SE0003647D0 - Method, apparatus and use - Google Patents
Method, apparatus and useInfo
- Publication number
- SE0003647D0 SE0003647D0 SE0003647A SE0003647A SE0003647D0 SE 0003647 D0 SE0003647 D0 SE 0003647D0 SE 0003647 A SE0003647 A SE 0003647A SE 0003647 A SE0003647 A SE 0003647A SE 0003647 D0 SE0003647 D0 SE 0003647D0
- Authority
- SE
- Sweden
- Prior art keywords
- nozzle
- jetting
- assembly
- information
- viscous medium
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0469—Surface mounting by applying a glue or viscous material
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Ink Jet (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0003647A SE0003647D0 (sv) | 2000-10-09 | 2000-10-09 | Method, apparatus and use |
JP2002535455A JP4220234B2 (ja) | 2000-10-09 | 2001-10-09 | 粘性媒質を噴射する方法 |
EP01975123A EP1334648A1 (en) | 2000-10-09 | 2001-10-09 | Method of jetting viscous medium |
PCT/SE2001/002198 WO2002032201A1 (en) | 2000-10-09 | 2001-10-09 | Method of jetting viscous medium |
US10/398,712 US7011382B2 (en) | 2000-10-09 | 2001-10-09 | Method of jetting viscous medium |
AU2001294480A AU2001294480A1 (en) | 2000-10-09 | 2001-10-09 | Method of jetting viscous medium |
US11/373,327 US7229145B2 (en) | 2000-10-09 | 2006-03-13 | Method of jetting viscous medium |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0003647A SE0003647D0 (sv) | 2000-10-09 | 2000-10-09 | Method, apparatus and use |
Publications (1)
Publication Number | Publication Date |
---|---|
SE0003647D0 true SE0003647D0 (sv) | 2000-10-09 |
Family
ID=20281353
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE0003647A SE0003647D0 (sv) | 2000-10-09 | 2000-10-09 | Method, apparatus and use |
Country Status (6)
Country | Link |
---|---|
US (2) | US7011382B2 (ja) |
EP (1) | EP1334648A1 (ja) |
JP (1) | JP4220234B2 (ja) |
AU (1) | AU2001294480A1 (ja) |
SE (1) | SE0003647D0 (ja) |
WO (1) | WO2002032201A1 (ja) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE0202247D0 (sv) | 2002-07-18 | 2002-07-18 | Mydata Automation Ab | Jetting device and method at a jetting device |
US20050001869A1 (en) * | 2003-05-23 | 2005-01-06 | Nordson Corporation | Viscous material noncontact jetting system |
KR100540633B1 (ko) * | 2003-06-20 | 2006-01-11 | 주식회사 탑 엔지니어링 | 페이스트 도포기 및 그 제어 방법 |
CN100439820C (zh) * | 2003-07-14 | 2008-12-03 | 诺信公司 | 用于分配不连续量的粘性物质的装置和方法 |
EP2045744A1 (en) | 2003-08-06 | 2009-04-08 | Panasonic Corporation | Method, server, and client for reducing processing time in synchronous communication in a client-server distributed system |
DE602005003203T2 (de) * | 2004-01-16 | 2008-09-04 | Ericsson Ab | Verfahren zum ankleben einer schaltungskomponente an eine leiterplatte |
JP4504082B2 (ja) * | 2004-04-28 | 2010-07-14 | 富士通株式会社 | 液体注入装置 |
CN101356425B (zh) | 2005-11-14 | 2011-01-26 | 麦德塔自动化股份有限公司 | 喷射装置和改善喷射装置性能的方法 |
US20070145164A1 (en) * | 2005-12-22 | 2007-06-28 | Nordson Corporation | Jetting dispenser with multiple jetting nozzle outlets |
US7980197B2 (en) * | 2006-11-03 | 2011-07-19 | Illinois Tool Works, Inc. | Method and apparatus for dispensing a viscous material on a substrate |
US7923056B2 (en) * | 2007-06-01 | 2011-04-12 | Illinois Tool Works Inc. | Method and apparatus for dispensing material on a substrate |
EP2042829B2 (en) * | 2007-09-26 | 2017-08-09 | Hexagon Metrology AB | Modular calibration |
JP4582225B2 (ja) * | 2008-08-15 | 2010-11-17 | ソニー株式会社 | 液体吐出装置及び液体吐出方法 |
CH707308B1 (de) * | 2012-12-05 | 2017-02-15 | Esec Ag | Verfahren zum Bestimmen einer Referenzhöhe einer Dispensdüse. |
US10082417B2 (en) * | 2013-12-30 | 2018-09-25 | Nordson Corporation | Calibration methods for a viscous fluid dispensing system |
US9815081B2 (en) | 2015-02-24 | 2017-11-14 | Illinois Tool Works Inc. | Method of calibrating a dispenser |
WO2018189586A2 (zh) * | 2017-04-14 | 2018-10-18 | 伊利诺斯工具制品有限公司 | 用于提供锡膏的组件及其方法 |
JP7127055B2 (ja) * | 2017-04-14 | 2022-08-29 | イリノイ トゥール ワークス インコーポレイティド | はんだペースト印刷機の自動はんだペースト付加装置 |
JP7191848B2 (ja) * | 2017-04-14 | 2022-12-19 | イリノイ トゥール ワークス インコーポレイティド | はんだペーストの液垂れを防止する装置 |
JP7207152B2 (ja) * | 2019-05-16 | 2023-01-18 | 株式会社デンソー | スリーブはんだ付け装置および電子装置の製造方法 |
US11246249B2 (en) | 2020-04-15 | 2022-02-08 | Illinois Tool Works Inc. | Tilt and rotate dispenser having strain wave gear system |
US11805634B2 (en) * | 2021-08-03 | 2023-10-31 | Illinois Tool Works Inc. | Tilt and rotate dispenser having motion control |
US11904337B2 (en) | 2021-08-03 | 2024-02-20 | Illinois Tool Works Inc. | Tilt and rotate dispenser having material flow rate control |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE461822B (sv) | 1988-07-08 | 1990-03-26 | Mydata Automation Ab | Anordning foer att laegga ut pastor och lim i diskreta punkter, foeretraedesvis vid ytmontering av komponenter paa kretskort |
US5243755A (en) | 1990-11-02 | 1993-09-14 | Canon Kabushiki Kaisha | Ink-jet head assembling apparatus and method |
DE4318506A1 (de) | 1993-06-03 | 1994-12-08 | Martin Umwelt & Energietech | Verfahren und Einrichtung zur Abstandshaltung bei einem Dickstoff-Dispenser |
US5984470A (en) | 1995-04-20 | 1999-11-16 | Canon Kabushiki Kaisha | Apparatus for producing color filter with alignment error detection |
JPH09323056A (ja) | 1996-06-05 | 1997-12-16 | Hitachi Techno Eng Co Ltd | ペースト塗布機 |
US5889534A (en) * | 1996-09-10 | 1999-03-30 | Colorspan Corporation | Calibration and registration method for manufacturing a drum-based printing system |
US5855323A (en) | 1996-11-13 | 1999-01-05 | Sandia Corporation | Method and apparatus for jetting, manufacturing and attaching uniform solder balls |
EP0920791B1 (en) | 1996-11-26 | 2006-05-24 | Assembléon N.V. | Method of placing components on a carrier including a calibration procecure and device suitable therefor |
US6224180B1 (en) | 1997-02-21 | 2001-05-01 | Gerald Pham-Van-Diep | High speed jet soldering system |
JP3980115B2 (ja) | 1997-04-22 | 2007-09-26 | 松下電器産業株式会社 | 電子部品接着用ボンドの塗布装置 |
JPH10341074A (ja) | 1997-06-09 | 1998-12-22 | Matsushita Electric Ind Co Ltd | 粘性材の塗布方法 |
SE513527C2 (sv) | 1998-06-11 | 2000-09-25 | Mydata Automation Ab | Anordning och förfarande för utskjutning av små droppar |
JP2000085116A (ja) * | 1998-09-10 | 2000-03-28 | Brother Ind Ltd | インクジェット記録装置及びその駆動調整方法 |
DE69932146T2 (de) * | 1999-02-18 | 2007-03-01 | Hewlett-Packard Development Co., L.P., Houston | Korrektursystem für Tröpfchenpositionierungsfehler in der Druckrichtungsachse in Tintenstrahldruckern |
US6499821B1 (en) * | 1999-07-22 | 2002-12-31 | Canon Kabushiki Kaisha | Ink jet printing apparatus and printing head |
-
2000
- 2000-10-09 SE SE0003647A patent/SE0003647D0/xx unknown
-
2001
- 2001-10-09 JP JP2002535455A patent/JP4220234B2/ja not_active Expired - Lifetime
- 2001-10-09 WO PCT/SE2001/002198 patent/WO2002032201A1/en active Application Filing
- 2001-10-09 EP EP01975123A patent/EP1334648A1/en not_active Withdrawn
- 2001-10-09 US US10/398,712 patent/US7011382B2/en not_active Expired - Lifetime
- 2001-10-09 AU AU2001294480A patent/AU2001294480A1/en not_active Abandoned
-
2006
- 2006-03-13 US US11/373,327 patent/US7229145B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP4220234B2 (ja) | 2009-02-04 |
WO2002032201A1 (en) | 2002-04-18 |
US20040118935A1 (en) | 2004-06-24 |
EP1334648A1 (en) | 2003-08-13 |
US7229145B2 (en) | 2007-06-12 |
US20060176327A1 (en) | 2006-08-10 |
JP2004511333A (ja) | 2004-04-15 |
AU2001294480A1 (en) | 2002-04-22 |
US7011382B2 (en) | 2006-03-14 |
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