PL2880196T3 - Urządzenie do rozpylania - Google Patents
Urządzenie do rozpylaniaInfo
- Publication number
- PL2880196T3 PL2880196T3 PL13834622T PL13834622T PL2880196T3 PL 2880196 T3 PL2880196 T3 PL 2880196T3 PL 13834622 T PL13834622 T PL 13834622T PL 13834622 T PL13834622 T PL 13834622T PL 2880196 T3 PL2880196 T3 PL 2880196T3
- Authority
- PL
- Poland
- Prior art keywords
- sputtering apparatus
- sputtering
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
- H01J37/3452—Magnet distribution
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/342—Hollow targets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Plasma Technology (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261696610P | 2012-09-04 | 2012-09-04 | |
PCT/US2013/057802 WO2014039426A1 (en) | 2012-09-04 | 2013-09-03 | Sputtering apparatus |
EP13834622.6A EP2880196B1 (en) | 2012-09-04 | 2013-09-03 | Sputtering apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
PL2880196T3 true PL2880196T3 (pl) | 2020-11-30 |
Family
ID=50185909
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL13834622T PL2880196T3 (pl) | 2012-09-04 | 2013-09-03 | Urządzenie do rozpylania |
Country Status (8)
Country | Link |
---|---|
US (1) | US9758862B2 (pl) |
EP (1) | EP2880196B1 (pl) |
JP (2) | JP2015530482A (pl) |
KR (1) | KR102101720B1 (pl) |
CN (1) | CN104812934B (pl) |
PL (1) | PL2880196T3 (pl) |
TW (1) | TWI598454B (pl) |
WO (1) | WO2014039426A1 (pl) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012094566A2 (en) | 2011-01-06 | 2012-07-12 | Sputtering Components, Inc. | Sputtering apparatus |
TWI579880B (zh) * | 2015-05-29 | 2017-04-21 | 國立臺灣科技大學 | 陽極層離子源與陽極層離子源離子束濺鍍模組 |
GB2562128B (en) * | 2017-09-29 | 2020-08-05 | Camvac Ltd | Apparatus and Method for Processing, Coating or Curing a Substrate |
DE102020125407A1 (de) | 2020-09-29 | 2022-03-31 | VON ARDENNE Asset GmbH & Co. KG | Magnetsystem |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6223979A (ja) | 1985-07-24 | 1987-01-31 | Toshiba Corp | マグネトロンスパツタリング用タ−ゲツト |
US5096562A (en) | 1989-11-08 | 1992-03-17 | The Boc Group, Inc. | Rotating cylindrical magnetron structure for large area coating |
US5047131A (en) | 1989-11-08 | 1991-09-10 | The Boc Group, Inc. | Method for coating substrates with silicon based compounds |
US5427665A (en) * | 1990-07-11 | 1995-06-27 | Leybold Aktiengesellschaft | Process and apparatus for reactive coating of a substrate |
US5364518A (en) | 1991-05-28 | 1994-11-15 | Leybold Aktiengesellschaft | Magnetron cathode for a rotating target |
WO1995012003A2 (en) | 1993-10-22 | 1995-05-04 | Manley Barry W | Method and apparatus for sputtering magnetic target materials |
JPH10512326A (ja) | 1995-01-12 | 1998-11-24 | ザ ビーオーシー グループ インコーポレイテッド | 曲面又は扇状エンド・マグネットを持つ回転式マグネトロン |
CA2218279A1 (en) | 1995-04-25 | 1996-10-31 | The Boc Group, Inc. | Sputtering system using cylindrical rotating magnetron electrically powered using alternating current |
JP3834111B2 (ja) | 1996-10-16 | 2006-10-18 | 松下電器産業株式会社 | マグネトロンスパッタ方法、マグネトロンスパッタ装置及びそれに使用するマグネットユニット |
US6264803B1 (en) * | 1997-02-07 | 2001-07-24 | Steven V. Morgan | Apparatus and method for sputtering |
ES2257047T3 (es) * | 1998-04-16 | 2006-07-16 | Bekaert Advanced Coatings Nv. | Medios para controlar la erosion y la pulverizacion del objetivo en un magnetron. |
JP2001164362A (ja) | 1999-12-06 | 2001-06-19 | Ulvac Japan Ltd | プレーナーマグネトロンスパッタリング装置 |
GB0118803D0 (en) | 2001-08-02 | 2001-09-26 | Bekaert Sa Nv | Adjustable magnet configuration and method for magnetron sputtering |
JP2006016634A (ja) | 2004-06-30 | 2006-01-19 | Neomax Co Ltd | 磁界発生装置及びマグネトロン・スパッタ装置 |
JP5342240B2 (ja) * | 2005-12-22 | 2013-11-13 | テル・ソーラー・アクチェンゲゼルシャフト | 少なくとも1つのスパッタコーティングされた基板を製造する方法およびスパッタソース |
JP4244991B2 (ja) * | 2005-12-26 | 2009-03-25 | トヨタ自動車株式会社 | ハイブリッド自動車 |
US20080047831A1 (en) | 2006-08-24 | 2008-02-28 | Hendryk Richert | Segmented/modular magnet bars for sputtering target |
US8016982B2 (en) * | 2007-11-30 | 2011-09-13 | Panasonic Corporation | Sputtering apparatus and sputtering method |
CN101545094B (zh) * | 2008-03-28 | 2013-02-20 | 应用材料公司 | 具有辅助边缘磁体的矩形磁控管 |
US20100044222A1 (en) | 2008-08-21 | 2010-02-25 | Guardian Industries Corp., | Sputtering target including magnetic field uniformity enhancing sputtering target backing tube |
TW201030168A (en) | 2009-02-03 | 2010-08-16 | Wintek Corp | Magnetron sputtering cathode |
US20100200395A1 (en) * | 2009-02-06 | 2010-08-12 | Anton Dietrich | Techniques for depositing transparent conductive oxide coatings using dual C-MAG sputter apparatuses |
US20100300877A1 (en) | 2009-06-02 | 2010-12-02 | Applied Materials, Inc. | High utilization rotatable target using ceramic titanium oxide ring |
WO2011056581A2 (en) * | 2009-10-26 | 2011-05-12 | General Plasma, Inc. | Rotary magnetron magnet bar and apparatus containing the same for high target utilization |
WO2012094566A2 (en) | 2011-01-06 | 2012-07-12 | Sputtering Components, Inc. | Sputtering apparatus |
-
2013
- 2013-09-03 KR KR1020157005529A patent/KR102101720B1/ko active IP Right Grant
- 2013-09-03 WO PCT/US2013/057802 patent/WO2014039426A1/en active Application Filing
- 2013-09-03 US US14/016,693 patent/US9758862B2/en active Active
- 2013-09-03 JP JP2015530133A patent/JP2015530482A/ja active Pending
- 2013-09-03 PL PL13834622T patent/PL2880196T3/pl unknown
- 2013-09-03 CN CN201380046219.9A patent/CN104812934B/zh active Active
- 2013-09-03 EP EP13834622.6A patent/EP2880196B1/en active Active
- 2013-09-03 TW TW102131641A patent/TWI598454B/zh active
-
2019
- 2019-09-06 JP JP2019162610A patent/JP6870045B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP6870045B2 (ja) | 2021-05-12 |
JP2020015983A (ja) | 2020-01-30 |
US9758862B2 (en) | 2017-09-12 |
CN104812934A (zh) | 2015-07-29 |
EP2880196B1 (en) | 2020-05-20 |
TWI598454B (zh) | 2017-09-11 |
KR20150048142A (ko) | 2015-05-06 |
WO2014039426A1 (en) | 2014-03-13 |
JP2015530482A (ja) | 2015-10-15 |
EP2880196A4 (en) | 2016-03-30 |
US20140061029A1 (en) | 2014-03-06 |
KR102101720B1 (ko) | 2020-04-21 |
CN104812934B (zh) | 2017-04-26 |
EP2880196A1 (en) | 2015-06-10 |
TW201416474A (zh) | 2014-05-01 |
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