NL7701284A - Encapsulating transistors using epoxide! fluidised bed - producing inner protection which is encapsulated using injected foam thermoplastic inside mould (BE 7.8.78) - Google Patents

Encapsulating transistors using epoxide! fluidised bed - producing inner protection which is encapsulated using injected foam thermoplastic inside mould (BE 7.8.78)

Info

Publication number
NL7701284A
NL7701284A NL7701284A NL7701284A NL7701284A NL 7701284 A NL7701284 A NL 7701284A NL 7701284 A NL7701284 A NL 7701284A NL 7701284 A NL7701284 A NL 7701284A NL 7701284 A NL7701284 A NL 7701284A
Authority
NL
Netherlands
Prior art keywords
epoxide
encapsulating
encapsulated
transistors
fluidised bed
Prior art date
Application number
NL7701284A
Other languages
Dutch (nl)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Priority to NL7701284A priority Critical patent/NL7701284A/en
Priority to IT19995/78A priority patent/IT1092425B/en
Priority to GB4418/78A priority patent/GB1594892A/en
Priority to BR7800732A priority patent/BR7800732A/en
Priority to BE184942A priority patent/BE863695A/en
Priority to FR7803222A priority patent/FR2379910A1/en
Priority to ES466679A priority patent/ES466679A1/en
Priority to SE7801325A priority patent/SE7801325L/en
Priority to DE19782804956 priority patent/DE2804956A1/en
Priority to AR270981A priority patent/AR214553A1/en
Priority to AU33038/78A priority patent/AU513092B2/en
Priority to JP1158278A priority patent/JPS53112063A/en
Priority to AT0087478A priority patent/ATA87478A/en
Priority to CA296,495A priority patent/CA1093704A/en
Publication of NL7701284A publication Critical patent/NL7701284A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
    • C08J9/06—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent
    • C08J9/10—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent developing nitrogen, the blowing agent being a compound containing a nitrogen-to-nitrogen bond
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2381/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen, or carbon only; Polysulfones; Derivatives of such polymers
    • C08J2381/04—Polysulfides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Connections Arranged To Contact A Plurality Of Conductors (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

A semi-conductor assembly has semi-conductor, leads in contact with terminals, and a polymer encapsulation around the semi-conductor, electrical connections and part of the leads. The encapsulation provides the protection from the surroundings plus an outer injection-foamed thermoplastic envelope of required external dimensions. Rapidly prodn. is achievd with good protection from surroundings, precise external shape as required, smooth exterior.
NL7701284A 1977-02-08 1977-02-08 Encapsulating transistors using epoxide! fluidised bed - producing inner protection which is encapsulated using injected foam thermoplastic inside mould (BE 7.8.78) NL7701284A (en)

Priority Applications (14)

Application Number Priority Date Filing Date Title
NL7701284A NL7701284A (en) 1977-02-08 1977-02-08 Encapsulating transistors using epoxide! fluidised bed - producing inner protection which is encapsulated using injected foam thermoplastic inside mould (BE 7.8.78)
IT19995/78A IT1092425B (en) 1977-02-08 1978-02-03 SEMICONDUCTIVE DEVICE AND ENCAPSULATION METHOD OF THE SAME
GB4418/78A GB1594892A (en) 1977-02-08 1978-02-03 Semiconductor devices and the provision of envelopes therefor
BR7800732A BR7800732A (en) 1977-02-08 1978-02-03 SEMI-CONDUCTOR DEVICE
BE184942A BE863695A (en) 1977-02-08 1978-02-06 SEMICONDUCTOR DEVICE AND PROCESS FOR ITS COATING
FR7803222A FR2379910A1 (en) 1977-02-08 1978-02-06 SEMICONDUCTOR DEVICE AND PROCESS FOR ITS COATING
ES466679A ES466679A1 (en) 1977-02-08 1978-02-06 Semiconductor devices and the provision of envelopes therefor
SE7801325A SE7801325L (en) 1977-02-08 1978-02-06 SEMICONDUCTOR DEVICE AND WAY TO ENCLOSE SEMICONDUCTOR DEVICE
DE19782804956 DE2804956A1 (en) 1977-02-08 1978-02-06 SEMICONDUCTOR ARRANGEMENT AND METHOD OF WRAPPING THE SEMICONDUCTOR ARRANGEMENT
AR270981A AR214553A1 (en) 1977-02-08 1978-02-06 SEMICONDUCTIVE DEVICE AND METHOD OF WRAPPING THE SEMICONDUCTIVE DEVICE
AU33038/78A AU513092B2 (en) 1977-02-08 1978-02-06 Semiconductor device and method of enveloping the semiconductor device
JP1158278A JPS53112063A (en) 1977-02-08 1978-02-06 Semiconductor and method of coating same
AT0087478A ATA87478A (en) 1977-02-08 1978-02-08 SEMICONDUCTOR ARRANGEMENT AND METHOD FOR COVERING THE SEMICONDUCTOR ARRANGEMENT
CA296,495A CA1093704A (en) 1977-02-08 1978-02-08 Semiconductor device and method of enveloping the semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7701284A NL7701284A (en) 1977-02-08 1977-02-08 Encapsulating transistors using epoxide! fluidised bed - producing inner protection which is encapsulated using injected foam thermoplastic inside mould (BE 7.8.78)

Publications (1)

Publication Number Publication Date
NL7701284A true NL7701284A (en) 1978-08-10

Family

ID=19827941

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7701284A NL7701284A (en) 1977-02-08 1977-02-08 Encapsulating transistors using epoxide! fluidised bed - producing inner protection which is encapsulated using injected foam thermoplastic inside mould (BE 7.8.78)

Country Status (2)

Country Link
BE (1) BE863695A (en)
NL (1) NL7701284A (en)

Also Published As

Publication number Publication date
BE863695A (en) 1978-08-07

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Legal Events

Date Code Title Description
BV The patent application has lapsed