SE424518B - PROCEDURE AND DEVICE FOR SOFT, MOLDING OR HARDWARE - Google Patents

PROCEDURE AND DEVICE FOR SOFT, MOLDING OR HARDWARE

Info

Publication number
SE424518B
SE424518B SE7410907A SE7410907A SE424518B SE 424518 B SE424518 B SE 424518B SE 7410907 A SE7410907 A SE 7410907A SE 7410907 A SE7410907 A SE 7410907A SE 424518 B SE424518 B SE 424518B
Authority
SE
Sweden
Prior art keywords
soft
molding
hardware
procedure
Prior art date
Application number
SE7410907A
Other languages
Swedish (sv)
Other versions
SE7410907L (en
Inventor
H H Ammann
T Y Chu
J C Mollendorf
R C Pfahl
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US395310A external-priority patent/US3866307A/en
Priority claimed from US476343A external-priority patent/US3904102A/en
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of SE7410907L publication Critical patent/SE7410907L/
Publication of SE424518B publication Critical patent/SE424518B/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/012Soldering with the use of hot gas
    • B23K1/015Vapour-condensation soldering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/08Soldering by means of dipping in molten solder
    • B23K1/085Wave soldering
SE7410907A 1973-09-07 1974-08-28 PROCEDURE AND DEVICE FOR SOFT, MOLDING OR HARDWARE SE424518B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US395310A US3866307A (en) 1973-09-07 1973-09-07 Method for soldering, fusing or brazing
US476343A US3904102A (en) 1974-06-05 1974-06-05 Apparatus and method for soldering, fusing or brazing

Publications (2)

Publication Number Publication Date
SE7410907L SE7410907L (en) 1975-03-08
SE424518B true SE424518B (en) 1982-07-26

Family

ID=27015058

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7410907A SE424518B (en) 1973-09-07 1974-08-28 PROCEDURE AND DEVICE FOR SOFT, MOLDING OR HARDWARE

Country Status (10)

Country Link
JP (1) JPS5340934B2 (en)
AU (1) AU7293274A (en)
BR (1) BR7407403D0 (en)
DE (1) DE2442180C3 (en)
ES (1) ES449417A1 (en)
FR (1) FR2243045B1 (en)
GB (1) GB1484604A (en)
IT (1) IT1020737B (en)
NL (1) NL163732C (en)
SE (1) SE424518B (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4115601A (en) * 1977-07-01 1978-09-19 Bell Telephone Laboratories, Incorporated Flexible circuit reflow soldering process and machine
US4389797A (en) * 1981-06-23 1983-06-28 The Htc Corporation Continuous vapor processing system
GB2120964A (en) * 1982-03-25 1983-12-14 Alpha Metals Processes of applying solder
FR2537912A1 (en) * 1982-12-21 1984-06-22 Annemasse Ultrasons Process for stabilising, in a steady state, the separation front between an upper vapour region and a lower vapour region which are created in an apparatus comprising a vessel, apparatus making use of the said process and use of the said apparatus
FR2556083B1 (en) * 1983-10-11 1986-04-25 Piezo Ceram Electronique IMPROVED MACHINE FOR HEATING AN ARTICLE OR PRODUCT BY CONDENSATION OF STEAM THEREON
US4541358A (en) * 1983-11-28 1985-09-17 The Htc Corporation Method and apparatus for solder removal
CA1241236A (en) * 1984-05-25 1988-08-30 Donald J. Spigarelli Continuous solder system
DE3673880D1 (en) * 1985-06-08 1990-10-11 Nippon Dennetsu Keiki Kk STEAM PHASE SOLDERING DEVICE.
DE3619964C1 (en) * 1986-06-13 1987-03-12 Heraeus Gmbh W C Device for melting a solder by vapor phase treatment
DE3813931C2 (en) * 1988-04-25 1995-05-04 Resma Gmbh Fuegetechnik Indust Inert gas soldering method and device for carrying out this method
DE3814870C1 (en) * 1988-05-02 1989-11-16 Helmut Walter 8900 Augsburg De Leicht
DE3915040A1 (en) * 1989-05-08 1990-11-15 Helmut Walter Leicht Vapour-phase esp. soldering unit for e.g. PCB - involves controlled stepwise or continuous preheating and/or cooling with immersion of workpieces in vapour phase region
DE8913226U1 (en) * 1989-11-08 1989-12-21 Leicht, Helmut Walter, 8900 Augsburg, De
DE4024181C1 (en) * 1990-07-30 1992-02-13 Siemens Nixdorf Informationssysteme Ag, 4790 Paderborn, De Vapour phase soldering installation - has valve in by=pass opening in dependence on preset temp. of sec. medium in soldering tank
DE4103098C1 (en) * 1991-02-01 1992-06-25 Helmut Walter 8901 Koenigsbrunn De Leicht
DE4342634A1 (en) * 1993-12-14 1995-06-22 Helmut Walter Leicht Device for heat transfer, especially in a convection soldering system
DE4432774C2 (en) * 1994-09-15 2000-04-06 Fraunhofer Ges Forschung Process for producing meniscus-shaped solder bumps
DE19508402C2 (en) * 1995-03-09 1998-08-20 Helmut W Leicht Vapor phase soldering system
DE19519188C2 (en) * 1995-05-24 2001-06-28 Fraunhofer Ges Forschung Method and device for wave and / or vapor phase soldering of electronic assemblies

Also Published As

Publication number Publication date
DE2442180C3 (en) 1979-12-20
BR7407403D0 (en) 1975-09-09
FR2243045A1 (en) 1975-04-04
IT1020737B (en) 1977-12-30
GB1484604A (en) 1977-09-01
NL163732C (en) 1980-10-15
AU7293274A (en) 1976-03-11
JPS5340934B2 (en) 1978-10-30
SE7410907L (en) 1975-03-08
DE2442180B2 (en) 1979-04-26
NL7411686A (en) 1975-03-11
FR2243045B1 (en) 1979-08-03
ES449417A1 (en) 1977-11-01
JPS5054552A (en) 1975-05-14
DE2442180A1 (en) 1975-03-13

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