NL7310168A - Sintered laminated integrated circuit unit - mfd. from ceramic, and printed conducting assemblies on a ceramic substrate - Google Patents

Sintered laminated integrated circuit unit - mfd. from ceramic, and printed conducting assemblies on a ceramic substrate

Info

Publication number
NL7310168A
NL7310168A NL7310168A NL7310168A NL7310168A NL 7310168 A NL7310168 A NL 7310168A NL 7310168 A NL7310168 A NL 7310168A NL 7310168 A NL7310168 A NL 7310168A NL 7310168 A NL7310168 A NL 7310168A
Authority
NL
Netherlands
Prior art keywords
ceramic
mfd
integrated circuit
circuit unit
plate
Prior art date
Application number
NL7310168A
Other languages
Dutch (nl)
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to NL7310168A priority Critical patent/NL7310168A/en
Publication of NL7310168A publication Critical patent/NL7310168A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5383—Multilayer substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
    • C04B35/111—Fine ceramics
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/64—Burning or sintering processes
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/68—Forming laminates or joining articles wherein at least one substrate contains at least two different parts of macro-size, e.g. one ceramic substrate layer containing an embedded conductor or electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

A composite sintered structure is mfd. by placing an unfired ceramic and/or a conducting assembly on an unfired ceramic plate in the form of a single or a series of alternating layers and the matls are sintered simultaneously. The unfired ceramic plate and the various assemblies from a mixt of a powdered inorg. matl and a binder, in which the same ceramic and binder is used in the plate and the assemblies, with a ratio of ceramic to binder the same in the plate and in each assembly. The difference in shrinkage between the unfired ceramic layers and the layers e.g. of conducting material printed on these, is eliminated so that deformation of the sintered structure is prevented.
NL7310168A 1973-07-20 1973-07-20 Sintered laminated integrated circuit unit - mfd. from ceramic, and printed conducting assemblies on a ceramic substrate NL7310168A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
NL7310168A NL7310168A (en) 1973-07-20 1973-07-20 Sintered laminated integrated circuit unit - mfd. from ceramic, and printed conducting assemblies on a ceramic substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7310168A NL7310168A (en) 1973-07-20 1973-07-20 Sintered laminated integrated circuit unit - mfd. from ceramic, and printed conducting assemblies on a ceramic substrate

Publications (1)

Publication Number Publication Date
NL7310168A true NL7310168A (en) 1975-01-22

Family

ID=19819299

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7310168A NL7310168A (en) 1973-07-20 1973-07-20 Sintered laminated integrated circuit unit - mfd. from ceramic, and printed conducting assemblies on a ceramic substrate

Country Status (1)

Country Link
NL (1) NL7310168A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001049485A1 (en) * 1999-12-30 2001-07-12 Ceramic Fuel Cells Limited Laminated structure and method of forming same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001049485A1 (en) * 1999-12-30 2001-07-12 Ceramic Fuel Cells Limited Laminated structure and method of forming same

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