RU2005141557A - Способ производства металлических проводников на подложке - Google Patents
Способ производства металлических проводников на подложке Download PDFInfo
- Publication number
- RU2005141557A RU2005141557A RU2005141557/02A RU2005141557A RU2005141557A RU 2005141557 A RU2005141557 A RU 2005141557A RU 2005141557/02 A RU2005141557/02 A RU 2005141557/02A RU 2005141557 A RU2005141557 A RU 2005141557A RU 2005141557 A RU2005141557 A RU 2005141557A
- Authority
- RU
- Russia
- Prior art keywords
- metal
- printing
- solution
- substrate
- reducing agent
- Prior art date
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/161—Process or apparatus coating on selected surface areas by direct patterning from plating step, e.g. inkjet
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1658—Process features with two steps starting with metal deposition followed by addition of reducing agent
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/166—Process features with two steps starting with addition of reducing agent followed by metal deposition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1157—Using means for chemical reduction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
Claims (13)
1. Способ производства металлических проводников на подложке, отличающийся тем, что химическое осаждение осуществляют в упомянутом способе, по меньшей мере, в две стадии, где отдельные растворы получают из по меньшей мере одного исходного металлического материала и восстановителя, или один из них присутствует в виде газа или пара, с последующим последовательным нанесением исходного металлического материала и восстановителя на подложку, которая является неподвижной или подвижным рулоном, содержащей бумагу или картон.
2. Способ по п.1, отличающийся тем, что металл исходного металлического материала выбирают из группы, состоящей из Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, As,Se, Tc, Ru, Rh, Pd, Ag, Cd, In, Sn, Sb, Те, Re, Os, Ir, Pt, Au, Hg, Tl, Pb, Bi и их сплавов.
3. Способ по п.1 или 2, отличающийся тем, что металлом является медь, серебро, золото, хром, железо, кобальт, никель, палладий и платина, и их сплавы.
4. Способ по любому из пп.1 или 2, отличающийся тем, что металлом является медь, серебро или никель.
5. Способ по п.1, отличающийся тем, что металл вводится в раствор металла в форме растворимой в воде соли, предпочтительно в виде сульфата или хлорида, причем упомянутый раствор металла содержит соль металла в концентрации, изменяющейся между 0,005 М и концентрацией, соответствующей насыщенному раствору, предпочтительно от 0,1 до 0,5 М.
6. Способ по п.5, отличающийся тем, что упомянутый раствор металла также содержит одно или более комплексообразующих соединений, предпочтительно ЭДТА (этилендиаминтетрауксусную кислоту), лимонную кислоту или этилендиамин.
7. Способ по п.1, отличающийся тем, что упомянутый восстановитель является борогидридом или гипофосфитом щелочного или щелочноземельного металла, формальдегидом, гидратом гидразина или аминоборатом R2NHBH3, в котором группа R представляет собой алкильную группу.
8. Способ по п.1, отличающийся тем, что упомянутый восстановитель является борогидридом натрия, формальдегидом, гипофосфитом натрия, гидратом гидразина или аминоборатом R2NHBH3, в котором группа R представляет собой метиловую, этиловую или пропиловую группу, причем упомянутый восстановитель предпочтительно находится в виде водного раствора.
9. Способ по п.1, отличающийся тем, что один из исходных материалов наносят в виде раствора на поверхность подложки с использованием способа печати на участках, где желательно формирование плата, или, необязательно, на всю поверхность, и когда другой исходный материал наносят в виде раствора на поверхность подложки, используя способ печати, или для формирования плата путем введения, или напыления для покрытия всей поверхности.
10. Способ по п.9, отличающийся тем, что способ печати является глубокой печатью, флексографией, офсетом, шелко-трафаретной печатью или способом струйной печати.
11. Способ по п.9, отличающийся тем, что упомянутый способ печати является способом струйной печати.
12. Способ по п.9, отличающийся тем, что упомянутый способ печати является способом струйной печати с цифровым управлением.
13. Способ по п.9, отличающийся тем, что упомянутый способ печати является способом печати с валика на валик.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20030816A FI20030816A (fi) | 2003-05-30 | 2003-05-30 | Menetelmä metallijohtimien valmistamiseksi substraatille |
FI20030816 | 2003-05-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
RU2005141557A true RU2005141557A (ru) | 2006-05-10 |
Family
ID=8566186
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
RU2005141557/02A RU2005141557A (ru) | 2003-05-30 | 2004-05-28 | Способ производства металлических проводников на подложке |
Country Status (9)
Country | Link |
---|---|
US (1) | US20060286304A1 (ru) |
EP (1) | EP1629137A1 (ru) |
JP (1) | JP2006526074A (ru) |
CN (1) | CN1798869A (ru) |
BR (1) | BRPI0410874A (ru) |
CA (1) | CA2526068A1 (ru) |
FI (1) | FI20030816A (ru) |
RU (1) | RU2005141557A (ru) |
WO (1) | WO2004106585A1 (ru) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2492278C2 (ru) * | 2007-11-16 | 2013-09-10 | Хюк Енгравинг Гмбх Унд Ко. Кг | Способ обработки структурированной поверхности |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060130700A1 (en) * | 2004-12-16 | 2006-06-22 | Reinartz Nicole M | Silver-containing inkjet ink |
US7682431B1 (en) * | 2008-11-12 | 2010-03-23 | Lam Research Corporation | Plating solutions for electroless deposition of ruthenium |
CA2918939C (en) | 2013-07-24 | 2021-10-26 | National Research Council Of Canada | Process for depositing metal on a substrate |
CN109706439B (zh) * | 2019-01-02 | 2020-10-30 | 济南大学 | 一种组合喷镀镀银还原液及其制备方法 |
CN116288295B (zh) * | 2023-03-23 | 2024-06-25 | 河南科技大学 | 一种长度和表面粗糙度可调节的Au钉子及其制备方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB191120012A (en) * | 1911-09-08 | 1912-01-11 | Pascal Marino | A Process of Superficially Metallizing the Surface of Cast Iron, Wood, Gypsum, Paper and other Porous Substances or Articles for the purpose of Electrolytically Depositing Metals or Alloys thereof. |
US3058845A (en) * | 1959-06-23 | 1962-10-16 | Du Pont | Process for metallizing polyacrylonitrile shaped article by treating with a water soluble metal salt and reducing the salt to the free metal |
US4150171A (en) * | 1976-03-30 | 1979-04-17 | Surface Technology, Inc. | Electroless plating |
JPH0826462B2 (ja) * | 1987-11-30 | 1996-03-13 | 龍徳 四十宮 | 表面金属化重合体成形物の製造方法 |
US5132248A (en) * | 1988-05-31 | 1992-07-21 | The United States Of America As Represented By The United States Department Of Energy | Direct write with microelectronic circuit fabrication |
US5158604A (en) * | 1991-07-01 | 1992-10-27 | Monsanto Company | Viscous electroless plating solutions |
DE69608669T2 (de) * | 1995-12-19 | 2001-03-01 | Cornell Research Foundation, Inc. | Stromloses aufbringen von metallfilmen mit sprayprozessor |
US5989653A (en) * | 1997-12-08 | 1999-11-23 | Sandia Corporation | Process for metallization of a substrate by irradiative curing of a catalyst applied thereto |
US6328078B1 (en) * | 1998-03-13 | 2001-12-11 | Tietex International, Ltd. | System and process for forming a fabric having digitally printed warp yarns |
DE10050862C2 (de) * | 2000-10-06 | 2002-08-01 | Atotech Deutschland Gmbh | Bad und Verfahren zum stromlosen Abscheiden von Silber auf Metalloberflächen |
US20040062861A1 (en) * | 2001-02-07 | 2004-04-01 | Hiroshi Sato | Method of electroless plating and apparatus for electroless plating |
-
2003
- 2003-05-30 FI FI20030816A patent/FI20030816A/fi unknown
-
2004
- 2004-05-28 WO PCT/FI2004/000327 patent/WO2004106585A1/en active Application Filing
- 2004-05-28 CN CN200480015141.5A patent/CN1798869A/zh active Pending
- 2004-05-28 RU RU2005141557/02A patent/RU2005141557A/ru not_active Application Discontinuation
- 2004-05-28 US US10/557,174 patent/US20060286304A1/en not_active Abandoned
- 2004-05-28 EP EP04735248A patent/EP1629137A1/en not_active Withdrawn
- 2004-05-28 JP JP2006508329A patent/JP2006526074A/ja not_active Withdrawn
- 2004-05-28 BR BRPI0410874-4A patent/BRPI0410874A/pt not_active IP Right Cessation
- 2004-05-28 CA CA002526068A patent/CA2526068A1/en not_active Abandoned
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2492278C2 (ru) * | 2007-11-16 | 2013-09-10 | Хюк Енгравинг Гмбх Унд Ко. Кг | Способ обработки структурированной поверхности |
Also Published As
Publication number | Publication date |
---|---|
FI20030816A (fi) | 2004-12-01 |
BRPI0410874A (pt) | 2006-07-04 |
US20060286304A1 (en) | 2006-12-21 |
EP1629137A1 (en) | 2006-03-01 |
WO2004106585A1 (en) | 2004-12-09 |
CA2526068A1 (en) | 2004-12-09 |
FI20030816A0 (fi) | 2003-05-30 |
JP2006526074A (ja) | 2006-11-16 |
CN1798869A (zh) | 2006-07-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FA93 | Acknowledgement of application withdrawn (no request for examination) |
Effective date: 20070529 |