NO960419D0 - Pakning for elektronisk komponent, samt framgangsmåte for framstilling av samme - Google Patents

Pakning for elektronisk komponent, samt framgangsmåte for framstilling av samme

Info

Publication number
NO960419D0
NO960419D0 NO960419A NO960419A NO960419D0 NO 960419 D0 NO960419 D0 NO 960419D0 NO 960419 A NO960419 A NO 960419A NO 960419 A NO960419 A NO 960419A NO 960419 D0 NO960419 D0 NO 960419D0
Authority
NO
Norway
Prior art keywords
manufacturing
well
same
electronic component
component gasket
Prior art date
Application number
NO960419A
Other languages
English (en)
Other versions
NO960419L (no
Inventor
Victor J Adams
David J Dougherty
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of NO960419D0 publication Critical patent/NO960419D0/no
Publication of NO960419L publication Critical patent/NO960419L/no

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
NO960419A 1995-03-23 1996-02-01 Pakning for elektronisk komponent, samt framgangsmåte for framstilling av samme NO960419L (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/409,130 US5659950A (en) 1995-03-23 1995-03-23 Method of forming a package assembly

Publications (2)

Publication Number Publication Date
NO960419D0 true NO960419D0 (no) 1996-02-01
NO960419L NO960419L (no) 1996-09-24

Family

ID=23619175

Family Applications (1)

Application Number Title Priority Date Filing Date
NO960419A NO960419L (no) 1995-03-23 1996-02-01 Pakning for elektronisk komponent, samt framgangsmåte for framstilling av samme

Country Status (4)

Country Link
US (1) US5659950A (no)
EP (1) EP0733906A1 (no)
JP (1) JP3725607B2 (no)
NO (1) NO960419L (no)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE59402033D1 (de) * 1993-09-30 1997-04-17 Siemens Ag Zweipoliges SMT-Miniatur-Gehäuse für Halbleiterbauelemente und Verfahren zu dessen Herstellung
US6911727B1 (en) * 1995-06-06 2005-06-28 Analog Devices, Inc. Package for sealing an integrated circuit die
JP2001518692A (ja) 1997-07-29 2001-10-16 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー オッフェネ ハンデルスゲゼルシャフト 光電素子
KR19990035575A (ko) * 1997-10-31 1999-05-15 윤종용 쇼트 리드형 반도체 패키지의 리드 프레임
US5889658A (en) * 1997-11-25 1999-03-30 Motorola, Inc. Package assembly for an electronic component
US5867367A (en) * 1997-12-04 1999-02-02 Intel Corporation Quad flat pack integrated circuit package
US6362426B1 (en) * 1998-01-09 2002-03-26 Micron Technology, Inc. Radiused leadframe
US6929485B1 (en) * 2004-03-16 2005-08-16 Agilent Technologies, Inc. Lead frame with interdigitated pins
US7602054B2 (en) * 2005-10-05 2009-10-13 Semiconductor Components Industries, L.L.C. Method of forming a molded array package device having an exposed tab and structure
US8169081B1 (en) 2007-12-27 2012-05-01 Volterra Semiconductor Corporation Conductive routings in integrated circuits using under bump metallization
US8947887B2 (en) 2009-02-23 2015-02-03 Freescale Semiconductor, Inc. Package assembly and method of tuning a natural resonant frequency of a package
US8587099B1 (en) * 2012-05-02 2013-11-19 Texas Instruments Incorporated Leadframe having selective planishing
ITTO20120854A1 (it) * 2012-09-28 2014-03-29 Stmicroelectronics Malta Ltd Contenitore a montaggio superficiale perfezionato per un dispositivo integrato a semiconduttori, relativo assemblaggio e procedimento di fabbricazione
US9235937B1 (en) 2013-06-05 2016-01-12 Analog Devices, Inc. Mounting method for satellite crash sensors
US9287200B2 (en) * 2013-06-27 2016-03-15 Freescale Semiconductor, Inc. Packaged semiconductor device
EP3239665A1 (de) * 2016-04-25 2017-11-01 Weickmann & Weickmann PartmbB Sensorgehäuse

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1339660A (en) * 1971-11-20 1973-12-05 Ferranti Ltd Supports for semiconductor devices
US4809135A (en) * 1986-08-04 1989-02-28 General Electric Company Chip carrier and method of fabrication
JPS63129652A (ja) * 1986-11-20 1988-06-02 Toshiba Corp 半導体装置
US5118298A (en) * 1991-04-04 1992-06-02 Advanced Interconnections Corporation Through hole mounting of integrated circuit adapter leads
US5088930A (en) * 1990-11-20 1992-02-18 Advanced Interconnections Corporation Integrated circuit socket with reed-shaped leads
US5233131A (en) * 1990-12-19 1993-08-03 Vlsi Technology, Inc. Integrated circuit die-to-leadframe interconnect assembly system
JP2982126B2 (ja) * 1991-03-20 1999-11-22 株式会社日立製作所 半導体装置およびその製造方法
US5263241A (en) * 1992-04-06 1993-11-23 Delco Electronics Corporation Apparatus useful in the manufacture of a pressure sensor assembly
US5311407A (en) * 1992-04-30 1994-05-10 Siemens Components, Inc. Printed circuit based for mounted semiconductors and other electronic components
US5352851A (en) * 1992-09-08 1994-10-04 Texas Instruments Incorporated Edge-mounted, surface-mount integrated circuit device
DE9309918U1 (de) * 1993-07-03 1993-12-02 Mannesmann Kienzle Gmbh, 78052 Villingen-Schwenningen Halter für Beschleunigungssensoren

Also Published As

Publication number Publication date
JP3725607B2 (ja) 2005-12-14
NO960419L (no) 1996-09-24
US5659950A (en) 1997-08-26
JPH08274247A (ja) 1996-10-18
EP0733906A1 (en) 1996-09-25

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