PH12015500100A1 - Mold release film - Google Patents
Mold release filmInfo
- Publication number
- PH12015500100A1 PH12015500100A1 PH12015500100A PH12015500100A PH12015500100A1 PH 12015500100 A1 PH12015500100 A1 PH 12015500100A1 PH 12015500100 A PH12015500100 A PH 12015500100A PH 12015500100 A PH12015500100 A PH 12015500100A PH 12015500100 A1 PH12015500100 A1 PH 12015500100A1
- Authority
- PH
- Philippines
- Prior art keywords
- mold release
- release film
- test piece
- measurement
- base layer
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
- C09J7/405—Adhesives in the form of films or foils characterised by release liners characterised by the substrate of the release liner
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/24—All layers being polymeric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/51—Elastic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/54—Yield strength; Tensile strength
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/748—Releasability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/006—Presence of polyolefin in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2425/00—Presence of styrenic polymer
- C09J2425/005—Presence of styrenic polymer in the release coating
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2425/00—Presence of styrenic polymer
- C09J2425/006—Presence of styrenic polymer in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention provides a mold release film having both mold release properties and embedding performance. The mold release film (1) according to the present invention comprises: a base layer (2) which comprises a polyolefin resin and a polystyrene resin having a syndiotactic structure; and a first mold release layer (3) which is arranged on the upper surface of the base layer (2) and is composed of a resin material containing a polystyrene resin having a syndiotactic structure as the main component. The mold release film (1) has a tensile storage elastic modulus (E') of 1.0 x 106 to 5.0 x 108 Pa at 120oC and 1.0 x 107 to 1.0 x 109 Pa at 170oC as measured by a test method in accordance with JIS K 7244 under such conditions that the length of a test piece is 40 mm, the width of the test piece is 4 mm, the length of the test piece between clamps is 20 mm, the measurement starting temperature is 25oC, the measurement termination temperature is 250oC, the temperature rising rate is 5oC/min, and the measurement frequency is 1 Hz.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012158584A JP5895755B2 (en) | 2012-07-17 | 2012-07-17 | Release film |
PCT/JP2013/068396 WO2014013884A1 (en) | 2012-07-17 | 2013-07-04 | Mold release film |
Publications (1)
Publication Number | Publication Date |
---|---|
PH12015500100A1 true PH12015500100A1 (en) | 2015-03-02 |
Family
ID=49948714
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PH12015500100A PH12015500100A1 (en) | 2012-07-17 | 2015-01-14 | Mold release film |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP5895755B2 (en) |
KR (1) | KR20150035596A (en) |
CN (1) | CN104507680B (en) |
PH (1) | PH12015500100A1 (en) |
TW (1) | TWI554375B (en) |
WO (1) | WO2014013884A1 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6398221B2 (en) * | 2014-02-26 | 2018-10-03 | 住友ベークライト株式会社 | Release film for producing resin-encapsulated semiconductor device, method for producing release film for producing resin-encapsulated semiconductor device, and method for producing resin-encapsulated semiconductor device |
JP6303727B2 (en) * | 2014-03-31 | 2018-04-04 | 住友ベークライト株式会社 | Release film |
JP6467800B2 (en) * | 2014-07-30 | 2019-02-13 | 住友ベークライト株式会社 | Release film |
JP6648400B2 (en) * | 2014-11-10 | 2020-02-14 | 凸版印刷株式会社 | Terminal resin film, tab and power storage device using the same |
WO2018173683A1 (en) * | 2017-03-22 | 2018-09-27 | 住友ベークライト株式会社 | Mold release film and method for producing flexible printed circuit board |
JP7268057B2 (en) * | 2018-12-28 | 2023-05-02 | 株式会社クラレ | Base film for decorative film and decorative film containing the same |
JP7281381B2 (en) * | 2019-10-04 | 2023-05-25 | 出光興産株式会社 | Resin laminate for low dielectric materials |
JP6870775B1 (en) * | 2020-10-21 | 2021-05-12 | 住友ベークライト株式会社 | Manufacturing method of release film and molded product |
CN113924825B (en) * | 2020-10-21 | 2022-10-25 | 住友电木株式会社 | Release film and method for producing molded article |
CN114080866B (en) * | 2020-10-21 | 2022-09-16 | 住友电木株式会社 | Release film and method for producing molded article |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001161747A (en) * | 1999-12-08 | 2001-06-19 | Kao Corp | Absorptive article |
JP2004082502A (en) * | 2002-08-27 | 2004-03-18 | Mitsubishi Plastics Ind Ltd | Release film |
US20100204405A1 (en) * | 2007-07-31 | 2010-08-12 | Sumitomo Bakelite Co., Ltd. | Release film |
JP5272589B2 (en) * | 2008-09-01 | 2013-08-28 | 住友ベークライト株式会社 | Release film |
JP5353217B2 (en) * | 2008-12-11 | 2013-11-27 | 住友ベークライト株式会社 | Release film, adhesion method using the same, and circuit board manufacturing method |
TWI451959B (en) * | 2009-10-19 | 2014-09-11 | Kureha Corp | Solvent release film and laminates made of polyphenylene sulfide resin |
JP2011088287A (en) * | 2009-10-20 | 2011-05-06 | Pilot Ink Co Ltd | Multi-lead writing utensil |
JP2011088387A (en) * | 2009-10-23 | 2011-05-06 | Idemitsu Kosan Co Ltd | Laminate for manufacturing flexible printed board |
KR101745038B1 (en) * | 2010-02-09 | 2017-06-08 | 스미또모 베이크라이트 가부시키가이샤 | Laminated film |
JP5557152B2 (en) * | 2010-02-09 | 2014-07-23 | 住友ベークライト株式会社 | Laminated film |
JP5488809B2 (en) * | 2010-02-09 | 2014-05-14 | 住友ベークライト株式会社 | Laminated film |
JP4918181B2 (en) * | 2010-06-02 | 2012-04-18 | 三井化学東セロ株式会社 | SEMICONDUCTOR WAFER SURFACE PROTECTION SHEET, SEMICONDUCTOR WAFER PROTECTION METHOD USING THE SAME, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD |
-
2012
- 2012-07-17 JP JP2012158584A patent/JP5895755B2/en not_active Expired - Fee Related
-
2013
- 2013-07-04 CN CN201380037570.1A patent/CN104507680B/en not_active Expired - Fee Related
- 2013-07-04 WO PCT/JP2013/068396 patent/WO2014013884A1/en active Application Filing
- 2013-07-04 KR KR20147034756A patent/KR20150035596A/en not_active Application Discontinuation
- 2013-07-10 TW TW102124740A patent/TWI554375B/en not_active IP Right Cessation
-
2015
- 2015-01-14 PH PH12015500100A patent/PH12015500100A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN104507680A (en) | 2015-04-08 |
KR20150035596A (en) | 2015-04-06 |
JP5895755B2 (en) | 2016-03-30 |
CN104507680B (en) | 2016-10-19 |
WO2014013884A1 (en) | 2014-01-23 |
TW201406518A (en) | 2014-02-16 |
JP2014019017A (en) | 2014-02-03 |
TWI554375B (en) | 2016-10-21 |
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