PL2465150T3 - Metoda hermetyzacji układu elektronicznego - Google Patents

Metoda hermetyzacji układu elektronicznego

Info

Publication number
PL2465150T3
PL2465150T3 PL10739598T PL10739598T PL2465150T3 PL 2465150 T3 PL2465150 T3 PL 2465150T3 PL 10739598 T PL10739598 T PL 10739598T PL 10739598 T PL10739598 T PL 10739598T PL 2465150 T3 PL2465150 T3 PL 2465150T3
Authority
PL
Poland
Prior art keywords
encapsulating
electronic arrangement
electronic
arrangement
Prior art date
Application number
PL10739598T
Other languages
English (en)
Inventor
Alexander Steen
Thorsten Krawinkel
KLAUS KEITE-TELGENBüSCHER
Jan Ellinger
Original Assignee
Tesa Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tesa Se filed Critical Tesa Se
Publication of PL2465150T3 publication Critical patent/PL2465150T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C09J153/025—Vinyl aromatic monomers and conjugated dienes modified
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electroluminescent Light Sources (AREA)
  • Adhesive Tapes (AREA)
PL10739598T 2009-08-12 2010-07-30 Metoda hermetyzacji układu elektronicznego PL2465150T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009036968A DE102009036968A1 (de) 2009-08-12 2009-08-12 Verfahren zur Kapselung einer elektronischen Anordnung
PCT/EP2010/061090 WO2011018356A1 (de) 2009-08-12 2010-07-30 Verfahren zur kapselung einer elektronischen anordnung
EP10739598.0A EP2465150B1 (de) 2009-08-12 2010-07-30 Verfahren zur kapselung einer elektronischen anordnung

Publications (1)

Publication Number Publication Date
PL2465150T3 true PL2465150T3 (pl) 2015-02-27

Family

ID=42937679

Family Applications (1)

Application Number Title Priority Date Filing Date
PL10739598T PL2465150T3 (pl) 2009-08-12 2010-07-30 Metoda hermetyzacji układu elektronicznego

Country Status (9)

Country Link
US (1) US8557084B2 (pl)
EP (1) EP2465150B1 (pl)
JP (1) JP5725671B2 (pl)
KR (1) KR101769930B1 (pl)
CN (1) CN102576821B (pl)
DE (1) DE102009036968A1 (pl)
PL (1) PL2465150T3 (pl)
TW (1) TWI482831B (pl)
WO (1) WO2011018356A1 (pl)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010043866A1 (de) 2010-11-12 2012-05-16 Tesa Se Klebmasse und Verfahren zur Kapselung einer elektronischen Anordnung
DE102010043871A1 (de) * 2010-11-12 2012-05-16 Tesa Se Klebmasse und Verfahren zur Kapselung einer elektronischen Anordnung
DE102011084276B4 (de) * 2011-10-11 2019-10-10 Osram Oled Gmbh Verkapselung für ein organisches elektronisches bauelement, ein organisches elektronisches bauelement mit der verkapselung und ein verfahren zur herstellung eines organischen elektronischen bauelements mit der verkapselung
DE102011089566A1 (de) 2011-12-22 2013-06-27 Tesa Se Liner zum Schutz von Klebemassen
DE102011089565A1 (de) 2011-12-22 2013-06-27 Tesa Se Liner zum Schutz von Klebemassen
CN104106148A (zh) * 2012-02-10 2014-10-15 阿科玛股份有限公司 用于柔性薄膜光伏和发光二极管装置的耐候复合物
JP5949054B2 (ja) * 2012-03-30 2016-07-06 大日本印刷株式会社 有機エレクトロルミネッセンス素子形成用フレキシブル基板ロール
DE102012206265A1 (de) * 2012-04-17 2013-10-17 Tesa Se Temperaturstabile vernetzbare Klebemasse mit Hart- und Weichblöcken
DE102012206273A1 (de) 2012-04-17 2013-10-17 Tesa Se Vernetzbare Klebmasse mit Hart- und Weichblöcken als Permeantenbarriere
DE102012211335A1 (de) * 2012-06-29 2014-01-02 Tesa Se Klebeband für die Kapselung einer organischen elektronischen Anordnung
JP5895762B2 (ja) * 2012-07-27 2016-03-30 コニカミノルタ株式会社 有機エレクトロルミネッセンス素子および有機エレクトロルミネッセンスパネルの封止方法
DE102012224319A1 (de) 2012-12-21 2014-06-26 Tesa Se Verfahren zum Entfernen von Permeaten aus Flächengebilden
DE102013202473A1 (de) 2013-02-15 2014-08-21 Tesa Se Verfahren zum Entfernen von Permeaten aus Flächengebilden
TW201436855A (zh) 2012-12-21 2014-10-01 Tesa Se 從平面結構物移除滲透物的方法
US10971277B2 (en) * 2013-02-15 2021-04-06 Cambrios Film Solutions Corporation Methods to incorporate silver nanowire-based transparent conductors in electronic devices
TWI647109B (zh) * 2013-05-21 2019-01-11 Ｌｇ化學股份有限公司 包封膜以及使用彼來包封有機電子裝置之方法
KR101816332B1 (ko) 2013-06-28 2018-01-08 주식회사 엘지화학 광학용 점착 필름, 광학용 점착 필름의 제조 방법 및 이를 포함하는 터치 스크린 패널
JP6460344B2 (ja) 2013-09-24 2019-01-30 エルジー・ケム・リミテッド 粘着性組成物
DE102013223451A1 (de) 2013-11-18 2015-05-21 Tesa Se Verfahren zur Trocknung von Klebemassen
DE102014200948A1 (de) 2014-01-20 2015-07-23 Tesa Se Verfahren zum Entfernen von Permeaten aus Flächengebilden
DE102014207792A1 (de) 2014-04-25 2015-10-29 Tesa Se Dünnglasverbund und Verfahren zum Lagern einer Dünnglasfolie
CN107148458A (zh) * 2014-10-29 2017-09-08 德莎欧洲公司 包含可活化的吸气剂材料的胶粘剂混合物
EP3034548A1 (en) * 2014-12-18 2016-06-22 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Barrier film laminate comprising submicron getter particles and electronic device comprising such a laminate
JP6446280B2 (ja) * 2015-01-28 2018-12-26 日立オートモティブシステムズ株式会社 電子装置
US10074827B2 (en) 2015-02-04 2018-09-11 Lg Chem, Ltd. Encapsulation film
DE102016213911A1 (de) 2016-07-28 2018-02-01 Tesa Se OLED kompatible Klebemassen mit cyclischen Azasilanwasserfängern
PT3516710T (pt) 2016-09-20 2023-07-20 Inuru Gmbh Camada de barreira eletroativa limitadora da difusão para um componente optoeletrónico
JP2020502777A (ja) 2016-09-27 2020-01-23 イヌル ゲーエムベーハー 電子機器の非破壊での統合
US9960389B1 (en) 2017-05-05 2018-05-01 3M Innovative Properties Company Polymeric films and display devices containing such films
JP6817145B2 (ja) * 2017-05-29 2021-01-20 エルジー ディスプレイ カンパニー リミテッド 有機電界発光装置および有機電界発光装置の製造方法
DE102017219310A1 (de) 2017-10-27 2019-05-02 Tesa Se Plasmarandverkapselung von Klebebändern
DE102018208168A1 (de) 2018-05-24 2019-11-28 Tesa Se Kombination einer transparenten vollflächigen Verkapselung mit einer (intransparenten) Randverkapselung mit hohem Gettergehalt
CN112424245A (zh) 2018-07-12 2021-02-26 3M创新有限公司 包含苯乙烯-异丁烯嵌段共聚物和烯键式不饱和单体的组合物
CN110118989B (zh) * 2019-04-19 2020-08-14 西北核技术研究所 基于光学渡越辐射的皮秒级脉冲电子束测量装置和方法
DE102020207783A1 (de) 2020-06-23 2021-12-23 Tesa Se Leitfähiger doppelseitiger Haftklebestreifen
CN111978884A (zh) * 2020-08-12 2020-11-24 芜湖徽氏新材料科技有限公司 一种耐电解液的超薄胶粘带及其制备方法
DE102023200132A1 (de) 2022-05-04 2023-11-09 Carl Zeiss Smt Gmbh Einrichtung zur Entfernung von gasförmigen Kontaminationen und Vorrichtung, insbesondere Lithographiesystem, mit einer solchen Einrichtung

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4051195A (en) 1975-12-15 1977-09-27 Celanese Polymer Specialties Company Polyepoxide-polyacrylate ester compositions
GB1552046A (en) 1977-02-02 1979-09-05 Ciba Geigy Ag Film adhesives
US5304419A (en) * 1990-07-06 1994-04-19 Alpha Fry Ltd Moisture and particle getter for enclosures
WO1998021287A1 (en) 1996-11-12 1998-05-22 Minnesota Mining And Manufacturing Company Thermosettable pressure sensitive adhesive
US6294270B1 (en) * 1998-12-23 2001-09-25 3M Innovative Properties Company Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer
JP3807139B2 (ja) 1999-02-26 2006-08-09 日立化成工業株式会社 電気・電子部品の製造方法
WO2001092344A2 (en) * 2000-06-01 2001-12-06 Kraton Polymers Research, B.V. Compositions comprising a functionalized block copolymer crosslinked with aluminum acetylacetonate
DE10048059A1 (de) 2000-09-28 2002-04-18 Henkel Kgaa Klebstoff mit Barriereeigenschaften
DE10123291A1 (de) * 2001-05-12 2002-11-28 Tesa Ag Klebefolienstreifen
EP1412409A1 (en) 2001-08-03 2004-04-28 Dsm N.V. Curable compositions for display devices
US6936131B2 (en) 2002-01-31 2005-08-30 3M Innovative Properties Company Encapsulation of organic electronic devices using adsorbent loaded adhesives
JP2005533919A (ja) 2002-07-24 2005-11-10 アドヒーシブズ・リサーチ・インコーポレイテッド 形態変化可能な感圧接着剤テープ、およびそのディスプレイスクリーンにおける使用
DE10361540A1 (de) * 2003-12-23 2005-07-28 Tesa Ag Chemisch vernetzbare, durch Zug in Richtung der Verklebungsebene lösbare Klebestreifen
DE102004031188A1 (de) * 2004-06-28 2006-01-19 Tesa Ag Hitzeaktivierbares Klebeband für die Verklebung von elektronischen Bauteilen und Leiterbahnen
DE102004031189A1 (de) * 2004-06-28 2006-01-19 Tesa Ag Hitzeaktivierbares und vernetzbares Klebeband für die Verklebung von elektronischen Bauteilen und Leiterbahnen
US20070135552A1 (en) 2005-12-09 2007-06-14 General Atomics Gas barrier
JP2007186649A (ja) * 2006-01-16 2007-07-26 Panac Co Ltd ヒートシール性自己粘着シート
JP2007197517A (ja) 2006-01-24 2007-08-09 Three M Innovative Properties Co 接着性封止組成物、封止フィルム及び有機ｅｌ素子
JP2007297503A (ja) * 2006-04-28 2007-11-15 Shin Etsu Polymer Co Ltd 接着剤組成物及びこれを用いて得られる複合部材
DE102006023936A1 (de) * 2006-05-19 2007-11-22 Tesa Ag Maskierung von Fensterflanschen mit einem Klebeband mit einer Selbstklebemasse auf Basis vernetzter Vinylaromatenblockcopolymere
DE102006037627A1 (de) 2006-08-10 2008-02-14 Tesa Ag Selbstklebemasse aus hydrierten Blockcopolymeren und daraus hergestellte Schutzfolie für glatte und raue Oberflächen
DE102006047738A1 (de) * 2006-10-06 2008-04-10 Tesa Ag Hitzeaktivierbares Klebeband insbesondere für die Verklebung von elektronischen Bauteilen und Leiterbahnen
JP2009149829A (ja) * 2007-11-28 2009-07-09 Shin Etsu Chem Co Ltd 難燃性接着剤組成物ならびにそれを用いたカバーレイフィルムおよび接着シート
JP5008536B2 (ja) * 2007-11-28 2012-08-22 信越化学工業株式会社 接着剤組成物ならびにそれを用いたカバーレイフィルムおよび接着シート
DE102008047964A1 (de) 2008-09-18 2010-03-25 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung

Also Published As

Publication number Publication date
CN102576821B (zh) 2015-06-10
EP2465150A1 (de) 2012-06-20
US20110036496A1 (en) 2011-02-17
WO2011018356A1 (de) 2011-02-17
KR20120062766A (ko) 2012-06-14
TWI482831B (zh) 2015-05-01
EP2465150B1 (de) 2014-10-22
CN102576821A (zh) 2012-07-11
JP5725671B2 (ja) 2015-05-27
KR101769930B1 (ko) 2017-08-21
TW201132727A (en) 2011-10-01
DE102009036968A1 (de) 2011-02-17
JP2013502027A (ja) 2013-01-17
US8557084B2 (en) 2013-10-15

Similar Documents

Publication Publication Date Title
PL2465149T3 (pl) Sposób hermetyzacji układu elektronicznego
PL2465150T3 (pl) Metoda hermetyzacji układu elektronicznego
PL2279537T3 (pl) Metoda hermetyzacji układu elektronicznego
HK1161504A1 (zh) 用於製造電子設備外殼的方法
EP2490411A4 (en) ELECTRONIC DEVICE
EP2453040A4 (en) METHOD FOR MANUFACTURING SHAPED CIRCUIT COMPONENT
GB0905140D0 (en) Method
GB0902476D0 (en) Method
EP2438610A4 (en) Encapsulation method and structure for electronic equipment
EP2589938A4 (en) METHOD OF CALIBRATING A FIXED ELECTRONIC SCALE OF LARGE SIZE
EP2421099A4 (en) ELECTRONIC DEVICE
PL2649642T3 (pl) Masa klejąca i metoda hermetyzacji układu elektronicznego
PT2652812T (pt) Processo de fabrico de um dispositivo oled
TWI373057B (en) Electronic apparatus
EP2431837A4 (en) ELECTRONIC DEVICE
GB0901444D0 (en) Method
PL2447835T3 (pl) Sposób konfiguracji jednostki elektronicznej
GB0905367D0 (en) Method
GB0903316D0 (en) Method
SI2341471T1 (sl) Postopek za izdelavo elektronskih kartic
GB0908770D0 (en) Method
GB2476209B (en) Encapsulation method
GB0902034D0 (en) Method
GB0900560D0 (en) Method
EP2474876A4 (en) ELECTRONIC DEVICE