|
US3804729A
(en)
*
|
1972-06-19 |
1974-04-16 |
M & T Chemicals Inc |
Electrolyte and process for electro-depositing copper
|
|
ZA739310B
(en)
*
|
1972-12-14 |
1974-11-27 |
M & T Chemicals Inc |
Electrode position of copper
|
|
US3940320A
(en)
*
|
1972-12-14 |
1976-02-24 |
M & T Chemicals Inc. |
Electrodeposition of copper
|
|
US3956120A
(en)
*
|
1972-12-14 |
1976-05-11 |
M & T Chemicals Inc. |
Electrodeposition of copper
|
|
US3956079A
(en)
*
|
1972-12-14 |
1976-05-11 |
M & T Chemicals Inc. |
Electrodeposition of copper
|
|
US3956084A
(en)
*
|
1972-12-14 |
1976-05-11 |
M & T Chemicals Inc. |
Electrodeposition of copper
|
|
US3956078A
(en)
*
|
1972-12-14 |
1976-05-11 |
M & T Chemicals Inc. |
Electrodeposition of copper
|
|
US3966565A
(en)
*
|
1972-12-14 |
1976-06-29 |
M & T Chemicals Inc. |
Electrodeposition of copper
|
|
JPS544329B2
(xx)
*
|
1973-03-20 |
1979-03-06 |
|
|
|
NL7415845A
(nl)
*
|
1973-12-26 |
1975-06-30 |
Upjohn Co |
Werkwijze voor het bevorderen van de productie van endogene prostaglandinen door zoogdieren, alsmede werkwijze ter bereiding van daarbij te gebruiken preparaten.
|
|
US4014760A
(en)
*
|
1974-11-21 |
1977-03-29 |
M & T Chemicals Inc. |
Electrodeposition of copper
|
|
US4036710A
(en)
*
|
1974-11-21 |
1977-07-19 |
M & T Chemicals Inc. |
Electrodeposition of copper
|
|
BR7606259A
(pt)
*
|
1975-09-22 |
1977-06-21 |
M & T Chemicals Inc |
Aperfeicoamentos em processo e composicao para a preparacao de um eletrodeposito
|
|
US4036711A
(en)
*
|
1975-12-18 |
1977-07-19 |
M & T Chemicals Inc. |
Electrodeposition of copper
|
|
US4374709A
(en)
*
|
1980-05-01 |
1983-02-22 |
Occidental Chemical Corporation |
Process for plating polymeric substrates
|
|
US4376685A
(en)
*
|
1981-06-24 |
1983-03-15 |
M&T Chemicals Inc. |
Acid copper electroplating baths containing brightening and leveling additives
|
|
US4490220A
(en)
*
|
1982-09-30 |
1984-12-25 |
Learonal, Inc. |
Electrolytic copper plating solutions
|
|
DE3462259D1
(de)
*
|
1983-07-22 |
1987-03-05 |
Bayer Ag |
Substituted furazans
|
|
US4781801A
(en)
*
|
1987-02-03 |
1988-11-01 |
Mcgean-Rohco, Inc. |
Method of copper plating gravure rolls
|
|
US4786746A
(en)
*
|
1987-09-18 |
1988-11-22 |
Pennsylvania Research Corporation |
Copper electroplating solutions and methods of making and using them
|
|
US4948474A
(en)
*
|
1987-09-18 |
1990-08-14 |
Pennsylvania Research Corporation |
Copper electroplating solutions and methods
|
|
US5403465A
(en)
*
|
1990-05-30 |
1995-04-04 |
Gould Inc. |
Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives
|
|
DE69125573T2
(de)
*
|
1990-05-30 |
1997-07-17 |
Gould Electronics Inc |
ELEKTROPLATTIERTE KUPFERFOLIE UND DEREN HERSTELLUNG UNTER VERWENDUNG ELEKTROLYTISCHER LöSUNGEN MIT NIEDRIGEN KONZENTRATIONEN VON CHLOR IONEN
|
|
DE69110208T2
(de)
*
|
1990-08-03 |
1995-10-19 |
Rohco Inc Mcgean |
Kupferplattieren von Tiefdruckzylindern.
|
|
US6544399B1
(en)
*
|
1999-01-11 |
2003-04-08 |
Applied Materials, Inc. |
Electrodeposition chemistry for filling apertures with reflective metal
|
|
DE10058896C1
(de)
*
|
2000-10-19 |
2002-06-13 |
Atotech Deutschland Gmbh |
Elektrolytisches Kupferbad, dessen Verwendung und Verfahren zur Abscheidung einer matten Kupferschicht
|
|
ATE267278T1
(de)
*
|
2000-10-19 |
2004-06-15 |
Atotech Deutschland Gmbh |
Kupferbad und verfahren zur abscheidung eines matten kupferüberzuges
|
|
WO2003012174A1
(en)
*
|
2001-07-27 |
2003-02-13 |
Pirelli Pneumatici S.P.A. |
Electrolytic process for depositing a layer of copper on a steel wire
|
|
US6652731B2
(en)
*
|
2001-10-02 |
2003-11-25 |
Shipley Company, L.L.C. |
Plating bath and method for depositing a metal layer on a substrate
|
|
US20040074775A1
(en)
*
|
2002-10-21 |
2004-04-22 |
Herdman Roderick Dennis |
Pulse reverse electrolysis of acidic copper electroplating solutions
|
|
US6851200B2
(en)
*
|
2003-03-14 |
2005-02-08 |
Hopkins Manufacturing Corporation |
Reflecting lighted level
|