RU2005141557A - Способ производства металлических проводников на подложке - Google Patents

Способ производства металлических проводников на подложке Download PDF

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Publication number
RU2005141557A
RU2005141557A RU2005141557/02A RU2005141557A RU2005141557A RU 2005141557 A RU2005141557 A RU 2005141557A RU 2005141557/02 A RU2005141557/02 A RU 2005141557/02A RU 2005141557 A RU2005141557 A RU 2005141557A RU 2005141557 A RU2005141557 A RU 2005141557A
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RU
Russia
Prior art keywords
metal
printing
solution
substrate
reducing agent
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RU2005141557/02A
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English (en)
Inventor
Маркку ЛЕСКЕЛЯ (FI)
Маркку ЛЕСКЕЛЯ
Микко РИТАЛА (FI)
Микко РИТАЛА
Сеппо ЛИНДРООС (FI)
Сеппо ЛИНДРООС
Ханна УУСИКАРТАНО (FI)
Ханна УУСИКАРТАНО
Пекка КОЙВУКУННАС (FI)
Пекка КОЙВУКУННАС
Original Assignee
Авантоне Ой (Fi)
Авантоне Ой
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Авантоне Ой (Fi), Авантоне Ой filed Critical Авантоне Ой (Fi)
Publication of RU2005141557A publication Critical patent/RU2005141557A/ru

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/161—Process or apparatus coating on selected surface areas by direct patterning from plating step, e.g. inkjet
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1658—Process features with two steps starting with metal deposition followed by addition of reducing agent
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/166—Process features with two steps starting with addition of reducing agent followed by metal deposition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)

Claims (13)

1. Способ производства металлических проводников на подложке, отличающийся тем, что химическое осаждение осуществляют в упомянутом способе, по меньшей мере, в две стадии, где отдельные растворы получают из по меньшей мере одного исходного металлического материала и восстановителя, или один из них присутствует в виде газа или пара, с последующим последовательным нанесением исходного металлического материала и восстановителя на подложку, которая является неподвижной или подвижным рулоном, содержащей бумагу или картон.
2. Способ по п.1, отличающийся тем, что металл исходного металлического материала выбирают из группы, состоящей из Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, As,Se, Tc, Ru, Rh, Pd, Ag, Cd, In, Sn, Sb, Те, Re, Os, Ir, Pt, Au, Hg, Tl, Pb, Bi и их сплавов.
3. Способ по п.1 или 2, отличающийся тем, что металлом является медь, серебро, золото, хром, железо, кобальт, никель, палладий и платина, и их сплавы.
4. Способ по любому из пп.1 или 2, отличающийся тем, что металлом является медь, серебро или никель.
5. Способ по п.1, отличающийся тем, что металл вводится в раствор металла в форме растворимой в воде соли, предпочтительно в виде сульфата или хлорида, причем упомянутый раствор металла содержит соль металла в концентрации, изменяющейся между 0,005 М и концентрацией, соответствующей насыщенному раствору, предпочтительно от 0,1 до 0,5 М.
6. Способ по п.5, отличающийся тем, что упомянутый раствор металла также содержит одно или более комплексообразующих соединений, предпочтительно ЭДТА (этилендиаминтетрауксусную кислоту), лимонную кислоту или этилендиамин.
7. Способ по п.1, отличающийся тем, что упомянутый восстановитель является борогидридом или гипофосфитом щелочного или щелочноземельного металла, формальдегидом, гидратом гидразина или аминоборатом R2NHBH3, в котором группа R представляет собой алкильную группу.
8. Способ по п.1, отличающийся тем, что упомянутый восстановитель является борогидридом натрия, формальдегидом, гипофосфитом натрия, гидратом гидразина или аминоборатом R2NHBH3, в котором группа R представляет собой метиловую, этиловую или пропиловую группу, причем упомянутый восстановитель предпочтительно находится в виде водного раствора.
9. Способ по п.1, отличающийся тем, что один из исходных материалов наносят в виде раствора на поверхность подложки с использованием способа печати на участках, где желательно формирование плата, или, необязательно, на всю поверхность, и когда другой исходный материал наносят в виде раствора на поверхность подложки, используя способ печати, или для формирования плата путем введения, или напыления для покрытия всей поверхности.
10. Способ по п.9, отличающийся тем, что способ печати является глубокой печатью, флексографией, офсетом, шелко-трафаретной печатью или способом струйной печати.
11. Способ по п.9, отличающийся тем, что упомянутый способ печати является способом струйной печати.
12. Способ по п.9, отличающийся тем, что упомянутый способ печати является способом струйной печати с цифровым управлением.
13. Способ по п.9, отличающийся тем, что упомянутый способ печати является способом печати с валика на валик.
RU2005141557/02A 2003-05-30 2004-05-28 Способ производства металлических проводников на подложке RU2005141557A (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20030816A FI20030816A (fi) 2003-05-30 2003-05-30 Menetelmä metallijohtimien valmistamiseksi substraatille
FI20030816 2003-05-30

Publications (1)

Publication Number Publication Date
RU2005141557A true RU2005141557A (ru) 2006-05-10

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RU2005141557/02A RU2005141557A (ru) 2003-05-30 2004-05-28 Способ производства металлических проводников на подложке

Country Status (9)

Country Link
US (1) US20060286304A1 (ru)
EP (1) EP1629137A1 (ru)
JP (1) JP2006526074A (ru)
CN (1) CN1798869A (ru)
BR (1) BRPI0410874A (ru)
CA (1) CA2526068A1 (ru)
FI (1) FI20030816A (ru)
RU (1) RU2005141557A (ru)
WO (1) WO2004106585A1 (ru)

Cited By (1)

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RU2492278C2 (ru) * 2007-11-16 2013-09-10 Хюк Енгравинг Гмбх Унд Ко. Кг Способ обработки структурированной поверхности

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US7682431B1 (en) * 2008-11-12 2010-03-23 Lam Research Corporation Plating solutions for electroless deposition of ruthenium
CA2918939C (en) 2013-07-24 2021-10-26 National Research Council Of Canada Process for depositing metal on a substrate
CN109706439B (zh) * 2019-01-02 2020-10-30 济南大学 一种组合喷镀镀银还原液及其制备方法
CN116288295B (zh) * 2023-03-23 2024-06-25 河南科技大学 一种长度和表面粗糙度可调节的Au钉子及其制备方法

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US3058845A (en) * 1959-06-23 1962-10-16 Du Pont Process for metallizing polyacrylonitrile shaped article by treating with a water soluble metal salt and reducing the salt to the free metal
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2492278C2 (ru) * 2007-11-16 2013-09-10 Хюк Енгравинг Гмбх Унд Ко. Кг Способ обработки структурированной поверхности

Also Published As

Publication number Publication date
FI20030816A (fi) 2004-12-01
BRPI0410874A (pt) 2006-07-04
US20060286304A1 (en) 2006-12-21
EP1629137A1 (en) 2006-03-01
WO2004106585A1 (en) 2004-12-09
CA2526068A1 (en) 2004-12-09
FI20030816A0 (fi) 2003-05-30
JP2006526074A (ja) 2006-11-16
CN1798869A (zh) 2006-07-05

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Effective date: 20070529