NL6604964A - - Google Patents
Info
- Publication number
- NL6604964A NL6604964A NL6604964A NL6604964A NL6604964A NL 6604964 A NL6604964 A NL 6604964A NL 6604964 A NL6604964 A NL 6604964A NL 6604964 A NL6604964 A NL 6604964A NL 6604964 A NL6604964 A NL 6604964A
- Authority
- NL
- Netherlands
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/20—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device gaseous at the normal operating temperature of the device
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45015—Cross-sectional shape being circular
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H01L2924/01019—Potassium [K]
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- H01L2924/01039—Yttrium [Y]
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- H01L2924/01046—Palladium [Pd]
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- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Die Bonding (AREA)
- Junction Field-Effect Transistors (AREA)
Priority Applications (15)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL6604965A NL6604965A (ja) | 1966-04-14 | 1966-04-14 | |
NL6604964A NL6604964A (ja) | 1966-04-14 | 1966-04-14 | |
NL6704097A NL6704097A (ja) | 1966-04-14 | 1967-03-18 | |
DEN19951U DE1964794U (de) | 1966-04-14 | 1967-04-11 | Halbleitervorrichtung. |
DK199267A DK117909B (da) | 1966-04-14 | 1967-04-11 | Halvlederapparat. |
GB1656667A GB1175122A (en) | 1966-04-14 | 1967-04-11 | Improvements in and relating to Semiconductor Devices |
DE1967N0030311 DE1614236B2 (de) | 1966-04-14 | 1967-04-11 | Halbleiteranordnung |
CH509067A CH476396A (de) | 1966-04-14 | 1967-04-11 | Halbleitervorrichtung und Verfahren zum Betrieb der Halbleitervorrichtung |
AT341867A AT275607B (de) | 1966-04-14 | 1967-04-11 | Halbleitervorrichtung und Schaltung mit einer Halbleitervorrichtung |
ES339180A ES339180A0 (es) | 1966-04-14 | 1967-04-12 | Un dispositivo semiconductor. |
US3476990D US3476990A (en) | 1966-04-14 | 1967-04-12 | Housing and lead structure for high frequency semiconductor device operation |
SE508267A SE342359B (ja) | 1966-04-14 | 1967-04-12 | |
BR18857967A BR6788579D0 (pt) | 1966-04-14 | 1967-04-13 | Um dispositivo semi-condutor |
BE697075D BE697075A (ja) | 1966-04-14 | 1967-04-14 | |
FR102840A FR1524436A (fr) | 1966-04-14 | 1967-04-14 | Dispositif semi-conducteur et circuit équipé d'un tel dispositif |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL6604965A NL6604965A (ja) | 1966-04-14 | 1966-04-14 | |
NL6604964A NL6604964A (ja) | 1966-04-14 | 1966-04-14 | |
NL6704097A NL6704097A (ja) | 1966-04-14 | 1967-03-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
NL6604964A true NL6604964A (ja) | 1967-10-16 |
Family
ID=27351363
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL6604965A NL6604965A (ja) | 1966-04-14 | 1966-04-14 | |
NL6604964A NL6604964A (ja) | 1966-04-14 | 1966-04-14 | |
NL6704097A NL6704097A (ja) | 1966-04-14 | 1967-03-18 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL6604965A NL6604965A (ja) | 1966-04-14 | 1966-04-14 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL6704097A NL6704097A (ja) | 1966-04-14 | 1967-03-18 |
Country Status (11)
Country | Link |
---|---|
US (1) | US3476990A (ja) |
AT (1) | AT275607B (ja) |
BE (1) | BE697075A (ja) |
BR (1) | BR6788579D0 (ja) |
CH (1) | CH476396A (ja) |
DE (1) | DE1614236B2 (ja) |
DK (1) | DK117909B (ja) |
ES (1) | ES339180A0 (ja) |
GB (1) | GB1175122A (ja) |
NL (3) | NL6604965A (ja) |
SE (1) | SE342359B (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2250918C2 (de) * | 1971-10-27 | 1982-02-04 | Westinghouse Electric Corp., 15222 Pittsburgh, Pa. | Chipträger für Mikrowellen-Leistungstransistoren und Verfahren zu seiner Herstellung |
DE3106376A1 (de) * | 1981-02-20 | 1982-09-09 | Siemens AG, 1000 Berlin und 8000 München | Halbleiteranordnung mit aus blech ausgeschnittenen anschlussleitern |
GB2150747B (en) * | 1983-12-02 | 1987-04-23 | Philips Electronic Associated | Pyroelectric infra-red radiation detector |
EP0439653A1 (de) * | 1990-01-31 | 1991-08-07 | Siemens Aktiengesellschaft | Hochfrequenz-SMD-Transistor mit zwei Emitteranschlüssen |
EP0439656B1 (de) * | 1990-01-31 | 2001-05-16 | Infineon Technologies AG | Chipträger für ein Mikrowellen-Halbleiterbauelement |
EP0439652A1 (de) * | 1990-01-31 | 1991-08-07 | Siemens Aktiengesellschaft | Hochfrequenz-SMD-Transistor mit zwei Emitteranschlüssen |
JP3913574B2 (ja) * | 2002-02-27 | 2007-05-09 | 三洋電機株式会社 | 半導体装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2903630A (en) * | 1956-09-21 | 1959-09-08 | Rca Corp | Semiconductor devices |
US2985806A (en) * | 1958-12-24 | 1961-05-23 | Philco Corp | Semiconductor fabrication |
US3171187A (en) * | 1962-05-04 | 1965-03-02 | Nippon Electric Co | Method of manufacturing semiconductor devices |
US3264712A (en) * | 1962-06-04 | 1966-08-09 | Nippon Electric Co | Semiconductor devices |
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1966
- 1966-04-14 NL NL6604965A patent/NL6604965A/xx unknown
- 1966-04-14 NL NL6604964A patent/NL6604964A/xx unknown
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1967
- 1967-03-18 NL NL6704097A patent/NL6704097A/xx unknown
- 1967-04-11 CH CH509067A patent/CH476396A/de not_active IP Right Cessation
- 1967-04-11 AT AT341867A patent/AT275607B/de active
- 1967-04-11 GB GB1656667A patent/GB1175122A/en not_active Expired
- 1967-04-11 DE DE1967N0030311 patent/DE1614236B2/de not_active Ceased
- 1967-04-11 DK DK199267A patent/DK117909B/da not_active IP Right Cessation
- 1967-04-12 SE SE508267A patent/SE342359B/xx unknown
- 1967-04-12 ES ES339180A patent/ES339180A0/es active Pending
- 1967-04-12 US US3476990D patent/US3476990A/en not_active Expired - Lifetime
- 1967-04-13 BR BR18857967A patent/BR6788579D0/pt unknown
- 1967-04-14 BE BE697075D patent/BE697075A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CH476396A (de) | 1969-07-31 |
GB1175122A (en) | 1969-12-23 |
SE342359B (ja) | 1972-01-31 |
NL6604965A (ja) | 1967-10-16 |
ES339180A0 (es) | 1968-04-16 |
BR6788579D0 (pt) | 1973-12-27 |
AT275607B (de) | 1969-10-27 |
DE1614236B2 (de) | 1977-06-08 |
DK117909B (da) | 1970-06-15 |
NL6704097A (ja) | 1968-09-19 |
BE697075A (ja) | 1967-10-16 |
US3476990A (en) | 1969-11-04 |
DE1614236A1 (de) | 1970-08-20 |