NO2699839T3 - - Google Patents
Info
- Publication number
- NO2699839T3 NO2699839T3 NO12774041A NO12774041A NO2699839T3 NO 2699839 T3 NO2699839 T3 NO 2699839T3 NO 12774041 A NO12774041 A NO 12774041A NO 12774041 A NO12774041 A NO 12774041A NO 2699839 T3 NO2699839 T3 NO 2699839T3
- Authority
- NO
- Norway
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
- F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
- F21S4/24—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of ribbon or tape form, e.g. LED tapes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V13/00—Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
- F21V13/12—Combinations of only three kinds of elements
- F21V13/14—Combinations of only three kinds of elements the elements being filters or photoluminescent elements, reflectors and refractors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V15/00—Protecting lighting devices from damage
- F21V15/01—Housings, e.g. material or assembling of housing parts
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
- F21V23/0435—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by remote control means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
- F21V3/08—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material comprising photoluminescent substances
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- G—PHYSICS
- G08—SIGNALLING
- G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
- G08B7/00—Signalling systems according to more than one of groups G08B3/00 - G08B6/00; Personal calling systems according to more than one of groups G08B3/00 - G08B6/00
- G08B7/06—Signalling systems according to more than one of groups G08B3/00 - G08B6/00; Personal calling systems according to more than one of groups G08B3/00 - G08B6/00 using electric transmission, e.g. involving audible and visible signalling through the use of sound and light sources
- G08B7/066—Signalling systems according to more than one of groups G08B3/00 - G08B6/00; Personal calling systems according to more than one of groups G08B3/00 - G08B6/00 using electric transmission, e.g. involving audible and visible signalling through the use of sound and light sources guiding along a path, e.g. evacuation path lighting strip
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1327—Moulding over PCB locally or completely
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
- Planar Illumination Modules (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20115371A FI20115371A0 (fi) | 2011-04-18 | 2011-04-18 | Valonauha ja valonauhajärjestelmä |
FI20115370A FI20115370A0 (fi) | 2011-04-18 | 2011-04-18 | Valonauha ja valonauhajärjestelmä |
PCT/FI2012/050380 WO2012143611A1 (en) | 2011-04-18 | 2012-04-18 | Illuminated stripe and illuminated stripe system |
Publications (1)
Publication Number | Publication Date |
---|---|
NO2699839T3 true NO2699839T3 (no) | 2018-05-19 |
Family
ID=47041090
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO12774041A NO2699839T3 (no) | 2011-04-18 | 2012-04-18 |
Country Status (10)
Country | Link |
---|---|
US (1) | US9228701B2 (no) |
EP (1) | EP2699839B1 (no) |
JP (1) | JP6072002B2 (no) |
KR (1) | KR20140030190A (no) |
CN (1) | CN103597272B (no) |
AU (1) | AU2012246147B2 (no) |
CA (1) | CA2831821C (no) |
NO (1) | NO2699839T3 (no) |
RU (1) | RU2605452C2 (no) |
WO (1) | WO2012143611A1 (no) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102272782B1 (ko) * | 2013-04-19 | 2021-07-08 | 코베스트로 엘엘씨 | 몰드 내 전자 인쇄 회로 기판 캡슐화 및 조립체 |
US9976710B2 (en) * | 2013-10-30 | 2018-05-22 | Lilibrand Llc | Flexible strip lighting apparatus and methods |
CN103807653A (zh) * | 2014-01-27 | 2014-05-21 | 浙江九阳光电有限公司 | 一种led照明灯条 |
DE102014104423B4 (de) * | 2014-03-28 | 2016-01-14 | Döllken-Weimar Gmbh | LED-Band und Verfahren zur Herstellung eines LED-Bandes |
EP2942558B1 (en) * | 2014-05-07 | 2017-10-25 | Shenzhen BSN Technology Co., Ltd. | Integral multi-functional waterproof flexible light strip |
CN105179984B (zh) * | 2014-06-18 | 2019-03-12 | 欧司朗有限公司 | 发光装置和制造发光装置的方法 |
EP3344912A1 (de) * | 2015-07-06 | 2018-07-11 | Hauser Elektronik GmbH | Verfahren zur herstellung eines led-lichtbandes |
WO2017039626A1 (en) * | 2015-08-31 | 2017-03-09 | Abb Technology Ltd. | Emergency lighting, evacuation, and rescue routing with power over-ethernet |
CN111108616B (zh) | 2016-03-08 | 2024-03-15 | 科鲁斯公司 | 具有透镜组件的照明*** |
AU2017343734B2 (en) * | 2016-10-12 | 2021-05-27 | Gerhard Kager | LED strip, method for producing an LED tape, and LED tape |
US11296057B2 (en) | 2017-01-27 | 2022-04-05 | EcoSense Lighting, Inc. | Lighting systems with high color rendering index and uniform planar illumination |
US20180328552A1 (en) | 2017-03-09 | 2018-11-15 | Lilibrand Llc | Fixtures and lighting accessories for lighting devices |
JP6788131B2 (ja) * | 2017-05-02 | 2020-11-18 | シグニファイ ホールディング ビー ヴィSignify Holding B.V. | Ledストリップの固定 |
FR3069800B1 (fr) * | 2017-08-03 | 2020-09-04 | Blachere Illumination | Procede et systeme de fabrication d'un decor lumineux |
WO2019213299A1 (en) | 2018-05-01 | 2019-11-07 | Lilibrand Llc | Lighting systems and devices with central silicone module |
EP3643143B1 (en) * | 2018-07-17 | 2020-09-23 | Lumileds Holding B.V. | Lighting device comprising leds and reflection element |
IT201800007711A1 (it) * | 2018-07-31 | 2020-01-31 | Teleco Automation Srl | Profilato perfezionato |
US11353200B2 (en) | 2018-12-17 | 2022-06-07 | Korrus, Inc. | Strip lighting system for direct input of high voltage driving power |
JP6589079B1 (ja) * | 2019-02-19 | 2019-10-09 | Fkk株式会社 | 照明装置 |
WO2022079345A1 (en) * | 2020-10-14 | 2022-04-21 | Glowway Oy Ltd | Strip forming a caution or warning stripe |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FI108106B (fi) * | 1996-11-25 | 2001-11-15 | Modular Technology Group Engin | Menetelmä johde-elementin valmistamiseksi ja johde-elementti |
US7401949B2 (en) * | 1999-08-11 | 2008-07-22 | I3 Ventures | Illuminated rub-rail/bumper assembly |
US6866394B1 (en) | 1999-10-04 | 2005-03-15 | Nicholas D. Hutchins | Modules for elongated lighting system |
JP2003511817A (ja) * | 1999-10-04 | 2003-03-25 | ハッチンス,ニコラス,ディー | 細長発光ダイオード照明システム |
US7186005B2 (en) * | 2001-10-18 | 2007-03-06 | Ilight Technologies, Inc. | Color-changing illumination device |
US7264366B2 (en) * | 2001-10-18 | 2007-09-04 | Ilight Technologies, Inc. | Illumination device for simulating neon or similar lighting using phosphorescent dye |
RU2245566C2 (ru) * | 2002-12-26 | 2005-01-27 | Молохин Илья Валерьевич | Светоотражающий разметочный материал |
US7048413B2 (en) * | 2003-08-14 | 2006-05-23 | Ben Fan | Light string using a cladding to scatter light from light emitting diodes to present a neon light effect |
WO2005079340A2 (en) * | 2004-02-13 | 2005-09-01 | Lacasse Photoplastics, Inc. | Intelligent directional fire alarm system |
US20050242711A1 (en) * | 2004-04-30 | 2005-11-03 | Joseph Bloomfield | Multi-color solid state light emitting device |
DE202005002425U1 (de) * | 2005-02-14 | 2005-04-21 | Fan, Ben, Hsitzu | Lichtschlauch |
CN2819337Y (zh) * | 2005-09-15 | 2006-09-20 | 沈阳宏宇光电子科技有限公司 | 智能疏散指示装置 |
KR101249238B1 (ko) * | 2005-12-16 | 2013-04-01 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 상호 접속가능한 조명 모듈을 포함하는 조명 시스템 |
US8567992B2 (en) * | 2006-09-12 | 2013-10-29 | Huizhou Light Engine Ltd. | Integrally formed light emitting diode light wire and uses thereof |
US8581393B2 (en) * | 2006-09-21 | 2013-11-12 | 3M Innovative Properties Company | Thermally conductive LED assembly |
US7864381B2 (en) * | 2007-03-20 | 2011-01-04 | Xerox Corporation | Document illuminator with LED-driven phosphor |
CN201053599Y (zh) * | 2007-06-07 | 2008-04-30 | 李志刚 | Led软灯条 |
CN201066055Y (zh) * | 2007-07-31 | 2008-05-28 | 钟德铧 | 长余辉led灯带 |
CN101465394B (zh) * | 2007-12-19 | 2011-11-09 | 富士迈半导体精密工业(上海)有限公司 | 发光二极管及发光二极管灯串 |
KR100957218B1 (ko) * | 2007-12-27 | 2010-05-11 | 삼성전기주식회사 | 발광 다이오드 유니트 |
JPWO2010013716A1 (ja) * | 2008-07-28 | 2012-01-12 | ミドリ安全株式会社 | 照明バンド、照明装置及びヘルメット |
CN101769451B (zh) * | 2008-12-29 | 2012-03-14 | 富准精密工业(深圳)有限公司 | 发光二极管灯具 |
DE102009008947A1 (de) * | 2009-02-13 | 2010-08-19 | Dagmar Bettina Kramer | Verfahren zur Herstellung einer LED-Leuchte |
JP2010214628A (ja) * | 2009-03-13 | 2010-09-30 | Teijin Ltd | 複合中空パイプおよびその製造方法 |
FI20095935A (fi) * | 2009-09-10 | 2011-03-11 | Marimils Oy | Valo-opaste ja valo-opastejärjestelmä |
EP2454520B1 (en) * | 2010-03-09 | 2015-01-28 | Tri-O-Light BV | Light strip |
IT1402856B1 (it) * | 2010-10-28 | 2013-09-27 | Posa S P A | Strisce di led incapsulate in guaine flessibili in elastomero siliconico vulcanizzabile a freddo, relativo processo di preparazione e loro uso come guarnizioni |
IT1403915B1 (it) * | 2011-02-04 | 2013-11-08 | Luxall S R L | Sorgenti luminose led, oled, el, incapsulate per coestrusione in un elastomero siliconico vulcanizzabile a freddo comprendente materiali termoconduttivi, e relativo processo di preparazione |
-
2012
- 2012-04-18 NO NO12774041A patent/NO2699839T3/no unknown
- 2012-04-18 US US14/110,845 patent/US9228701B2/en active Active
- 2012-04-18 AU AU2012246147A patent/AU2012246147B2/en active Active
- 2012-04-18 CN CN201280019008.1A patent/CN103597272B/zh active Active
- 2012-04-18 KR KR1020137030327A patent/KR20140030190A/ko not_active Application Discontinuation
- 2012-04-18 RU RU2013151000/07A patent/RU2605452C2/ru active
- 2012-04-18 CA CA2831821A patent/CA2831821C/en not_active Expired - Fee Related
- 2012-04-18 WO PCT/FI2012/050380 patent/WO2012143611A1/en active Application Filing
- 2012-04-18 EP EP12774041.3A patent/EP2699839B1/en active Active
- 2012-04-18 JP JP2014505689A patent/JP6072002B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
AU2012246147A1 (en) | 2013-10-24 |
JP2014517444A (ja) | 2014-07-17 |
CN103597272B (zh) | 2017-05-10 |
US20140036500A1 (en) | 2014-02-06 |
EP2699839B1 (en) | 2017-12-20 |
US9228701B2 (en) | 2016-01-05 |
CA2831821A1 (en) | 2012-10-26 |
KR20140030190A (ko) | 2014-03-11 |
CA2831821C (en) | 2019-07-02 |
WO2012143611A1 (en) | 2012-10-26 |
RU2605452C2 (ru) | 2016-12-20 |
EP2699839A4 (en) | 2014-10-08 |
AU2012246147B2 (en) | 2016-02-04 |
EP2699839A1 (en) | 2014-02-26 |
JP6072002B2 (ja) | 2017-02-01 |
RU2013151000A (ru) | 2015-05-27 |
CN103597272A (zh) | 2014-02-19 |