SE1730353A1 - Cooling installation - Google Patents

Cooling installation

Info

Publication number
SE1730353A1
SE1730353A1 SE1730353A SE1730353A SE1730353A1 SE 1730353 A1 SE1730353 A1 SE 1730353A1 SE 1730353 A SE1730353 A SE 1730353A SE 1730353 A SE1730353 A SE 1730353A SE 1730353 A1 SE1730353 A1 SE 1730353A1
Authority
SE
Sweden
Prior art keywords
fluid
cooling
cooling installation
circulating
heat exchanger
Prior art date
Application number
SE1730353A
Other languages
Swedish (sv)
Inventor
Alireza Soltani
Mohamad Javad Soltani
Narges Soltani
Pedram Soltani
Original Assignee
Andersson Inge
Pedram Soltani
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Andersson Inge, Pedram Soltani filed Critical Andersson Inge
Priority to SE1730353A priority Critical patent/SE1730353A1/en
Publication of SE1730353A1 publication Critical patent/SE1730353A1/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H05K7/20163—Heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

En anordning för kylning av en värmealstrande komponent innefattar en serie tunna metalltrådar i ett borstliknande arrangemang.Ett system för kylning av en datorkomponent innefattar ett kanalsystem för en fluid, en pumpanordning för cirkulering av fluiden i kanalsystemet och en värmeväxlare (5), för överföring av värmeenergi från datorkomponenten till den i kanalsystemet cirkulerande fluiden. Värmeväxlaren (5) är en anordning enligt ovan.A device for cooling a heat generating component comprises a series of thin metal wires in a brush-like arrangement. A system for cooling a computer component comprises a channel system for a fluid, a pump device for circulating the fluid in the channel system and a heat exchanger (5), for transferring heat energy from the computer component to the fluid circulating in the duct system. The heat exchanger (5) is a device as above.

SE1730353A 2017-12-28 2017-12-28 Cooling installation SE1730353A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SE1730353A SE1730353A1 (en) 2017-12-28 2017-12-28 Cooling installation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE1730353A SE1730353A1 (en) 2017-12-28 2017-12-28 Cooling installation

Publications (1)

Publication Number Publication Date
SE1730353A1 true SE1730353A1 (en) 2019-06-29

Family

ID=67386427

Family Applications (1)

Application Number Title Priority Date Filing Date
SE1730353A SE1730353A1 (en) 2017-12-28 2017-12-28 Cooling installation

Country Status (1)

Country Link
SE (1) SE1730353A1 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0082051A2 (en) * 1981-12-11 1983-06-22 Thomson-Csf Process for realising a cooling device
SU1163126A1 (en) * 1983-06-15 1985-06-23 Проектно-конструкторское бюро электрогидравлики АН УССР Semiconductor device cooling fin
US20060126308A1 (en) * 2004-12-10 2006-06-15 International Business Machines Corporation Cooling apparatus, cooled electronic module, and methods of fabrication thereof employing thermally conductive, wire-bonded pin fins
US20110297361A1 (en) * 2009-04-08 2011-12-08 Sunmodular, Inc. Low Stress-Inducing Heat Sink
WO2016194158A1 (en) * 2015-06-03 2016-12-08 三菱電機株式会社 Liquid-cooled cooler, and manufacturing method for radiating fin in liquid-cooled cooler
US20170118870A1 (en) * 2015-10-27 2017-04-27 Asia Vital Components Co., Ltd. Water-cooling device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0082051A2 (en) * 1981-12-11 1983-06-22 Thomson-Csf Process for realising a cooling device
SU1163126A1 (en) * 1983-06-15 1985-06-23 Проектно-конструкторское бюро электрогидравлики АН УССР Semiconductor device cooling fin
US20060126308A1 (en) * 2004-12-10 2006-06-15 International Business Machines Corporation Cooling apparatus, cooled electronic module, and methods of fabrication thereof employing thermally conductive, wire-bonded pin fins
US20110297361A1 (en) * 2009-04-08 2011-12-08 Sunmodular, Inc. Low Stress-Inducing Heat Sink
WO2016194158A1 (en) * 2015-06-03 2016-12-08 三菱電機株式会社 Liquid-cooled cooler, and manufacturing method for radiating fin in liquid-cooled cooler
US20170118870A1 (en) * 2015-10-27 2017-04-27 Asia Vital Components Co., Ltd. Water-cooling device

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Legal Events

Date Code Title Description
NAV Patent application has lapsed