PH12015501577A1 - Silicone rubber composition for adhering semiconductor chip - Google Patents

Silicone rubber composition for adhering semiconductor chip

Info

Publication number
PH12015501577A1
PH12015501577A1 PH12015501577A PH12015501577A PH12015501577A1 PH 12015501577 A1 PH12015501577 A1 PH 12015501577A1 PH 12015501577 A PH12015501577 A PH 12015501577A PH 12015501577 A PH12015501577 A PH 12015501577A PH 12015501577 A1 PH12015501577 A1 PH 12015501577A1
Authority
PH
Philippines
Prior art keywords
semiconductor chip
rubber composition
silicone rubber
adhering
die
Prior art date
Application number
PH12015501577A
Other versions
PH12015501577B1 (en
Inventor
Choi Sung Hwan
Yoo Jang Hyun
Lee Jun Yong
Lee Seung Hwan
Choi Geun Mook
Original Assignee
Kcc Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kcc Corp filed Critical Kcc Corp
Publication of PH12015501577A1 publication Critical patent/PH12015501577A1/en
Publication of PH12015501577B1 publication Critical patent/PH12015501577B1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/005—Stabilisers against oxidation, heat, light, ozone
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C09J183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Inorganic Chemistry (AREA)

Abstract

The present invention relates to a silicone rubber composition for adhering a semiconductor chip (die) onto an SR-substrate and, more specifically, to a silicone rubber composition for adhering a semiconductor chip (die) which has improved reliability and adhesiveness by comprising a silicone resin having a vinyl group, hydrogenpolysiloxane, a tackifier, spherical silicone particles having a specific reactive functional group, an inorganic silica filler, a hydrosilylation reaction catalyst, and a reaction retardant.
PH12015501577A 2013-01-29 2015-07-16 Silicone rubber composition for adhering semiconductor chip PH12015501577B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20130009605 2013-01-29
PCT/KR2014/000858 WO2014119930A1 (en) 2013-01-29 2014-01-29 Silicone rubber composition for adhering semiconductor chip

Publications (2)

Publication Number Publication Date
PH12015501577A1 true PH12015501577A1 (en) 2015-10-05
PH12015501577B1 PH12015501577B1 (en) 2015-10-05

Family

ID=51262580

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12015501577A PH12015501577B1 (en) 2013-01-29 2015-07-16 Silicone rubber composition for adhering semiconductor chip

Country Status (4)

Country Link
KR (1) KR101733529B1 (en)
CN (1) CN104968747B (en)
PH (1) PH12015501577B1 (en)
WO (1) WO2014119930A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI663236B (en) 2014-10-16 2019-06-21 Dow Silicones Corporation Silicone composition and a pressure sensitive adhesive film having a pressure sensitive adhesive layer made from the composition
TW201625754A (en) * 2014-11-21 2016-07-16 艾倫塔斯有限公司 Single-component, storage-stable, curable silicone composition
CN106317894B (en) * 2015-06-30 2019-03-29 比亚迪股份有限公司 Silicon composition, reflecting coating and preparation method thereof and the photovoltaic module including it
KR20170047540A (en) * 2015-10-23 2017-05-08 동우 화인켐 주식회사 Silicone adhesive composition
WO2020116127A1 (en) * 2018-12-07 2020-06-11 信越化学工業株式会社 Ultraviolet curable silicone adhesive composition and cured product of same
JP7427542B2 (en) * 2020-06-15 2024-02-05 信越化学工業株式会社 Silicone rubber sponge composition and its manufacturing method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6124407A (en) * 1998-10-28 2000-09-26 Dow Corning Corporation Silicone composition, method for the preparation thereof, and silicone elastomer
JP2001019928A (en) * 1999-07-08 2001-01-23 Dow Corning Toray Silicone Co Ltd Adhesive and semiconductor apparatus
JP2001019936A (en) * 1999-07-08 2001-01-23 Dow Corning Toray Silicone Co Ltd Adhesive and semiconductor device
US6121368A (en) * 1999-09-07 2000-09-19 Dow Corning Corporation Silicone composition and silicone pressure sensitive adhesive formed therefrom
JP5445415B2 (en) * 2010-09-21 2014-03-19 信越化学工業株式会社 Thermally conductive silicone adhesive composition and thermally conductive silicone elastomer molded article
CN102174309B (en) * 2011-01-13 2014-08-13 深圳市森日有机硅材料有限公司 Solvent-free organic silicon pressure-sensitive adhesive and preparation method thereof

Also Published As

Publication number Publication date
KR101733529B1 (en) 2017-05-08
WO2014119930A1 (en) 2014-08-07
CN104968747B (en) 2017-03-08
KR20150105636A (en) 2015-09-17
CN104968747A (en) 2015-10-07
PH12015501577B1 (en) 2015-10-05

Similar Documents

Publication Publication Date Title
PH12015501577B1 (en) Silicone rubber composition for adhering semiconductor chip
SG10201506094PA (en) Functional Particle, Functional Particle Group, Filler, Resin Composition for Electronic Component, Electronic Component and Semiconductor Device
EP2857457A4 (en) Curable resin composition, and cured product, sealing agent, and optical semiconductor device using same
EP3121236A4 (en) Curable silicon rubber composition for led packaging
WO2011090362A3 (en) Silicone resin
EP2537899A4 (en) Phosphor-containing cured silicone, process for production of same, phosphor-containing silicone composition, precursor of the composition, sheet-shaped moldings, led package, light -emitting device, and process for production of led-mounted substrate
EP3015487A4 (en) Resin composition, resin sheet, cured resin sheet, resin sheet structure, cured resin sheet structure, method for producing cured resin sheet structure, semiconductor device, and led device
WO2014145482A3 (en) Bonding adhesive and adhered roofing systems prepared using the same
MX2014004595A (en) Adhesive substance, in particular for encapsulating an electronic assembly.
IL231051A0 (en) Resin composition containing plate-like inorganic compound and used for adhesives,and adhesive
SG11201602233PA (en) Thermally curable resin sheet for sealing semiconductor chip, and method for manufacturing semiconductor package
MY176228A (en) Epoxy resin composition, semiconductor sealing agent, and semiconductor device
TW201612231A (en) Epoxy resin composition for encapsulating semiconductor device and semiconductor package encapsulated using the same
SG11201406941TA (en) Film adhesive composition, method for producing the same, film adhesive, semiconductor package using the film adhesive, and method for manufacturing the semiconductor package
EP2957599A4 (en) Curable resin composition, cured product, sealing member semiconductor device
MX2017008266A (en) Epoxy resin composition.
EP3020750A4 (en) Adhesiveness-imparting agent, adhesive polyorganosiloxane composition, and optical semiconductor device
MY156659A (en) Resin composition for encapsulating semiconductor and semiconductor device
MY184495A (en) Tooth whitening composition
EP2784808B8 (en) Electrical component resin, semiconductor device, and substrate
PH12016501725A1 (en) A single crystal alumina filled die attach paste
MX361860B (en) Hot melt adhesive.
EP2887390A4 (en) Easily deformable aggregates and process for producing same, thermally conductive resin composition, thermally conductive member and process for producing same, and thermally conductive adhesion sheet
SG11201701032XA (en) Film-like adhesive, semiconductor package using film-like adhesive, and method for producing the same
SG11201705967TA (en) Paste-like adhesive composition, semiconductor device, method for manufacturing semiconductor device, and method for bonding heatsink