NO20026107D0 - Fremgangsmåte for dannelse av en sjiktstruktur på et substrat - Google Patents
Fremgangsmåte for dannelse av en sjiktstruktur på et substratInfo
- Publication number
- NO20026107D0 NO20026107D0 NO20026107A NO20026107A NO20026107D0 NO 20026107 D0 NO20026107 D0 NO 20026107D0 NO 20026107 A NO20026107 A NO 20026107A NO 20026107 A NO20026107 A NO 20026107A NO 20026107 D0 NO20026107 D0 NO 20026107D0
- Authority
- NO
- Norway
- Prior art keywords
- substrate
- forming
- layer structure
- layer
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
- C04B35/5805—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on borides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/1208—Oxides, e.g. ceramics
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1283—Control of temperature, e.g. gradual temperature increase, modulation of temperature
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- Inorganic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Structural Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10163100 | 2001-12-20 | ||
EP02003042A EP1321446A1 (de) | 2001-12-20 | 2002-02-12 | Verfahren zum Ausbilden einer Schichtstruktur auf einem Substrat |
Publications (2)
Publication Number | Publication Date |
---|---|
NO20026107D0 true NO20026107D0 (no) | 2002-12-19 |
NO20026107L NO20026107L (no) | 2003-06-23 |
Family
ID=26010824
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO20026107A NO20026107L (no) | 2001-12-20 | 2002-12-19 | Fremgangsmåte for dannelse av en sjiktstruktur på et substrat |
Country Status (3)
Country | Link |
---|---|
US (1) | US7253355B2 (no) |
JP (1) | JP3961941B2 (no) |
NO (1) | NO20026107L (no) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2432722A (en) * | 2005-11-25 | 2007-05-30 | Seiko Epson Corp | Electrochemical cell and method of manufacture |
GB2432723B (en) * | 2005-11-25 | 2010-12-08 | Seiko Epson Corp | Electrochemical cell and method of manufacture |
GB2432721B (en) * | 2005-11-25 | 2011-06-22 | Seiko Epson Corp | Electrochemical cell structure and method of fabrication |
US20090250108A1 (en) * | 2008-04-02 | 2009-10-08 | Applied Materials, Inc. | Silicon carbide for crystalline silicon solar cell surface passivation |
DE102009043916A1 (de) * | 2009-05-19 | 2010-12-16 | Schott Solar Ag | Verfahren zur Herstellung elektrischer Kontakte auf einem Halbleiterbauelement |
WO2011005586A2 (en) * | 2009-06-24 | 2011-01-13 | Buttress David G | Apparatus and method for joining solar receiver tubes |
WO2011025925A2 (en) * | 2009-08-30 | 2011-03-03 | David Buttress | Apparatus and method for field welding solar receiver tubes |
CN106029949B (zh) * | 2014-01-17 | 2020-02-21 | Iones株式会社 | 用于形成具有复合涂层粒度的涂层的方法和由此形成的涂层 |
US10490682B2 (en) | 2018-03-14 | 2019-11-26 | National Mechanical Group Corp. | Frame-less encapsulated photo-voltaic solar panel supporting solar cell modules encapsulated within multiple layers of optically-transparent epoxy-resin materials |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2874341A (en) * | 1954-11-30 | 1959-02-17 | Bell Telephone Labor Inc | Ohmic contacts to silicon bodies |
US3338693A (en) * | 1964-06-25 | 1967-08-29 | Bausch & Lomb | Fusion of glass particles with brief high intensity light flashes |
US3653970A (en) * | 1969-04-30 | 1972-04-04 | Nasa | Method of coating solar cell with borosilicate glass and resultant product |
US4320251A (en) * | 1980-07-28 | 1982-03-16 | Solamat Inc. | Ohmic contacts for solar cells by arc plasma spraying |
JPS63265872A (ja) * | 1987-04-23 | 1988-11-02 | Inax Corp | 繊維強化セラミツクスの製法 |
US5151386A (en) * | 1990-08-01 | 1992-09-29 | Mobil Solar Energy Corporation | Method of applying metallized contacts to a solar cell |
DE4133190A1 (de) * | 1991-10-07 | 1993-04-08 | Basf Ag | Formkoerper |
JP3070790B2 (ja) | 1992-03-06 | 2000-07-31 | キヤノン株式会社 | 太陽電池モジュール |
JP3112339B2 (ja) | 1992-03-31 | 2000-11-27 | キヤノン株式会社 | 太陽電池モジュール |
JPH06334205A (ja) | 1993-05-25 | 1994-12-02 | Matsushita Electric Ind Co Ltd | 太陽電池 |
US5552351A (en) * | 1993-11-29 | 1996-09-03 | Wisconsin Alumni Research Foundation | Ceramic membranes having macroscopic channels |
US5616185A (en) * | 1995-10-10 | 1997-04-01 | Hughes Aircraft Company | Solar cell with integrated bypass diode and method |
US5776235A (en) * | 1996-10-04 | 1998-07-07 | Dow Corning Corporation | Thick opaque ceramic coatings |
JP3722326B2 (ja) * | 1996-12-20 | 2005-11-30 | 三菱電機株式会社 | 太陽電池の製造方法 |
US6127202A (en) * | 1998-07-02 | 2000-10-03 | International Solar Electronic Technology, Inc. | Oxide-based method of making compound semiconductor films and making related electronic devices |
JP2000100483A (ja) * | 1998-09-22 | 2000-04-07 | Sharp Corp | 光電変換素子及びその製造方法及びこれを用いた太陽電池 |
US6358567B2 (en) * | 1998-12-23 | 2002-03-19 | The Regents Of The University Of California | Colloidal spray method for low cost thin coating deposition |
JP2000327460A (ja) | 1999-05-20 | 2000-11-28 | Nissan Motor Co Ltd | 耐摩耗性セラミックスおよびその製造方法 |
DE19930043A1 (de) * | 1999-06-30 | 2001-01-04 | Wolf Systeme Ag | Beleuchtungsvorrichtung für die elektronische Bildverarbeitung |
US6649824B1 (en) * | 1999-09-22 | 2003-11-18 | Canon Kabushiki Kaisha | Photoelectric conversion device and method of production thereof |
EP1321446A1 (de) * | 2001-12-20 | 2003-06-25 | RWE Solar GmbH | Verfahren zum Ausbilden einer Schichtstruktur auf einem Substrat |
JP3895254B2 (ja) * | 2002-10-07 | 2007-03-22 | シャープ株式会社 | 太陽電池セルの製造方法 |
-
2002
- 2002-12-19 US US10/322,762 patent/US7253355B2/en not_active Expired - Fee Related
- 2002-12-19 NO NO20026107A patent/NO20026107L/no not_active Application Discontinuation
- 2002-12-20 JP JP2002369948A patent/JP3961941B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2003218370A (ja) | 2003-07-31 |
NO20026107L (no) | 2003-06-23 |
US20030121545A1 (en) | 2003-07-03 |
JP3961941B2 (ja) | 2007-08-22 |
US7253355B2 (en) | 2007-08-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FC2A | Withdrawal, rejection or dismissal of laid open patent application |