NL96840C - - Google Patents
Info
- Publication number
- NL96840C NL96840C NL96840DA NL96840C NL 96840 C NL96840 C NL 96840C NL 96840D A NL96840D A NL 96840DA NL 96840 C NL96840 C NL 96840C
- Authority
- NL
- Netherlands
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
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- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
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- H01L2924/01005—Boron [B]
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- H01L2924/01006—Carbon [C]
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- H01L2924/01013—Aluminum [Al]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01018—Argon [Ar]
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- H01L2924/01019—Potassium [K]
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- H01L2924/01023—Vanadium [V]
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- H01L2924/01027—Cobalt [Co]
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- H01L2924/01029—Copper [Cu]
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- H01L2924/01032—Germanium [Ge]
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- H01L2924/01033—Arsenic [As]
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- H01L2924/01039—Yttrium [Y]
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- H01L2924/01043—Technetium [Tc]
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- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H01L2924/01049—Indium [In]
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- H01L2924/01051—Antimony [Sb]
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- H01L2924/01052—Tellurium [Te]
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- H01L2924/01055—Cesium [Cs]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01058—Cerium [Ce]
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- H01L2924/01059—Praseodymium [Pr]
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- H01L2924/01063—Europium [Eu]
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- H01L2924/01068—Erbium [Er]
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- H01L2924/01074—Tungsten [W]
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- H01L2924/01078—Platinum [Pt]
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- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US354026A US2705768A (en) | 1953-05-11 | 1953-05-11 | Semiconductor signal translating devices and method of fabrication |
Publications (1)
Publication Number | Publication Date |
---|---|
NL96840C true NL96840C (xx) | 1900-01-01 |
Family
ID=23391585
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NLAANVRAGE8001925,A NL186747B (nl) | 1953-05-11 | Inrichting voor het vervaardigen van samengestelde isolatieprofielen, in het bijzonder voor venster- en deurkozijnen, of gevels. | |
NL96840D NL96840C (xx) | 1953-05-11 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NLAANVRAGE8001925,A NL186747B (nl) | 1953-05-11 | Inrichting voor het vervaardigen van samengestelde isolatieprofielen, in het bijzonder voor venster- en deurkozijnen, of gevels. |
Country Status (6)
Country | Link |
---|---|
US (1) | US2705768A (xx) |
BE (1) | BE528676A (xx) |
DE (1) | DE960372C (xx) |
FR (1) | FR1097084A (xx) |
GB (1) | GB775366A (xx) |
NL (2) | NL96840C (xx) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB753136A (en) * | 1953-08-28 | 1956-07-18 | Standard Telephones Cables Ltd | Improvements in or relating to light cells or rectifiers |
US2860291A (en) * | 1953-09-03 | 1958-11-11 | Texas Instruments Inc | Junction type transistor structure |
US2850687A (en) * | 1953-10-13 | 1958-09-02 | Rca Corp | Semiconductor devices |
USRE25875E (en) * | 1954-11-22 | 1965-10-12 | Crystal diode | |
US2894184A (en) * | 1955-06-29 | 1959-07-07 | Hughes Aircraft Co | Electrical characteristics of diodes |
GB797304A (en) * | 1955-12-19 | 1958-07-02 | Gen Electric Co Ltd | Improvements in or relating to the manufacture of semiconductor devices |
US2805370A (en) * | 1956-04-26 | 1957-09-03 | Bell Telephone Labor Inc | Alloyed connections to semiconductors |
NL216614A (xx) * | 1956-05-15 | |||
US2820135A (en) * | 1956-09-05 | 1958-01-14 | Pacific Semiconductors Inc | Method for producing electrical contact to semiconductor devices |
US2916604A (en) * | 1957-09-20 | 1959-12-08 | Philco Corp | Fabrication of electrical units |
US3091683A (en) * | 1958-05-14 | 1963-05-28 | Philips Corp | Method of passing wire, cable sheath and the like through a wall |
US2894112A (en) * | 1958-08-27 | 1959-07-07 | Western Electric Co | Apparatus for attaching leads to orystals |
US3005897A (en) * | 1959-05-07 | 1961-10-24 | Hoffman Electrouics Corp | Heater control circuit for alloying apparatus |
US2987597A (en) * | 1959-12-22 | 1961-06-06 | Philco Corp | Electrical component assembly |
NL249359A (xx) * | 1960-03-12 | |||
US3189801A (en) * | 1960-11-04 | 1965-06-15 | Microwave Ass | Point contact semiconductor devices |
US3159775A (en) * | 1960-11-30 | 1964-12-01 | Sylvania Electric Prod | Semiconductor device and method of manufacture |
US3165615A (en) * | 1961-04-07 | 1965-01-12 | Texas Instruments Inc | Apparatus for forming clean iron-lead telluride high temperature pressure contacts |
US3134699A (en) * | 1961-07-25 | 1964-05-26 | Nippon Electric Co | Method of manufacturing semiconductor devices |
BE624958A (xx) * | 1961-11-20 | |||
US3287612A (en) * | 1963-12-17 | 1966-11-22 | Bell Telephone Labor Inc | Semiconductor contacts and protective coatings for planar devices |
NL134170C (xx) * | 1963-12-17 | 1900-01-01 | ||
US3515840A (en) * | 1965-10-20 | 1970-06-02 | Gti Corp | Diode sealer |
US3432730A (en) * | 1966-09-06 | 1969-03-11 | Webb James E | Semiconductor p-n junction stress and strain sensor |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USB134657I5 (xx) * | 1949-12-23 | |||
US2666150A (en) * | 1950-05-04 | 1954-01-12 | Ibm | Crystal tetrode |
US2654059A (en) * | 1951-05-26 | 1953-09-29 | Bell Telephone Labor Inc | Semiconductor signal translating device |
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0
- NL NLAANVRAGE8001925,A patent/NL186747B/xx unknown
- NL NL96840D patent/NL96840C/xx active
- BE BE528676D patent/BE528676A/xx unknown
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1953
- 1953-05-11 US US354026A patent/US2705768A/en not_active Expired - Lifetime
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1954
- 1954-03-10 FR FR1097084D patent/FR1097084A/fr not_active Expired
- 1954-04-01 DE DEW13613A patent/DE960372C/de not_active Expired
- 1954-05-06 GB GB13286/54A patent/GB775366A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
US2705768A (en) | 1955-04-05 |
BE528676A (xx) | 1900-01-01 |
DE960372C (de) | 1957-03-21 |
NL186747B (nl) | |
GB775366A (en) | 1957-05-22 |
FR1097084A (fr) | 1955-06-29 |