PL3416921T3 - Sposób obróbki krawędzi elementów szklanych i element szklany, obrobiony według tego sposobu - Google Patents

Sposób obróbki krawędzi elementów szklanych i element szklany, obrobiony według tego sposobu

Info

Publication number
PL3416921T3
PL3416921T3 PL16810274T PL16810274T PL3416921T3 PL 3416921 T3 PL3416921 T3 PL 3416921T3 PL 16810274 T PL16810274 T PL 16810274T PL 16810274 T PL16810274 T PL 16810274T PL 3416921 T3 PL3416921 T3 PL 3416921T3
Authority
PL
Poland
Prior art keywords
glass
machining
edges
machined according
element machined
Prior art date
Application number
PL16810274T
Other languages
English (en)
Inventor
Volker Plapper
Fabian Wagner
Andreas Ortner
Albrecht Seidl
Frank-Thomas Lentes
Original Assignee
Schott Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schott Ag filed Critical Schott Ag
Publication of PL3416921T3 publication Critical patent/PL3416921T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass

Landscapes

  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Surface Treatment Of Glass (AREA)
PL16810274T 2016-02-17 2016-12-01 Sposób obróbki krawędzi elementów szklanych i element szklany, obrobiony według tego sposobu PL3416921T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102016102768.5A DE102016102768A1 (de) 2016-02-17 2016-02-17 Verfahren zur Kantenbearbeitung von Glaselementen und verfahrensgemäß bearbeitetes Glaselement
PCT/EP2016/079411 WO2017140394A1 (de) 2016-02-17 2016-12-01 VERFAHREN ZUR KANTENBEARBEITUNG VON GLASELEMENTEN UND VERFAHRENSGEMÄß BEARBEITETES GLASELEMENT
EP16810274.7A EP3416921B1 (de) 2016-02-17 2016-12-01 Verfahren zur kantenbearbeitung von glaselementen und verfahrensgemäss bearbeitetes glaselement

Publications (1)

Publication Number Publication Date
PL3416921T3 true PL3416921T3 (pl) 2020-09-07

Family

ID=57544395

Family Applications (1)

Application Number Title Priority Date Filing Date
PL16810274T PL3416921T3 (pl) 2016-02-17 2016-12-01 Sposób obróbki krawędzi elementów szklanych i element szklany, obrobiony według tego sposobu

Country Status (8)

Country Link
US (2) US10807902B2 (pl)
EP (1) EP3416921B1 (pl)
JP (1) JP6906538B2 (pl)
CN (1) CN108698900B (pl)
DE (1) DE102016102768A1 (pl)
ES (1) ES2776724T3 (pl)
PL (1) PL3416921T3 (pl)
WO (1) WO2017140394A1 (pl)

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EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US10293436B2 (en) 2013-12-17 2019-05-21 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
JP2017521259A (ja) 2014-07-08 2017-08-03 コーニング インコーポレイテッド 材料をレーザ加工するための方法および装置
JP2017530867A (ja) 2014-07-14 2017-10-19 コーニング インコーポレイテッド 長さおよび直径の調節可能なレーザビーム焦線を用いて透明材料を加工するためのシステムおよび方法
CN107922237B (zh) 2015-03-24 2022-04-01 康宁股份有限公司 显示器玻璃组合物的激光切割和加工
WO2017011296A1 (en) 2015-07-10 2017-01-19 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
KR102607582B1 (ko) * 2016-08-30 2023-11-30 삼성디스플레이 주식회사 커버 윈도우, 커버 윈도우를 포함하는 표시 장치 및 커버 윈도우의 제조 방법
KR102078294B1 (ko) 2016-09-30 2020-02-17 코닝 인코포레이티드 비-축대칭 빔 스폿을 이용하여 투명 워크피스를 레이저 가공하기 위한 기기 및 방법
WO2018081031A1 (en) 2016-10-24 2018-05-03 Corning Incorporated Substrate processing station for laser-based machining of sheet-like glass substrates
DE102017208290A1 (de) 2017-05-17 2018-11-22 Schott Ag Vorrichtung und Verfahren zum Bearbeiten eines Werkstücks entlang einer vorbestimmten Bearbeitungslinie
KR102543324B1 (ko) 2017-05-19 2023-06-13 쇼오트 아게 유리 또는 유리 세라믹을 포함하고 선결정된 분할선을 따라 기손상부를 갖는 부품, 그 부품을 제조하기 위한 방법과 장치, 및 그 부품의 용도
CN111065485B (zh) * 2017-08-25 2022-06-21 康宁股份有限公司 使用无焦光束调整组件激光加工透明工件的设备和方法
WO2019151185A1 (ja) * 2018-01-31 2019-08-08 Hoya株式会社 磁気ディスク用ガラス基板の製造方法
DE102019110489A1 (de) * 2019-04-23 2020-10-29 Schott Ag Glas- oder Glaskeramikplatte und Verfahren zur Herstellung derartiger Platten
DE102019113635A1 (de) * 2019-05-22 2020-11-26 Schott Ag Verfahren und Vorrichtung zur Verarbeitung von Glaselementen
CN114728832A (zh) 2019-11-21 2022-07-08 Ａｇｃ株式会社 玻璃板的加工方法、玻璃板
KR20210110510A (ko) * 2020-02-28 2021-09-08 쇼오트 아게 유리 부재의 분리 방법 및 유리 서브부재
CN111439924A (zh) * 2020-04-28 2020-07-24 深圳市东赢激光设备有限公司 一种大幅面玻璃超快皮秒激光切割机的使用方法
CN112518433A (zh) * 2020-10-20 2021-03-19 哈尔滨工业大学（深圳） 一种复杂曲面打磨的刀具轨迹自动生成方法
JPWO2022264976A1 (pl) 2021-06-16 2022-12-22
DE102023100535A1 (de) 2023-01-11 2024-07-11 Schott Ag Verfahren zum Zerteilen von Werkstücken aus sprödhartem Material und verfahrensgemäß herstellbare Elemente

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JP4863168B2 (ja) * 2007-04-17 2012-01-25 日本電気硝子株式会社 フラットパネルディスプレイ用ガラス基板およびその製造方法
US20100279067A1 (en) * 2009-04-30 2010-11-04 Robert Sabia Glass sheet having enhanced edge strength
US20120234807A1 (en) 2009-12-07 2012-09-20 J.P. Sercel Associates Inc. Laser scribing with extended depth affectation into a workplace
RU2013102422A (ru) 2010-07-12 2014-08-20 ФАЙЛЭЙСЕР ЮЭс-Эй ЭлЭлСи Способ обработки материалов с использованием филаментации
US8721392B2 (en) * 2011-06-28 2014-05-13 Corning Incorporated Glass edge finishing method
CN104136967B (zh) * 2012-02-28 2018-02-16 伊雷克托科学工业股份有限公司 用于分离增强玻璃的方法及装置及由该增强玻璃生产的物品
FR2989294B1 (fr) 2012-04-13 2022-10-14 Centre Nat Rech Scient Dispositif et methode de nano-usinage par laser
TW201417928A (zh) * 2012-07-30 2014-05-16 Raydiance Inc 具訂製邊形及粗糙度之脆性材料切割
CN102785031B (zh) * 2012-08-15 2015-04-01 武汉隽龙科技有限公司 一种利用超短脉冲激光的透明材料切割方法及切割装置
KR20140072448A (ko) 2012-12-04 2014-06-13 주식회사 나래나노텍 개선된 유리 커팅 장치, 시스템 및 방법
EP2754524B1 (de) * 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
WO2014130830A1 (en) 2013-02-23 2014-08-28 Raydiance, Inc. Shaping of brittle materials with controlled surface and bulk properties
WO2014144322A1 (en) * 2013-03-15 2014-09-18 Kinestral Technologies, Inc. Laser cutting strengthened glass
EP2781296B1 (de) * 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
WO2014161535A2 (de) 2013-04-04 2014-10-09 Lpkf Laser & Electronics Ag Verfahren und vorrichtung zum trennen eines substrates
US20150034613A1 (en) * 2013-08-02 2015-02-05 Rofin-Sinar Technologies Inc. System for performing laser filamentation within transparent materials
US9815730B2 (en) * 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US20150166393A1 (en) * 2013-12-17 2015-06-18 Corning Incorporated Laser cutting of ion-exchangeable glass substrates
US9850160B2 (en) * 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US10293436B2 (en) * 2013-12-17 2019-05-21 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
JP2017510535A (ja) * 2014-01-27 2017-04-13 コーニング インコーポレイテッド レーザ切断済みガラスを機械的に加工することによる縁部面取り
JP7090594B2 (ja) * 2016-07-29 2022-06-24 コーニング インコーポレイテッド レーザ加工するための装置および方法

Also Published As

Publication number Publication date
WO2017140394A1 (de) 2017-08-24
US20200407263A1 (en) 2020-12-31
ES2776724T3 (es) 2020-07-31
JP6906538B2 (ja) 2021-07-21
CN108698900A (zh) 2018-10-23
US10807902B2 (en) 2020-10-20
DE102016102768A1 (de) 2017-08-17
EP3416921B1 (de) 2020-02-26
CN108698900B (zh) 2021-10-29
US20180370840A1 (en) 2018-12-27
EP3416921A1 (de) 2018-12-26
US11396471B2 (en) 2022-07-26
JP2019511989A (ja) 2019-05-09

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