NL7805992A - Halfgeleiderinrichting. - Google Patents
Halfgeleiderinrichting.Info
- Publication number
- NL7805992A NL7805992A NL7805992A NL7805992A NL7805992A NL 7805992 A NL7805992 A NL 7805992A NL 7805992 A NL7805992 A NL 7805992A NL 7805992 A NL7805992 A NL 7805992A NL 7805992 A NL7805992 A NL 7805992A
- Authority
- NL
- Netherlands
- Prior art keywords
- semi
- guide device
- guide
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/492—Bases or plates or solder therefor
- H01L23/4924—Bases or plates or solder therefor characterised by the materials
- H01L23/4928—Bases or plates or solder therefor characterised by the materials the materials containing carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Die Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP52064720A JPS603776B2 (ja) | 1977-06-03 | 1977-06-03 | 半導体素子 |
Publications (1)
Publication Number | Publication Date |
---|---|
NL7805992A true NL7805992A (nl) | 1978-12-05 |
Family
ID=13266261
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL7805992A NL7805992A (nl) | 1977-06-03 | 1978-06-01 | Halfgeleiderinrichting. |
Country Status (5)
Country | Link |
---|---|
US (1) | US4196442A (nl) |
JP (1) | JPS603776B2 (nl) |
DE (1) | DE2824250C2 (nl) |
GB (1) | GB1602478A (nl) |
NL (1) | NL7805992A (nl) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0012019A1 (en) * | 1978-12-01 | 1980-06-11 | Hitachi, Ltd. | An electrode for a semiconductor device and method of making such an electrode |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5550646A (en) * | 1978-10-06 | 1980-04-12 | Hitachi Ltd | Integrated circuit device |
JPS55128554A (en) * | 1979-03-29 | 1980-10-04 | Hitachi Ltd | Fiber combined material and producing the same |
JPS55160437A (en) * | 1979-05-31 | 1980-12-13 | Hitachi Ltd | Semiconductor device |
DE2937049A1 (de) * | 1979-09-13 | 1981-04-02 | Brown, Boveri & Cie Ag, 6800 Mannheim | Leistungs-halbleiterbauelement |
JPS56142645A (en) * | 1980-04-07 | 1981-11-07 | Hitachi Ltd | Semiconductor device |
JPS5759453U (nl) * | 1980-09-24 | 1982-04-08 | ||
JPS5787139A (en) * | 1980-11-19 | 1982-05-31 | Hitachi Ltd | Semiconductor device |
JPS5921032A (ja) * | 1982-07-26 | 1984-02-02 | Sumitomo Electric Ind Ltd | 半導体装置用基板 |
US4737217A (en) * | 1985-09-30 | 1988-04-12 | General Electric Company | Method of fabricating a substrate for a semiconductor chip package |
EP0224141A3 (en) * | 1985-11-21 | 1989-06-14 | General Electric Company | Improved semiconductor power devices |
CA1316303C (en) * | 1988-12-23 | 1993-04-20 | Thijs Eerkes | Composite structure |
US5151777A (en) * | 1989-03-03 | 1992-09-29 | Delco Electronics Corporation | Interface device for thermally coupling an integrated circuit to a heat sink |
EP0638928B1 (de) * | 1993-08-09 | 1998-10-14 | Siemens Aktiengesellschaft | Leistungs-Halbleiterbauelement mit Druckkontakt |
US5834374A (en) * | 1994-09-30 | 1998-11-10 | International Business Machines Corporation | Method for controlling tensile and compressive stresses and mechanical problems in thin films on substrates |
DE19605302A1 (de) * | 1996-02-14 | 1997-08-21 | Fraunhofer Ges Forschung | Kühlkörper mit einer Montagefläche für ein elektronisches Bauteil |
US5686676A (en) * | 1996-05-07 | 1997-11-11 | Brush Wellman Inc. | Process for making improved copper/tungsten composites |
US6016007A (en) * | 1998-10-16 | 2000-01-18 | Northrop Grumman Corp. | Power electronics cooling apparatus |
US6703707B1 (en) * | 1999-11-24 | 2004-03-09 | Denso Corporation | Semiconductor device having radiation structure |
EP1403923A1 (en) * | 2002-09-27 | 2004-03-31 | Abb Research Ltd. | Press pack power semiconductor module |
DE102006043163B4 (de) | 2006-09-14 | 2016-03-31 | Infineon Technologies Ag | Halbleiterschaltungsanordnungen |
EP2447988B1 (en) * | 2010-11-02 | 2015-05-06 | GE Energy Power Conversion Technology Limited | Power electronic device with edge passivation |
JP2014183256A (ja) * | 2013-03-21 | 2014-09-29 | Denso Corp | 接合体およびこれを用いた半導体装置、ならびにそれらの製造方法 |
CN106783787A (zh) * | 2017-01-24 | 2017-05-31 | 东莞市阿甘半导体有限公司 | 用于芯片封装的电极以及使用该电极的芯片封装结构 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5116302B2 (nl) * | 1973-10-22 | 1976-05-22 | ||
US3889286A (en) * | 1973-12-26 | 1975-06-10 | Gen Electric | Transparent multiple contact for semiconductor light conversion elements |
-
1977
- 1977-06-03 JP JP52064720A patent/JPS603776B2/ja not_active Expired
-
1978
- 1978-05-31 GB GB25541/78A patent/GB1602478A/en not_active Expired
- 1978-05-31 US US05/911,078 patent/US4196442A/en not_active Expired - Lifetime
- 1978-06-01 NL NL7805992A patent/NL7805992A/nl not_active Application Discontinuation
- 1978-06-02 DE DE2824250A patent/DE2824250C2/de not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0012019A1 (en) * | 1978-12-01 | 1980-06-11 | Hitachi, Ltd. | An electrode for a semiconductor device and method of making such an electrode |
Also Published As
Publication number | Publication date |
---|---|
DE2824250C2 (de) | 1982-11-04 |
JPS603776B2 (ja) | 1985-01-30 |
JPS54568A (en) | 1979-01-05 |
DE2824250A1 (de) | 1978-12-07 |
US4196442A (en) | 1980-04-01 |
GB1602478A (en) | 1981-11-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
BB | A search report has been drawn up | ||
A85 | Still pending on 85-01-01 | ||
BV | The patent application has lapsed |