NO20003015D0 - Overflatemontert RC-anordning - Google Patents
Overflatemontert RC-anordningInfo
- Publication number
- NO20003015D0 NO20003015D0 NO20003015A NO20003015A NO20003015D0 NO 20003015 D0 NO20003015 D0 NO 20003015D0 NO 20003015 A NO20003015 A NO 20003015A NO 20003015 A NO20003015 A NO 20003015A NO 20003015 D0 NO20003015 D0 NO 20003015D0
- Authority
- NO
- Norway
- Prior art keywords
- surface mounted
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C13/00—Resistors not provided for elsewhere
- H01C13/02—Structural combinations of resistors
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H1/02—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network of RC networks, e.g. integrated networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H2001/0021—Constructional details
- H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Connection Of Batteries Or Terminals (AREA)
- Coils Or Transformers For Communication (AREA)
- Electron Tubes For Measurement (AREA)
- Thermistors And Varistors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/335,991 US6525628B1 (en) | 1999-06-18 | 1999-06-18 | Surface mount RC array with narrow tab portions on each of the electrode plates |
Publications (2)
Publication Number | Publication Date |
---|---|
NO20003015D0 true NO20003015D0 (no) | 2000-06-13 |
NO20003015L NO20003015L (no) | 2000-12-19 |
Family
ID=23314104
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO20003015A NO20003015L (no) | 1999-06-18 | 2000-06-13 | Overflatemontering av RC-anordninger |
Country Status (8)
Country | Link |
---|---|
US (4) | US6525628B1 (no) |
EP (1) | EP1061535A3 (no) |
JP (1) | JP2001044076A (no) |
KR (1) | KR20010021003A (no) |
CN (1) | CN1279533A (no) |
NO (1) | NO20003015L (no) |
SG (1) | SG98405A1 (no) |
TW (1) | TW452808B (no) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9054094B2 (en) | 1997-04-08 | 2015-06-09 | X2Y Attenuators, Llc | Energy conditioning circuit arrangement for integrated circuit |
US7336468B2 (en) | 1997-04-08 | 2008-02-26 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
US7301748B2 (en) | 1997-04-08 | 2007-11-27 | Anthony Anthony A | Universal energy conditioning interposer with circuit architecture |
US7321485B2 (en) | 1997-04-08 | 2008-01-22 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
DE10202915A1 (de) * | 2002-01-25 | 2003-08-21 | Epcos Ag | Elektrokeramisches Bauelement mit Innenelektroden |
US7075774B2 (en) * | 2002-09-10 | 2006-07-11 | Tdk Corporation | Multilayer capacitor |
CN1799112A (zh) * | 2003-04-08 | 2006-07-05 | 阿维科斯公司 | 电镀端头 |
WO2005065097A2 (en) | 2003-12-22 | 2005-07-21 | X2Y Attenuators, Llc | Internally shielded energy conditioner |
US20050180091A1 (en) * | 2004-01-13 | 2005-08-18 | Avx Corporation | High current feedthru device |
DE102004016146B4 (de) * | 2004-04-01 | 2006-09-14 | Epcos Ag | Elektrisches Vielschichtbauelement |
GB2439861A (en) | 2005-03-01 | 2008-01-09 | X2Y Attenuators Llc | Internally overlapped conditioners |
US7817397B2 (en) | 2005-03-01 | 2010-10-19 | X2Y Attenuators, Llc | Energy conditioner with tied through electrodes |
US20060229188A1 (en) * | 2005-04-07 | 2006-10-12 | Randall Michael S | C0G multi-layered ceramic capacitor |
US7923395B2 (en) * | 2005-04-07 | 2011-04-12 | Kemet Electronics Corporation | C0G multi-layered ceramic capacitor |
US20070119911A1 (en) * | 2005-11-28 | 2007-05-31 | Chan Su L | Method of forming a composite standoff on a circuit board |
EP1991996A1 (en) | 2006-03-07 | 2008-11-19 | X2Y Attenuators, L.L.C. | Energy conditioner structures |
US8493744B2 (en) * | 2007-04-03 | 2013-07-23 | Tdk Corporation | Surface mount devices with minimum lead inductance and methods of manufacturing the same |
KR100916480B1 (ko) * | 2007-12-20 | 2009-09-08 | 삼성전기주식회사 | 적층 세라믹 캐패시터 |
US20090236692A1 (en) * | 2008-03-24 | 2009-09-24 | Sheng-Fu Su | Rc filtering device having air gap construction for over voltage protection |
JP2015109409A (ja) | 2013-10-25 | 2015-06-11 | 株式会社村田製作所 | 電子部品 |
KR102048100B1 (ko) * | 2014-11-04 | 2019-12-02 | 삼성전기주식회사 | 적층 칩 전자부품 및 그 실장 기판 |
US9866193B2 (en) | 2015-04-20 | 2018-01-09 | Avx Corporation | Parallel RC circuit equalizers |
US10033346B2 (en) | 2015-04-20 | 2018-07-24 | Avx Corporation | Wire-bond transmission line RC circuit |
US10734159B2 (en) * | 2016-12-22 | 2020-08-04 | Murata Manufacturing Co., Ltd. | Multilayer ceramic capacitor and method for manufacturing multilayer ceramic capacitor |
TW201927091A (zh) * | 2017-12-08 | 2019-07-01 | 和碩聯合科技股份有限公司 | 表面黏著元件 |
CN108365308B (zh) * | 2018-02-05 | 2020-04-21 | 重庆思睿创瓷电科技有限公司 | 介质波导滤波器及其贴装方法 |
Family Cites Families (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2405515A (en) | 1944-09-23 | 1946-08-06 | Philco Radio & Television Corp | Amplifier coupling device |
US2828454A (en) | 1950-02-11 | 1958-03-25 | Globe Union Inc | Ceramic capacitor |
US2694185A (en) | 1951-01-19 | 1954-11-09 | Sprague Electric Co | Electrical circuit arrangement |
US2779975A (en) | 1955-01-19 | 1957-02-05 | Vitramon Inc | Methods for making composite electric circuit components |
US3002137A (en) | 1957-09-04 | 1961-09-26 | Sprague Electric Co | Voltage dependent ceramic capacitor |
US3256588A (en) | 1962-10-23 | 1966-06-21 | Philco Corp | Method of fabricating thin film r-c circuits on single substrate |
US3544925A (en) | 1965-08-31 | 1970-12-01 | Vitramon Inc | Solid-state electrical component with capacitance defeating resistor arrangement |
US3490055A (en) | 1967-01-16 | 1970-01-13 | Microtek Electronics Inc | Circuit structure with capacitor |
US3619220A (en) | 1968-09-26 | 1971-11-09 | Sprague Electric Co | Low temperature fired, glass bonded, dielectric ceramic body and method |
US3569872A (en) | 1968-11-27 | 1971-03-09 | Vitramon Inc | Electronic component |
US3569795A (en) | 1969-05-29 | 1971-03-09 | Us Army | Voltage-variable, ferroelectric capacitor |
DE2222546C3 (de) | 1972-05-08 | 1979-10-31 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Elektrisches RC-Bauelement |
US3896354A (en) | 1974-07-02 | 1975-07-22 | Sprague Electric Co | Monolithic ceramic capacitor |
US4453199A (en) | 1983-06-17 | 1984-06-05 | Avx Corporation | Low cost thin film capacitor |
JPS62194607A (ja) | 1986-02-20 | 1987-08-27 | 株式会社村田製作所 | セラミックコンデンサ |
GB2197540B (en) | 1986-11-12 | 1991-04-17 | Murata Manufacturing Co | A circuit structure. |
JPH0635462Y2 (ja) | 1988-08-11 | 1994-09-14 | 株式会社村田製作所 | 積層型コンデンサ |
US5258335A (en) | 1988-10-14 | 1993-11-02 | Ferro Corporation | Low dielectric, low temperature fired glass ceramics |
JP2790640B2 (ja) | 1989-01-14 | 1998-08-27 | ティーディーケイ株式会社 | 混成集積回路部品の構造 |
JP2852372B2 (ja) | 1989-07-07 | 1999-02-03 | 株式会社村田製作所 | 積層セラミックコンデンサ |
JPH0373421U (no) * | 1989-07-20 | 1991-07-24 | ||
MY105486A (en) | 1989-12-15 | 1994-10-31 | Tdk Corp | A multilayer hybrid circuit. |
JPH0453219A (ja) | 1990-06-20 | 1992-02-20 | Murata Mfg Co Ltd | 表面実装型電子部品 |
US5093774A (en) | 1991-03-22 | 1992-03-03 | Thomas & Betts Corporation | Two-terminal series-connected network |
US5495387A (en) | 1991-08-09 | 1996-02-27 | Murata Manufacturing Co., Ltd. | RC array |
JPH05283283A (ja) | 1992-03-31 | 1993-10-29 | Mitsubishi Materials Corp | チップ型cr複合素子及びその製造方法 |
JPH05326317A (ja) * | 1992-05-26 | 1993-12-10 | Tama Electric Co Ltd | 積層セラミックス素子 |
US5312674A (en) | 1992-07-31 | 1994-05-17 | Hughes Aircraft Company | Low-temperature-cofired-ceramic (LTCC) tape structures including cofired ferromagnetic elements, drop-in components and multi-layer transformer |
US5430605A (en) | 1992-08-04 | 1995-07-04 | Murata Erie North America, Inc. | Composite multilayer capacitive device and method for fabricating the same |
US5227951A (en) | 1992-08-04 | 1993-07-13 | Murata Erie North America, Inc. | Composite multilayer capacitive device and method for fabricating the same |
US5530722A (en) | 1992-10-27 | 1996-06-25 | Ericsson Ge Mobile Communications Inc. | Quadrature modulator with integrated distributed RC filters |
JPH06267789A (ja) | 1993-03-12 | 1994-09-22 | Rohm Co Ltd | 積層チップ型c・r複合電子部品 |
DE69524855T2 (de) | 1994-08-25 | 2002-08-14 | Nat Semiconductor Corp | Bauelementstapel in mehrchiphalbleiterpackungen |
JPH097877A (ja) | 1995-04-18 | 1997-01-10 | Rohm Co Ltd | 多層セラミックチップ型コンデンサ及びその製造方法 |
US5880925A (en) * | 1997-06-27 | 1999-03-09 | Avx Corporation | Surface mount multilayer capacitor |
US5889445A (en) | 1997-07-22 | 1999-03-30 | Avx Corporation | Multilayer ceramic RC device |
US5897912A (en) * | 1997-09-03 | 1999-04-27 | Ferro Corporation | Method of making conductive electrodes for use in multilayer ceramic capacitors or inductors using organometallic ink |
-
1999
- 1999-06-18 US US09/335,991 patent/US6525628B1/en not_active Expired - Fee Related
-
2000
- 2000-06-01 SG SG200003056A patent/SG98405A1/en unknown
- 2000-06-02 EP EP00304693A patent/EP1061535A3/en not_active Withdrawn
- 2000-06-13 NO NO20003015A patent/NO20003015L/no unknown
- 2000-06-16 CN CN00118363A patent/CN1279533A/zh active Pending
- 2000-06-17 TW TW089111930A patent/TW452808B/zh not_active IP Right Cessation
- 2000-06-17 KR KR1020000033440A patent/KR20010021003A/ko not_active Application Discontinuation
- 2000-06-19 JP JP2000182939A patent/JP2001044076A/ja active Pending
-
2001
- 2001-05-31 US US09/871,251 patent/US20020041219A1/en not_active Abandoned
- 2001-05-31 US US09/871,252 patent/US20020011905A1/en not_active Abandoned
- 2001-05-31 US US09/871,237 patent/US20020044029A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
EP1061535A2 (en) | 2000-12-20 |
CN1279533A (zh) | 2001-01-10 |
EP1061535A3 (en) | 2005-06-15 |
US20020044029A1 (en) | 2002-04-18 |
US6525628B1 (en) | 2003-02-25 |
US20020011905A1 (en) | 2002-01-31 |
US20020041219A1 (en) | 2002-04-11 |
KR20010021003A (ko) | 2001-03-15 |
NO20003015L (no) | 2000-12-19 |
TW452808B (en) | 2001-09-01 |
SG98405A1 (en) | 2003-09-19 |
JP2001044076A (ja) | 2001-02-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
NO20003015D0 (no) | Overflatemontert RC-anordning | |
DE69925738D1 (de) | Scheibenwischervorrichtung | |
DE60035572D1 (de) | Bewegungsvorrichtung | |
DE60024818D1 (de) | Strammvorrichtung | |
DE60012680D1 (de) | Düseneinrichtung | |
DE50010380D1 (de) | Federeinrichtung | |
DE69937739D1 (de) | Halbleitervorrichtung | |
DE60042024D1 (de) | Haltevorrichtung | |
DE69902021D1 (de) | Poliervorrichtung | |
DE60005959D1 (de) | Halbleiteranordnung | |
DE59912113D1 (de) | Reinigungsvorrichtung | |
DE60003425D1 (de) | Bohrlochvorrichtung | |
DE60029523D1 (de) | Changiervorrichtung | |
DE60032992D1 (de) | Schwingende Einrichtung | |
DE60019144D1 (de) | Halbleitervorrichtung | |
DE60041030D1 (de) | Halbleiterbauelement | |
DE69929501D1 (de) | Reinigungsvorrichtung | |
DE60000538D1 (de) | Stauchvorrichtung | |
ATA662000A (de) | Montagevorrichtung | |
DE60037083D1 (de) | Wischervorrichtung | |
DE60009999D1 (de) | Halbleitervorrichtung | |
DE60012943D1 (de) | Wascheinrichtung | |
FI3977U1 (fi) | Puhdistuslaite | |
DE50009663D1 (de) | Wischeinrichtung | |
FI19992074A (fi) | Elektroniikkalaite |