Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/46—Manufacturing multilayer circuits
  • H05K3/4685—Manufacturing of cross-over conductors
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
  • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
  • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• General Physics & Mathematics (AREA)
• Computer Hardware Design (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Parts Printed On Printed Circuit Boards (AREA)
• Manufacturing Of Printed Circuit Boards (AREA)
• Manufacture Of Motors, Generators (AREA)
• Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
• Manufacturing Of Printed Wiring (AREA)

Applications Claiming Priority (1)

Publications (1)

Family

ID=25248604

Family Applications (1)

Country Status (8)

Families Citing this family (19)

Family Cites Families (3)

• 1969
  • 1969-05-23 US US827215A patent/US3647585A/en not_active Expired - Lifetime
• 1970
  • 1970-05-14 SE SE06627/70A patent/SE353439B/xx unknown
  • 1970-05-19 BE BE750564D patent/BE750564A/xx unknown
  • 1970-05-20 DE DE19702024494 patent/DE2024494B2/de active Pending
  • 1970-05-21 GB GB2456370A patent/GB1308477A/en not_active Expired
  • 1970-05-21 ES ES380665A patent/ES380665A1/es not_active Expired
  • 1970-05-21 NL NL7007353A patent/NL7007353A/xx unknown
  • 1970-05-22 FR FR7018840A patent/FR2044816B1/fr not_active Expired

Also Published As

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