Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B22—CASTING; POWDER METALLURGY
  • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
  • B22D19/00—Casting in, on, or around objects which form part of the product
  • B22D19/04—Casting in, on, or around objects which form part of the product for joining parts
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B22—CASTING; POWDER METALLURGY
  • B22C—FOUNDRY MOULDING
  • B22C21/00—Flasks; Accessories therefor
  • B22C21/12—Accessories
  • B22C21/14—Accessories for reinforcing or securing moulding materials or cores, e.g. gaggers, chaplets, pins, bars
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B22—CASTING; POWDER METALLURGY
  • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
  • B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
  • B22D17/20—Accessories: Details
  • B22D17/22—Dies; Die plates; Die supports; Cooling equipment for dies; Accessories for loosening and ejecting castings from dies
  • B22D17/24—Accessories for locating and holding cores or inserts
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B22—CASTING; POWDER METALLURGY
  • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
  • B22D19/00—Casting in, on, or around objects which form part of the product
  • B22D19/0081—Casting in, on, or around objects which form part of the product pretreatment of the insert, e.g. for enhancing the bonding between insert and surrounding cast metal
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N30/00—Piezoelectric or electrostrictive devices
  • H10N30/01—Manufacture or treatment
  • H10N30/02—Forming enclosures or casings
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N30/00—Piezoelectric or electrostrictive devices
  • H10N30/80—Constructional details
  • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
  • H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N30/00—Piezoelectric or electrostrictive devices
  • H10N30/80—Constructional details
  • H10N30/88—Mounts; Supports; Enclosures; Casings
  • H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings

Landscapes

• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Manufacturing & Machinery (AREA)
• Casting Or Compression Moulding Of Plastics Or The Like (AREA)
• Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
• Injection Moulding Of Plastics Or The Like (AREA)
• Molds, Cores, And Manufacturing Methods Thereof (AREA)

Applications Claiming Priority (3)

Publications (1)

Family

ID=41202267

Family Applications (1)

Country Status (4)

Families Citing this family (6)

Family Cites Families (8)

• 2009
  • 2009-08-07 PL PL09010220T patent/PL2151875T3/pl unknown
  • 2009-08-07 EP EP09010220.3A patent/EP2151875B1/de active Active
  • 2009-08-07 ES ES09010220.3T patent/ES2522322T3/es active Active
  • 2009-08-07 DE DE102009036549A patent/DE102009036549A1/de not_active Withdrawn

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