PT1015130E - Metodo de electro-deposicao para fabrico de uma lampada de limpeza - Google Patents

Metodo de electro-deposicao para fabrico de uma lampada de limpeza

Info

Publication number
PT1015130E
PT1015130E PT97923561T PT97923561T PT1015130E PT 1015130 E PT1015130 E PT 1015130E PT 97923561 T PT97923561 T PT 97923561T PT 97923561 T PT97923561 T PT 97923561T PT 1015130 E PT1015130 E PT 1015130E
Authority
PT
Portugal
Prior art keywords
electroformed
squeegee blade
disclosed
deposition
electro
Prior art date
Application number
PT97923561T
Other languages
English (en)
Inventor
Karl W Fischbeck
Gary T Marks
Original Assignee
Xerox Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xerox Corp filed Critical Xerox Corp
Publication of PT1015130E publication Critical patent/PT1015130E/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00—Forme preparation
    • B41C1/14—Forme preparation for stencil-printing or silk-screen printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/40—Inking units
    • B41F15/42—Inking units comprising squeegees or doctors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N10/00—Blankets or like coverings; Coverings for wipers for intaglio printing
    • B41N10/005—Coverings for wipers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Screen Printers (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes For Compound Or Non-Metal Manufacture (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
PT97923561T 1996-05-03 1997-05-05 Metodo de electro-deposicao para fabrico de uma lampada de limpeza PT1015130E (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/646,380 US5746127A (en) 1996-05-03 1996-05-03 Electroformed squeegee blade for surface mount screen printing

Publications (1)

Publication Number Publication Date
PT1015130E true PT1015130E (pt) 2003-03-31

Family

ID=24592816

Family Applications (1)

Application Number Title Priority Date Filing Date
PT97923561T PT1015130E (pt) 1996-05-03 1997-05-05 Metodo de electro-deposicao para fabrico de uma lampada de limpeza

Country Status (9)

Country Link
US (1) US5746127A (pt)
EP (1) EP1015130B1 (pt)
AT (1) ATE228037T1 (pt)
AU (1) AU2933597A (pt)
DE (1) DE69717319T2 (pt)
DK (1) DK1015130T3 (pt)
ES (1) ES2187777T3 (pt)
PT (1) PT1015130E (pt)
WO (1) WO1997041969A1 (pt)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2754474B1 (fr) * 1996-10-15 1999-04-30 Novatec Dispositif pour le depot d'un produit visqueux ou pateux sur un substrat a travers les ouvertures d'un pochoir
EP0848586B1 (en) * 1996-12-10 2007-01-24 Matsushita Electric Industrial Co., Ltd. Apparatus and method for printing solder paste
US5947021A (en) * 1997-11-04 1999-09-07 Photo Stencil, Inc. Metal squeegee blade with a titanium nitride coating
TW409490B (en) * 1998-12-31 2000-10-21 World Wiser Electronics Inc The equipment for plug hole process and the method thereof
US6550662B2 (en) * 2001-04-03 2003-04-22 Kyocera Wireless Corporation Chip rework solder tool
US6659002B2 (en) * 2001-10-31 2003-12-09 International Business Machines Corporation Screening apparatus with trailing squeegee and method of screening
DE60312947T2 (de) * 2002-09-24 2007-12-13 Matsushita Electric Industrial Co., Ltd., Kadoma Druckplatte, leiterplatte und verfahren zum drucken einer leiterplatte
US7726239B2 (en) * 2005-08-24 2010-06-01 Seagate Technology Llc Controlled deposition of printing material
US20070232055A1 (en) * 2006-03-31 2007-10-04 Richard Earl Corley Methods and Apparatuses for Applying a Protective Material to an Interconnect Associated with a Component
US20130213247A1 (en) * 2012-02-17 2013-08-22 Samsung Electronics Co., Ltd. Stencil apparatus for printing solder paste
CN103287063B (zh) * 2012-02-29 2015-11-18 三星电子株式会社 用于印刷焊膏的漏印板设备
MX2016008677A (es) 2013-12-31 2017-05-11 Johnson & Johnson Consumer Inc Proceso para formar un producto de pelicula formado con multiples capas.
RU2700870C2 (ru) 2013-12-31 2019-09-23 Джонсон энд Джонсон Консьюмер Инк. Способ формования пленочного продукта
JP6517216B2 (ja) 2013-12-31 2019-05-22 ジョンソン・アンド・ジョンソン・コンシューマー・インコーポレイテッド 多層賦形フィルム製品を形成するための単一パス方法
CN112105504B (zh) * 2018-06-05 2021-12-21 雅马哈发动机株式会社 印刷装置
US10960607B2 (en) * 2018-12-13 2021-03-30 General Electric Company Systems and methods for monitoring powder spreading in additive manufacturing systems
TWI698287B (zh) * 2019-08-27 2020-07-11 華碩電腦股份有限公司 液態金屬散熱膏塗佈方法及使用液態金屬散熱膏的散熱模組

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3930455A (en) * 1974-09-19 1976-01-06 Harry Bremer Boat hull construction
JPH0288787A (ja) * 1988-09-27 1990-03-28 Matsushita Electric Works Ltd 電鋳刃
US5078082A (en) * 1989-08-16 1992-01-07 Smt East Corporation Method and apparatus for applying bonding material to a populated mounting surface
US5044306A (en) * 1990-06-11 1991-09-03 Gunter Erdmann Solder applying mechanism
JP3004416B2 (ja) * 1991-09-13 2000-01-31 理想科学工業株式会社 孔版印刷装置のインキ供給用スキージ装置
JP3025361B2 (ja) * 1992-02-07 2000-03-27 理想科学工業株式会社 孔版印刷装置のブレード式スキージ装置
US5478699A (en) * 1992-03-12 1995-12-26 Amtx, Inc. Method for preparing a screen printing stencil
US5254362A (en) * 1992-10-23 1993-10-19 Motorola, Inc. Method and apparatus for deposition of solder paste on a printed wiring board
US5387044A (en) * 1993-12-15 1995-02-07 Accardo; Thomas A. Screen filler applicator for the screen printing industry

Also Published As

Publication number Publication date
DE69717319T2 (de) 2003-04-03
ES2187777T3 (es) 2003-06-16
US5746127A (en) 1998-05-05
ATE228037T1 (de) 2002-12-15
EP1015130A4 (en) 2000-07-05
AU2933597A (en) 1997-11-26
EP1015130A1 (en) 2000-07-05
DE69717319D1 (de) 2003-01-02
DK1015130T3 (da) 2003-03-17
WO1997041969A1 (en) 1997-11-13
EP1015130B1 (en) 2002-11-20

Similar Documents

Publication Publication Date Title
PT1015130E (pt) Metodo de electro-deposicao para fabrico de uma lampada de limpeza
DE59503657D1 (de) Verfahren zur strukturierten Metallisierung der Oberfläche von Substraten
GR3029862T3 (en) Method for preparing and using a screen printing stencil having raised edges.
EP0255557A3 (en) Process for forming metal images
AU748566C (en) Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method
ATE385398T1 (de) Verfahren zur herstellung von starren und flexiblen schaltungen
KR830008634A (ko) 후막파인패턴(thick film fine pattern) 도전체(導電體)의 제조방법
JPS6112094A (ja) フレキシブル回路基板の製造法
DE59004525D1 (de) Verfahren zur beschichtung elektrisch leitfähiger substrate.
ES2169530T3 (es) Dispositivo para el tratamiento electrolitico de material en forma de placas y procedimiento para el apantallado electrico de las zonas marginales de dicho material durante el tratamiento electrolitico.
JPS59215790A (ja) 印刷回路板の製造法
ATE162923T1 (de) Verfahren zur herstellung einer leiterplatte.
EP0820095A3 (en) Method of forming an interlayer film
JPH0653635A (ja) プリント配線板の製造方法
ATE375703T1 (de) Mehrschichtige schaltungsanordnung und verfahren zu deren herstellung
ATE238642T1 (de) Verfahren zum beschichten von leiterplatten oder dergleichen substraten
JPS58305Y2 (ja) 金属芯入り印刷配線板用基板
KR970032314A (ko) 회로기판 제조방법
JPH09506468A (ja) プリント回路基板の製造方法
JPH0758435A (ja) 液体フォトレジストを平らな基板面に塗布するための方 法
JPH0368187A (ja) フレキシブル回路基板
SU588668A2 (ru) Устройство дл нанесени тонкого, равномерного сло покрыти
KR970078781A (ko) 인쇄회로 기판의 제조 방법
JPH06334313A (ja) 回路基板の製造方法
SU641684A1 (ru) Способ металлизации отверстий в платах