PL3207104T3 - Zgrzewalne i tłumiące drgania kleje silikonowe - Google Patents
Zgrzewalne i tłumiące drgania kleje silikonoweInfo
- Publication number
- PL3207104T3 PL3207104T3 PL15791816T PL15791816T PL3207104T3 PL 3207104 T3 PL3207104 T3 PL 3207104T3 PL 15791816 T PL15791816 T PL 15791816T PL 15791816 T PL15791816 T PL 15791816T PL 3207104 T3 PL3207104 T3 PL 3207104T3
- Authority
- PL
- Poland
- Prior art keywords
- weldable
- vibration damping
- silicone adhesives
- damping silicone
- adhesives
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/10—Joining materials by welding overlapping edges with an insertion of plastic material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2405/00—Adhesive articles, e.g. adhesive tapes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0812—Aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/14—Peroxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/02—Ingredients treated with inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201462063172P | 2014-10-13 | 2014-10-13 | |
US201562142590P | 2015-04-03 | 2015-04-03 | |
PCT/US2015/055360 WO2016061121A1 (en) | 2014-10-13 | 2015-10-13 | Weldable and vibration damping silicone adhesives |
EP15791816.0A EP3207104B1 (en) | 2014-10-13 | 2015-10-13 | Weldable and vibration damping silicone adhesives |
Publications (1)
Publication Number | Publication Date |
---|---|
PL3207104T3 true PL3207104T3 (pl) | 2022-01-03 |
Family
ID=54478956
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL15791816T PL3207104T3 (pl) | 2014-10-13 | 2015-10-13 | Zgrzewalne i tłumiące drgania kleje silikonowe |
Country Status (8)
Country | Link |
---|---|
US (1) | US10954422B2 (pl) |
EP (2) | EP3910039A1 (pl) |
JP (1) | JP2017534721A (pl) |
KR (1) | KR102424027B1 (pl) |
CN (1) | CN107001877B (pl) |
ES (1) | ES2890655T3 (pl) |
PL (1) | PL3207104T3 (pl) |
WO (1) | WO2016061121A1 (pl) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102015203128A1 (de) * | 2015-02-20 | 2016-08-25 | Thyssenkrupp Ag | Fahrwerkkomponente, Verfahren zu seiner Herstellung und Verwendung |
US20180134925A1 (en) * | 2016-11-11 | 2018-05-17 | Polyonics, Inc. | High temperature resistant pressure sensitive adhesive with low thermal impedance |
DE102017202624A1 (de) * | 2017-02-17 | 2018-08-23 | Tesa Se | Vibrationsdämpfende Silikon-Haftklebmasse |
DE102017202623A1 (de) * | 2017-02-17 | 2018-08-23 | Tesa Se | Vibrationsdämpfende Silikon-Haftklebmasse |
WO2019071379A1 (en) * | 2017-10-09 | 2019-04-18 | 3M Innovative Properties Company | ADHESIVE DAMPING LAYERS FOR MICRO-SPEAKER DIAPHRAGMS |
WO2022141224A1 (en) * | 2020-12-30 | 2022-07-07 | 3M Innovative Properties Company | Cured silicone adhesive composition |
JP2022149619A (ja) * | 2021-03-25 | 2022-10-07 | 株式会社Subaru | 樹脂複合鋼板 |
Family Cites Families (49)
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US1957597A (en) | 1927-04-09 | 1934-05-08 | Buckeye Steel Castings Co | Draft mechanism |
US3110691A (en) | 1958-12-11 | 1963-11-12 | Ind Metal Protectives Inc | Metallically pigmented liquid coating |
US3118048A (en) | 1961-07-18 | 1964-01-14 | Ind Metal Proiectives Inc | Liquid coating composition |
US3193049A (en) | 1963-05-27 | 1965-07-06 | Daubert Chemical Co | Sound damping tape |
US3687739A (en) | 1970-12-10 | 1972-08-29 | Diamond Shamrock Corp | Coated metal and method |
JPS60912B2 (ja) | 1980-06-04 | 1985-01-10 | 住友金属工業株式会社 | スポツト溶接可能な接着クラツド金属板 |
US4584355A (en) | 1984-10-29 | 1986-04-22 | Dow Corning Corporation | Silicone pressure-sensitive adhesive process and product with improved lap-shear stability-I |
US5820940A (en) | 1991-09-05 | 1998-10-13 | Technalum Research, Inc. | Preparation of adhesive coatings from thermally reactive binary and multicomponent powders |
US5275856A (en) | 1991-11-12 | 1994-01-04 | Minnesota Mining And Manufacturing Company | Electrically conductive adhesive web |
US5170930A (en) | 1991-11-14 | 1992-12-15 | Microelectronics And Computer Technology Corporation | Liquid metal paste for thermal and electrical connections |
US5869556A (en) | 1996-07-05 | 1999-02-09 | Dow Corning Corporation | Silicone pressure sensitive adhesives |
US5726256A (en) | 1996-10-22 | 1998-03-10 | Dow Corning Corporation | Method of making silicone pressure sensitive adhesives |
DE19710115A1 (de) | 1997-03-12 | 1998-09-17 | Henkel Kgaa | Schmelzklebstoff zur Verklebung von DVDs |
DE19744957C1 (de) | 1997-10-10 | 1999-07-29 | Pritt Produktionsgesellschaft | Mehrschichtiges, flexibles Korrekturband |
ATE256578T1 (de) | 1997-11-12 | 2004-01-15 | Collins & Aikman Prod Co | Vibrationsdämpfendes verbundmaterial |
JP3226889B2 (ja) | 1998-05-06 | 2001-11-05 | シンワ プロダクト カンパニー・リミテッド | 導電性粘着テープ |
US6117284A (en) | 1998-09-28 | 2000-09-12 | Wea Manufacturing, Inc. | Dual-layer DVD disc, and method and apparatus for making same |
US6201055B1 (en) * | 1999-03-11 | 2001-03-13 | Dow Corning Corporation | Silicone composition and silicone pressure sensitive adhesive |
US6703120B1 (en) * | 1999-05-05 | 2004-03-09 | 3M Innovative Properties Company | Silicone adhesives, articles, and methods |
US6347586B1 (en) | 2000-04-19 | 2002-02-19 | Heidelberger Druckmaschinen Ag | Method and device for reducing printing sleeve noise |
US6361716B1 (en) | 2000-07-20 | 2002-03-26 | Dow Corning Corporation | Silicone composition and electrically conductive silicone adhesive formed therefrom |
KR100734496B1 (ko) | 2000-07-25 | 2007-07-03 | 미쓰이 가가쿠 가부시키가이샤 | 경화성 조성물 및 그 용도 |
KR100713570B1 (ko) * | 2001-04-20 | 2007-05-02 | 다우 코닝 코포레이션 | 실리콘 조성물 및 이로부터 제조된 전기 전도성 실리콘접착제 |
US6641923B2 (en) | 2001-07-31 | 2003-11-04 | Ppg Industries Ohio, Inc. | Weldable coating compositions having improved intercoat adhesion |
US6828020B2 (en) | 2002-08-14 | 2004-12-07 | Adco Products, Inc. | Self-adhesive vibration damping tape and composition |
JP3956121B2 (ja) * | 2002-09-04 | 2007-08-08 | 信越化学工業株式会社 | 導電性シリコーン粘着剤組成物 |
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JP2004119254A (ja) * | 2002-09-27 | 2004-04-15 | Three Bond Co Ltd | 導電性接着剤組成物 |
US7147897B2 (en) | 2002-11-06 | 2006-12-12 | Ppg Industries Ohio, Inc. | Weldable compositions comprising a conductive pigment and silicon and methods for using the same |
WO2005108491A1 (ja) * | 2004-05-07 | 2005-11-17 | Kaneka Corporation | 硬化性組成物 |
DE102004054846A1 (de) | 2004-11-12 | 2006-05-24 | Henkel Kgaa | Doppelseitiger Klebestrip mit hoher Tragkraft |
CN101107337B (zh) * | 2005-01-25 | 2011-12-14 | 西格马涂料有限公司 | 基料组合物 |
US20070110942A1 (en) | 2005-02-14 | 2007-05-17 | Scapa North America | Novel enhanced high temperature tapes for high velocity Oxy fuel processes |
KR100625090B1 (ko) | 2005-03-02 | 2006-09-20 | 모딘코리아 유한회사 | 고 마그네슘 알루미늄 합금용 접합시트 및 고 마그네슘 알루미늄 합금 접합방법 |
KR100700346B1 (ko) | 2005-08-05 | 2007-03-29 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 기능성을 갖는 방열 점착테이프 |
WO2007067332A2 (en) | 2005-12-08 | 2007-06-14 | Dow Corning Corporation | Continuous process for production of silicone pressure sensitive adhesives |
US20080102240A1 (en) | 2006-10-27 | 2008-05-01 | Covalence Specialty Materials Corp. | Polymeric composite adhesive tape |
JP5049584B2 (ja) * | 2006-12-25 | 2012-10-17 | 東レ・ダウコーニング株式会社 | 過酸化物硬化型シリコーン系感圧接着剤組成物および粘着テープ |
KR100774440B1 (ko) | 2007-01-17 | 2007-11-08 | 조인셋 주식회사 | 전도성 점착테이프 |
WO2009081415A2 (en) | 2007-12-24 | 2009-07-02 | Prs Solutions Private Limited | Process of manufacturing audio/visual detectable and tamper evident label stock for authentication |
KR102001292B1 (ko) | 2008-10-29 | 2019-07-17 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 전자빔 경화된 실리콘 물질 |
JP5948242B2 (ja) | 2009-08-25 | 2016-07-06 | ダウ コーニング コーポレーションDow Corning Corporation | シリコーン感圧接着剤の調製方法 |
US8796580B2 (en) | 2009-12-28 | 2014-08-05 | Productive Research | Processes for welding composite materials and articles therefrom |
KR100977064B1 (ko) | 2010-02-19 | 2010-08-19 | 조인셋 주식회사 | 다목적 접착테이프 |
CN110527484B (zh) * | 2011-03-21 | 2022-05-24 | 艾利丹尼森公司 | 非流动性有机硅粘合剂 |
CN102984929B (zh) | 2011-09-07 | 2015-07-08 | 港易有限公司 | 用于电子装置的防辐射叠层板及将该叠层板嵌入外壳的方法 |
US9238760B2 (en) | 2012-03-30 | 2016-01-19 | Adhesives Research, Inc. | Charge collection side adhesive tape |
GB2504957A (en) * | 2012-08-14 | 2014-02-19 | Henkel Ag & Co Kgaa | Curable compositions comprising composite particles |
KR20140023820A (ko) | 2012-08-17 | 2014-02-27 | 삼성전기주식회사 | 점착 테이프 및 이를 이용한 기판의 제조 방법 |
-
2015
- 2015-10-13 CN CN201580065595.1A patent/CN107001877B/zh active Active
- 2015-10-13 KR KR1020177011503A patent/KR102424027B1/ko active IP Right Grant
- 2015-10-13 US US15/518,581 patent/US10954422B2/en active Active
- 2015-10-13 ES ES15791816T patent/ES2890655T3/es active Active
- 2015-10-13 WO PCT/US2015/055360 patent/WO2016061121A1/en active Application Filing
- 2015-10-13 JP JP2017519614A patent/JP2017534721A/ja active Pending
- 2015-10-13 EP EP21183676.2A patent/EP3910039A1/en active Pending
- 2015-10-13 PL PL15791816T patent/PL3207104T3/pl unknown
- 2015-10-13 EP EP15791816.0A patent/EP3207104B1/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20170218239A1 (en) | 2017-08-03 |
KR102424027B1 (ko) | 2022-07-25 |
WO2016061121A1 (en) | 2016-04-21 |
JP2017534721A (ja) | 2017-11-24 |
CN107001877B (zh) | 2022-10-14 |
US10954422B2 (en) | 2021-03-23 |
CN107001877A (zh) | 2017-08-01 |
ES2890655T3 (es) | 2022-01-21 |
EP3207104B1 (en) | 2021-08-25 |
KR20170067799A (ko) | 2017-06-16 |
EP3207104A1 (en) | 2017-08-23 |
EP3910039A1 (en) | 2021-11-17 |
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