PL3212728T3 - Adhesive compounds comprising multi-functional siloxane water scavengers - Google Patents

Adhesive compounds comprising multi-functional siloxane water scavengers

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Publication number
PL3212728T3
PL3212728T3 PL15786882T PL15786882T PL3212728T3 PL 3212728 T3 PL3212728 T3 PL 3212728T3 PL 15786882 T PL15786882 T PL 15786882T PL 15786882 T PL15786882 T PL 15786882T PL 3212728 T3 PL3212728 T3 PL 3212728T3
Authority
PL
Poland
Prior art keywords
functional siloxane
adhesive compounds
water scavengers
siloxane water
scavengers
Prior art date
Application number
PL15786882T
Other languages
Polish (pl)
Inventor
Christian Schuh
Klaus KEITE-TELGENBÜSCHER
Original Assignee
Tesa Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tesa Se filed Critical Tesa Se
Publication of PL3212728T3 publication Critical patent/PL3212728T3/en

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    • C08K5/15Heterocyclic compounds having oxygen in the ring
    • C08K5/151Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1515Three-membered rings
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    • C08K5/5425Silicon-containing compounds containing oxygen containing at least one C=C bond
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  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Optics & Photonics (AREA)
  • Sustainable Development (AREA)
  • Sustainable Energy (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Metallurgy (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
PL15786882T 2014-10-29 2015-10-15 Adhesive compounds comprising multi-functional siloxane water scavengers PL3212728T3 (en)

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015222027A1 (en) * 2015-11-09 2017-05-11 Tesa Se Barrier adhesive with polymeric getter material
DE102016213911A1 (en) 2016-07-28 2018-02-01 Tesa Se OLED compatible adhesives with cyclic azasilane water scavengers
JP6742253B2 (en) * 2017-02-06 2020-08-19 アイカ工業株式会社 Adhesive for fixing optical components
US9960389B1 (en) 2017-05-05 2018-05-01 3M Innovative Properties Company Polymeric films and display devices containing such films
CN111465669B (en) * 2017-12-06 2022-12-16 3M创新有限公司 Barrier adhesive compositions and articles
CN114656771B (en) * 2020-12-24 2023-09-12 广东生益科技股份有限公司 Resin composition and application thereof

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3729313A (en) 1971-12-06 1973-04-24 Minnesota Mining & Mfg Novel photosensitive systems comprising diaryliodonium compounds and their use
US3741769A (en) 1972-10-24 1973-06-26 Minnesota Mining & Mfg Novel photosensitive polymerizable systems and their use
AU497960B2 (en) 1974-04-11 1979-01-25 Minnesota Mining And Manufacturing Company Photopolymerizable compositions
US4058401A (en) 1974-05-02 1977-11-15 General Electric Company Photocurable compositions containing group via aromatic onium salts
US4256828A (en) 1975-09-02 1981-03-17 Minnesota Mining And Manufacturing Company Photocopolymerizable compositions based on epoxy and hydroxyl-containing organic materials
US4051195A (en) 1975-12-15 1977-09-27 Celanese Polymer Specialties Company Polyepoxide-polyacrylate ester compositions
GB1552046A (en) 1977-02-02 1979-09-05 Ciba Geigy Ag Film adhesives
US4138255A (en) 1977-06-27 1979-02-06 General Electric Company Photo-curing method for epoxy resin using group VIa onium salt
US4231951A (en) 1978-02-08 1980-11-04 Minnesota Mining And Manufacturing Company Complex salt photoinitiator
US4250053A (en) 1979-05-21 1981-02-10 Minnesota Mining And Manufacturing Company Sensitized aromatic iodonium or aromatic sulfonium salt photoinitiator systems
US5089536A (en) 1982-11-22 1992-02-18 Minnesota Mining And Manufacturing Company Energy polmerizable compositions containing organometallic initiators
EP0442700B1 (en) * 1990-02-14 1996-01-03 Union Camp Corporation Two-component curable hot-melt resin compositions
WO1998021287A1 (en) 1996-11-12 1998-05-22 Minnesota Mining And Manufacturing Company Thermosettable pressure sensitive adhesive
US7193594B1 (en) 1999-03-18 2007-03-20 Semiconductor Energy Laboratory Co., Ltd. Display device
JP2000311782A (en) 1999-04-27 2000-11-07 Nec Corp Organic el display, and manufacture thereof
US6833668B1 (en) 1999-09-29 2004-12-21 Sanyo Electric Co., Ltd. Electroluminescence display device having a desiccant
JP2001172603A (en) * 1999-12-15 2001-06-26 Toshiba Chem Corp Adhesive for electronic device
DE60234409D1 (en) 2001-06-29 2009-12-31 Jsr Corp Acid generator, sulfonic acid, sulfonic acid derivatives and radiation-sensitive composition
CN1558921A (en) 2001-08-03 2004-12-29 Dsm Curable compositions for display devices
US6936131B2 (en) 2002-01-31 2005-08-30 3M Innovative Properties Company Encapsulation of organic electronic devices using adsorbent loaded adhesives
US20060100299A1 (en) 2002-07-24 2006-05-11 Ranjit Malik Transformable pressure sensitive adhesive tape and use thereof in display screens
DE10240756A1 (en) 2002-08-30 2004-03-11 Degussa Ag Desiccant containing alkoxysiloxane for cross-linkable polymer compositions
JP4327489B2 (en) 2003-03-28 2009-09-09 本田技研工業株式会社 Metal separator for fuel cell and manufacturing method thereof
US7029725B2 (en) * 2004-03-08 2006-04-18 Air Products Polymers, L.P. Process for providing barrier properties to porous substrates
JP2007119667A (en) * 2005-10-31 2007-05-17 Sumitomo Chemical Co Ltd Adhesive
JP2007197517A (en) 2006-01-24 2007-08-09 Three M Innovative Properties Co Adhesive sealing composition, sealing film and organic el element
EP2041204B9 (en) * 2006-07-03 2010-07-21 Dow Corning Corporation Chemically curing all-in-one warm edge spacer and seal
JP5670616B2 (en) 2006-12-01 2015-02-18 株式会社カネカ Polysiloxane composition
DE102008003546A1 (en) 2008-01-09 2009-07-16 Tesa Ag Liner with a barrier layer
DE102008047964A1 (en) 2008-09-18 2010-03-25 Tesa Se Method for encapsulating an electronic device
DE102010043866A1 (en) 2010-11-12 2012-05-16 Tesa Se Adhesive composition and method for encapsulating an electronic device
JP5808177B2 (en) * 2011-07-14 2015-11-10 日本合成化学工業株式会社 Adhesive for optical member, optical part with adhesive layer, and image display device
DE102011085034A1 (en) * 2011-10-21 2013-04-25 Tesa Se Adhesive, in particular for encapsulating an electronic device
DE102012202377A1 (en) 2011-10-21 2013-04-25 Tesa Se Adhesive, in particular for encapsulating an electronic device
JP2013232580A (en) 2012-05-01 2013-11-14 Dow Corning Toray Co Ltd Thermosetting film-like silicone sealing material
JP2012184432A (en) * 2012-05-02 2012-09-27 Saiden Chemical Industry Co Ltd Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet for optics
DE102012211335A1 (en) * 2012-06-29 2014-01-02 Tesa Se Adhesive tape for the encapsulation of an organic electronic device
JP2014231586A (en) * 2013-05-30 2014-12-11 大日本印刷株式会社 Adhesive composition and adhesive sheet using the same

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Publication number Publication date
TW201623513A (en) 2016-07-01
CN107001892B (en) 2019-09-06
EP3212728A1 (en) 2017-09-06
EP3212728B1 (en) 2018-10-03
KR20170071583A (en) 2017-06-23
JP2017536448A (en) 2017-12-07
US20170298259A1 (en) 2017-10-19
US10280344B2 (en) 2019-05-07
BR112017008003A2 (en) 2017-12-19
KR101933961B1 (en) 2018-12-31
WO2016066437A1 (en) 2016-05-06
CN107001892A (en) 2017-08-01

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