PL3144591T3 - Rozpraszacz ciepła - Google Patents
Rozpraszacz ciepłaInfo
- Publication number
- PL3144591T3 PL3144591T3 PL16189209T PL16189209T PL3144591T3 PL 3144591 T3 PL3144591 T3 PL 3144591T3 PL 16189209 T PL16189209 T PL 16189209T PL 16189209 T PL16189209 T PL 16189209T PL 3144591 T3 PL3144591 T3 PL 3144591T3
- Authority
- PL
- Poland
- Prior art keywords
- heat sink
- sink
- heat
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/745—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades the fins or blades being planar and inclined with respect to the joining surface from which the fins or blades extend
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/40—Removing or ejecting moulded articles
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
- F21V29/777—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/78—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with helically or spirally arranged fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20127—Natural convection
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ES201531335A ES2565556B1 (es) | 2015-09-18 | 2015-09-18 | Disipador de calor |
EP16189209.6A EP3144591B1 (en) | 2015-09-18 | 2016-09-16 | Heat sink |
Publications (1)
Publication Number | Publication Date |
---|---|
PL3144591T3 true PL3144591T3 (pl) | 2019-06-28 |
Family
ID=55588739
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL16189209T PL3144591T3 (pl) | 2015-09-18 | 2016-09-16 | Rozpraszacz ciepła |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP3144591B1 (pl) |
DK (1) | DK3144591T3 (pl) |
ES (2) | ES2565556B1 (pl) |
MX (1) | MX2016011948A (pl) |
PL (1) | PL3144591T3 (pl) |
PT (1) | PT3144591T (pl) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11448389B1 (en) * | 2022-02-17 | 2022-09-20 | Dialight Corporation | Luminaires with modular heat spreader panels |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09293410A (ja) * | 1996-04-30 | 1997-11-11 | Matsushita Electric Works Ltd | ダウンライト |
US6308771B1 (en) * | 1998-10-29 | 2001-10-30 | Advanced Thermal Solutions, Inc. | High performance fan tail heat exchanger |
US20030131970A1 (en) * | 2002-01-17 | 2003-07-17 | Carter Daniel P. | Heat sinks and method of formation |
US7008095B2 (en) * | 2003-04-10 | 2006-03-07 | Osram Sylvania Inc. | LED lamp with insertable axial wireways and method of making the lamp |
US6955451B2 (en) * | 2003-08-25 | 2005-10-18 | Osram Sylvania Inc. | Lamp with LED substrates supported by heat conductive post, and method of making such lamp |
EP2757313B1 (en) * | 2010-05-05 | 2016-03-30 | Alexiou & Tryde Holding ApS | LED lamp assembly |
EP2469160A4 (en) * | 2010-07-05 | 2014-10-29 | Toshiba Lighting & Technology | LIGHTING DEVICE |
JP5204180B2 (ja) * | 2010-09-08 | 2013-06-05 | 株式会社日本自動車部品総合研究所 | 車両用前照灯 |
JP5729600B2 (ja) * | 2011-03-25 | 2015-06-03 | 東芝ライテック株式会社 | 照明器具 |
CN202915302U (zh) * | 2012-10-11 | 2013-05-01 | 四川畅洋泰鼎科技有限公司 | 筒灯散热体 |
-
2015
- 2015-09-18 ES ES201531335A patent/ES2565556B1/es not_active Expired - Fee Related
-
2016
- 2016-09-14 MX MX2016011948A patent/MX2016011948A/es active IP Right Grant
- 2016-09-16 PT PT16189209T patent/PT3144591T/pt unknown
- 2016-09-16 PL PL16189209T patent/PL3144591T3/pl unknown
- 2016-09-16 EP EP16189209.6A patent/EP3144591B1/en not_active Not-in-force
- 2016-09-16 DK DK16189209.6T patent/DK3144591T3/en active
- 2016-09-16 ES ES16189209.6T patent/ES2688423T3/es active Active
Also Published As
Publication number | Publication date |
---|---|
DK3144591T3 (en) | 2018-10-08 |
PT3144591T (pt) | 2018-10-22 |
ES2688423T3 (es) | 2018-11-02 |
EP3144591B1 (en) | 2018-06-20 |
MX2016011948A (es) | 2018-03-13 |
EP3144591A1 (en) | 2017-03-22 |
ES2565556A1 (es) | 2016-04-05 |
ES2565556B1 (es) | 2017-01-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
HK1243749A1 (zh) | 水槽 | |
GB2546144B (en) | Heat exchanger | |
GB201608523D0 (en) | Heat sink | |
HK1243748A1 (zh) | 水槽 | |
HUE053288T2 (hu) | Hõcserélõ | |
EP3457828A4 (en) | HEAT SINK | |
PL3371532T3 (pl) | Urządzenie chłodzące | |
LT3245468T (lt) | Šilumokaitis | |
PL3187964T3 (pl) | Układ rozpraszania ciepła | |
PL3159646T3 (pl) | Wymiennik ciepła | |
GB201503788D0 (en) | Heatsink | |
GB201521862D0 (en) | Cooling arrangement | |
ZA201800412B (en) | Cooling suit | |
PL3262357T3 (pl) | Urządzenie chłodzące | |
GB201600798D0 (en) | Heat exchanger | |
HUE047616T2 (hu) | Hõelvezetõ | |
PL3230670T3 (pl) | Promiennik ciepła | |
TWM533195U (en) | Heat dissipating device | |
PL3076106T3 (pl) | Jednostka chłodząca | |
GB2539915B (en) | Heat exchangers | |
TWM534431U (en) | Improved heat sink structure | |
FI11192U1 (fi) | Jäähdytyselementti | |
PL3134676T3 (pl) | Wymiennik ciepła | |
HK1210367A2 (en) | Cooling pad | |
ZA201901595B (en) | Heat sink |