SE443695B - PROCEDURE FOR MANUFACTURING MATERIALS FOR PRINTED WIRING - Google Patents

PROCEDURE FOR MANUFACTURING MATERIALS FOR PRINTED WIRING

Info

Publication number
SE443695B
SE443695B SE7302829A SE7302829A SE443695B SE 443695 B SE443695 B SE 443695B SE 7302829 A SE7302829 A SE 7302829A SE 7302829 A SE7302829 A SE 7302829A SE 443695 B SE443695 B SE 443695B
Authority
SE
Sweden
Prior art keywords
procedure
printed wiring
manufacturing materials
manufacturing
materials
Prior art date
Application number
SE7302829A
Other languages
Swedish (sv)
Inventor
J K Konicek
Original Assignee
Perstorp Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Perstorp Ab filed Critical Perstorp Ab
Priority to SE7302829A priority Critical patent/SE443695B/en
Priority to US05/446,334 priority patent/US3936548A/en
Priority to JP2372674A priority patent/JPS49135167A/ja
Priority to GB900474A priority patent/GB1460849A/en
Priority to NL7402669A priority patent/NL7402669A/xx
Priority to CH285074A priority patent/CH604463A5/xx
Publication of SE443695B publication Critical patent/SE443695B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
SE7302829A 1973-02-28 1973-02-28 PROCEDURE FOR MANUFACTURING MATERIALS FOR PRINTED WIRING SE443695B (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
SE7302829A SE443695B (en) 1973-02-28 1973-02-28 PROCEDURE FOR MANUFACTURING MATERIALS FOR PRINTED WIRING
US05/446,334 US3936548A (en) 1973-02-28 1974-02-27 Method for the production of material for printed circuits and material for printed circuits
JP2372674A JPS49135167A (en) 1973-02-28 1974-02-27
GB900474A GB1460849A (en) 1973-02-28 1974-02-27 Material for printed circuits
NL7402669A NL7402669A (en) 1973-02-28 1974-02-27
CH285074A CH604463A5 (en) 1973-02-28 1974-02-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE7302829A SE443695B (en) 1973-02-28 1973-02-28 PROCEDURE FOR MANUFACTURING MATERIALS FOR PRINTED WIRING

Publications (1)

Publication Number Publication Date
SE443695B true SE443695B (en) 1986-03-03

Family

ID=20316763

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7302829A SE443695B (en) 1973-02-28 1973-02-28 PROCEDURE FOR MANUFACTURING MATERIALS FOR PRINTED WIRING

Country Status (5)

Country Link
JP (1) JPS49135167A (en)
CH (1) CH604463A5 (en)
GB (1) GB1460849A (en)
NL (1) NL7402669A (en)
SE (1) SE443695B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
LU90804B1 (en) * 2001-07-18 2003-01-20 Circuit Foil Luxembourg Trading Sarl Process for manufacturing a composite foil suitable for manufacturing multi-layer printed circuit boards
JP2004090488A (en) * 2002-08-30 2004-03-25 Panac Co Ltd Metal layer transfer sheet

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE788117A (en) * 1971-08-30 1973-02-28 Perstorp Ab PROCESS FOR THE PRODUCTION OF ELEMENTS FOR PRINTED CIRCUITS

Also Published As

Publication number Publication date
JPS49135167A (en) 1974-12-26
GB1460849A (en) 1977-01-06
CH604463A5 (en) 1978-09-15
NL7402669A (en) 1974-08-30

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