AND A GLASS ENVELOPE AND ASSOCIATED METHODS |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3505571A (en) * | 1965-09-30 | 1970-04-07 | Gen Electric | Glass covered semiconductor device |
US3913127A (en) * | 1971-10-01 | 1975-10-14 | Hitachi Ltd | Glass encapsulated semiconductor device containing cylindrical stack of semiconductor pellets |
US3844029A (en) * | 1972-02-02 | 1974-10-29 | Trw Inc | High power double-slug diode package |
JPS4970858U (xx) * | 1972-10-04 | 1974-06-20 | ||
DE2261302A1 (de) * | 1972-12-15 | 1974-07-04 | Licentia Gmbh | Halbleiteranordnung aus einem halbleiterbauelement |
-
1975
- 1975-08-14 US US05/604,722 patent/US3996602A/en not_active Expired - Lifetime
-
1976
- 1976-08-10 CA CA258,818A patent/CA1057420A/en not_active Expired
- 1976-08-11 SE SE7608988A patent/SE7608988L/xx unknown
- 1976-08-12 IT IT50866/76A patent/IT1062666B/it active
- 1976-08-13 IE IE1789/76A patent/IE44200B1/en not_active IP Right Cessation
- 1976-08-13 DE DE19762636580 patent/DE2636580A1/de not_active Ceased
- 1976-08-13 ES ES450690A patent/ES450690A1/es not_active Expired
- 1976-08-13 NL NL7609034A patent/NL7609034A/xx active Search and Examination
- 1976-08-13 FR FR7624745A patent/FR2321192A1/fr active Granted
- 1976-08-13 GB GB33887/76A patent/GB1510294A/en not_active Expired
- 1976-08-14 JP JP51097396A patent/JPS5237772A/ja active Pending
- 1976-08-16 BR BR7605354A patent/BR7605354A/pt unknown
Also Published As
Publication number | Publication date |
---|---|
DE2636580A1 (de) | 1977-02-17 |
AU1678376A (en) | 1978-02-16 |
CA1057420A (en) | 1979-06-26 |
IE44200B1 (en) | 1981-09-09 |
US3996602A (en) | 1976-12-07 |
NL7609034A (nl) | 1977-02-16 |
GB1510294A (en) | 1978-05-10 |
IE44200L (en) | 1977-02-14 |
BR7605354A (pt) | 1977-08-16 |
FR2321192A1 (fr) | 1977-03-11 |
ES450690A1 (es) | 1977-12-01 |
IT1062666B (it) | 1984-10-20 |
JPS5237772A (en) | 1977-03-23 |
FR2321192B1 (xx) | 1979-03-02 |
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