NL2002362C - SUBSTRATE HOLDER FOR GAS DIFFUSION OVENS. - Google Patents
SUBSTRATE HOLDER FOR GAS DIFFUSION OVENS. Download PDFInfo
- Publication number
- NL2002362C NL2002362C NL2002362A NL2002362A NL2002362C NL 2002362 C NL2002362 C NL 2002362C NL 2002362 A NL2002362 A NL 2002362A NL 2002362 A NL2002362 A NL 2002362A NL 2002362 C NL2002362 C NL 2002362C
- Authority
- NL
- Netherlands
- Prior art keywords
- substrate holder
- boat
- holder according
- guide
- support bars
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
- H01L21/67306—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by a material, a roughness, a coating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
- H01L21/67316—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements characterized by a material, a roughness, a coating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
- H01L21/67343—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates characterized by a material, a roughness, a coating or the like
Description
Substraathouder voor gasdiffusie-ovensSubstrate holder for gas diffusion furnaces
In gasdiffusie-ovens worden in een thermisch geïnduceerd gasfasediffusieproces chemische reacties op het oppervlak van substraten uitgevoerd. Dergelijke gasdiffusie-5 ovens omvatten meestal een houdersysteem met een groot volume voor de opname van meerdere substraten en zijn meestal met een inrichting voor het produceren van een vacuüm verbonden. Verder zijn deze gasdiffusic-ovcns voorzien van verwarmingsinrichtin-gen, die voor de gerichte opwarming respectievelijk temperatuurgeleiding van de substraten geschikt zijn. Bij deze verwarmingsinrichtingen betreft het vaak aan de buiten-10 zijde aangebrachte verwarmingselementen, die door stralingsverwarming de substraten verwarmen. In speciale gasdiffusie-ovens, waarbij reactiegassen worden toegepast, die agressief reageren met metaaloppervlakken, wordt als constructiemateriaal voor het houdersysteem kwarts toegepast. Dit vatsysteem uit kwartsglas maakt het mogelijk, dat de warmtestraling van de buiten de houder of het vat aangebrachte stralingsverwarming de 15 substraten onbelemmerd bereikt en de opwarming daarvan tot gevolg heeft.In gas diffusion furnaces, chemical reactions are carried out on the surface of substrates in a thermally induced gas phase diffusion process. Such gas diffusion furnaces usually comprise a large volume container system for receiving multiple substrates and are usually connected to a device for producing a vacuum. Furthermore, these gas diffusic furnaces are provided with heating devices which are suitable for the targeted heating or temperature conduction of the substrates. These heating devices are heating elements which are often arranged on the outside and which heat the substrates by radiant heating. In special gas diffusion furnaces, in which reaction gases are used which react aggressively with metal surfaces, quartz is used as the construction material for the container system. This vessel system made of quartz glass makes it possible for the heat radiation of the radiation heating arranged outside the container or vessel to reach the substrates without hindrance and to result in the heating thereof.
De substraten zelf zijn in een op overeenkomstige wijze uitgevoerde draagconstructie of carrier, ook "boot" genoemd, naast elkaar aangebracht. De boot is meestal aan de bovenste dwarsdragers daarvan in zogenaamde vorken ingehangen om deze in de oven in positie te houden. Deze boot moet naast de mechanische belastingen, 20 die door het gewicht van de substraten ontstaan, ook de chemische belastingen door de toegepaste reactieve gassen bij de optredende temperaturen weerstaan.The substrates themselves are arranged next to each other in a supporting construction or carrier, also referred to as "boat", in a corresponding manner. The boat is usually hung in so-called forks on its upper crossbars to hold it in position in the oven. In addition to the mechanical loads created by the weight of the substrates, this boat must also withstand the chemical loads caused by the reactive gases used at the temperatures that arise.
Op typische wijze zijn dergelijke boten uit kwartsglas vervaardigd, omdat kwarts ook bij hoge temperaturen chemisch niet reageert met de reactieve gassen. Omdat kwarts voor warmtestraling transparant is, kunnen de afzonderlijke segmenten van een derge-25 lijke kwartsboot met een dikte worden uitgevoerd, die voldoende is om de noodzakelijke mechanische stevigheid te verkrijgen. Nadelen daarvan zijn naast de geringe mechanische belastbaarheid met betrekking tot druk van de substraten in de vasthoudsleuven en de opnamepunten en eventuele stoten ook de hogere gasstroomweerstand van dergelijke dikke kwartssegmenten, die een homogene gasverdeling belemmeren.Typically, such boats are made of quartz glass because quartz does not react chemically with the reactive gases even at high temperatures. Because quartz is transparent to heat radiation, the individual segments of such a quartz boat can be made with a thickness sufficient to obtain the necessary mechanical strength. Disadvantages thereof are, in addition to the low mechanical load-bearing capacity with respect to the pressure of the substrates in the holding slots and the receiving points and possible shocks, also the higher gas flow resistance of such thick quartz segments, which obstruct a homogeneous gas distribution.
30 Tijdens de opwarm- en aanhoud- en afkoelfases ontstaat een duidelijke verbuiging van de substraten in een horizontale richting. Daarbij moet erop gelet worden, dat de verbuiging van de buitenste beide substraten ten opzichte van de substraatstapel of batch als laatste begint en als eerste teruggaat, terwijl de verder aan de binnenzijde aangebrachte 2 substraten langer verbogen blijven respectievelijk horizontaal afgebogen blijven. Bij een te geringe afstand van de buitenste schijven ten opzichte van de eerstvolgende binnenste schijf kan het daarbij tot het contact van de substraten tot aan de breuk van de substraten of van de boot komen.During the heating, holding and cooling phases a clear bending of the substrates occurs in a horizontal direction. It must be ensured here that the bending of the outer two substrates relative to the substrate stack or batch starts last and goes back first, while the further 2 substrates arranged on the inside remain bent for longer or remain bent horizontally. If the distance between the outer discs and the next inner disc is too small, the contact of the substrates up to the breakage of the substrates or of the boat can occur.
5 Voor de verbetering van bekende substraathouders dienen geschikte materialen en een geschikt design voor de boot worden gevonden, waarbij in dezelfde mate rekening wordt gehouden met de mechanische, thermische en chemische aspecten.For the improvement of known substrate holders, suitable materials and a suitable design for the boat must be found, taking into account the mechanical, thermal and chemical aspects to the same extent.
Derhalve wordt voorgesteld om bij een substraathouder voor gasdiffusie-ovens alternatief of cumulatief een of meer van de volgende kenmerken toe te passen: 10 de boot is uit corrosievast en chemisch bestendige metalen of gelijkwaardig mechanisch stabiele materialen, bijvoorbeeld molybdeen of CFC ( Carbon Fiber reinforced Carbon = met koolstofvezels versterkte koolstof) vervaardigd, die een hoge stevigheid hebben, mechanisch en chemisch voldoende stabiel zijn en geen ongewenste contaminatie van de substraatbekleding bewerkstelligen.It is therefore proposed to use one or more of the following characteristics with a substrate holder for gas diffusion furnaces: the boat is made of corrosion-resistant and chemically resistant metals or equivalent mechanically stable materials, for example molybdenum or CFC (Carbon Fiber reinforced Carbon) = carbon fiber reinforced carbon), which have a high rigidity, are mechanically and chemically sufficiently stable and do not cause undesired contamination of the substrate coating.
15 De afzonderlijke dwars- en langssegmenten van de boot bestaan uit staven, die voldoende dun zijn en die de gasstroom slechts minimaal belemmeren.The individual transverse and longitudinal segments of the boat consist of rods which are sufficiently thin and only impede the gas flow to a minimum.
Ten minste twee onderste supportstaven, waarop de substraten zich bevinden, zijn met betrekking tot de geometrische substraatafmeting ver aan de buitenzijde aangebracht om de wrijvingskracht tussen substraat en oplegpunt, veroorzaakt door de substraatver-20 buiging, te verminderen.At least two lower support bars, on which the substrates are located, are arranged far on the outside with respect to the geometric substrate dimension to reduce the frictional force between the substrate and the support point caused by the substrate deflection.
De supportstaven zijn voldoende lang, zodat de substraten ook bij een duidelijke verbuiging tijdens het verwarmen of koelen niet van deze onderste staven af kunnen glijden.The support bars are sufficiently long so that the substrates cannot slide off these lower bars even when there is a clear bending during heating or cooling.
De onderste supportstaven zijn axiaal symmetrisch en eventueel rolbaar op de 25 onderste langsdragers van de boot vormgegeven om de wrijvingskracht tussen substraat en oplegpunt, veroorzaakt door de substraat- en bootuitzetting, te verminderen.The lower support bars are axially symmetrical and possibly rollable on the lower longitudinal carriers of the boat to reduce the frictional force between the substrate and the support point caused by the substrate and boat expansion.
De onderste supportstaven hebben geleidingssleuven respectievelijk geleidingsuitsparingen of -rillen om de vereiste substraatafstand onderling te garanderen.The lower support bars have guide slots or guide recesses or grooves to guarantee the required substrate spacing.
De substraten zijn aan de kopzijden in geleidingssleuven of geleidingsuitsparingen 30 van de boot geleid om de vereiste substraatafstand onderling te garanderen.The substrates are guided at the head sides in guide slots or guide recesses 30 of the boat to guarantee the required substrate spacing.
De geleidingssleuven respectievelijk geleidingsuitsparingen van de boot en eventueel van de onderste supportstaven zijn niet equidistant.The guide slots or guide recesses of the boat and possibly of the lower support bars are not equidistant.
33
Ten minste de beide steeds buitenste geleidingssleuven respectievelijk geleidingsuitsparingen van de boot en eventueel van de onderste supportstaven hebben een grotere afstand ten opzichte van de in een binnenwaartse richting meest nabij liggende binnenste geleidingssleuven respectievelijk geleidingsuitsparingen van de boot en 5 eventueel van de onderste supportstaven dan alle verdere binnenste geleidingssleuven respectievelijk geleidingsuitsparingen van de boot.At least the two always outer guide slots or guide recesses of the boat and optionally of the lower support bars have a greater distance from the inner guide slots or guide recesses of the boat and closest to an inward direction of the lower support bars than all further inner guide slots or guide recesses of the boat.
De afstanden van de geleidingssleuven respectievelijk geleidingsuitsparingen van de boot en eventueel van de onderste supportstaven worden van het midden aan de binnenzijde beginnend naar de buitenzijde steeds groter.The distances of the guide slots or guide recesses of the boat and possibly of the lower support bars are increasing from the center on the inside to the outside.
1010
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007063017 | 2007-12-21 | ||
DE200710063017 DE102007063017B4 (en) | 2007-12-21 | 2007-12-21 | Substrate support for gas diffusion furnaces |
Publications (2)
Publication Number | Publication Date |
---|---|
NL2002362A1 NL2002362A1 (en) | 2009-06-23 |
NL2002362C true NL2002362C (en) | 2010-03-18 |
Family
ID=40689959
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL2002362A NL2002362C (en) | 2007-12-21 | 2008-12-22 | SUBSTRATE HOLDER FOR GAS DIFFUSION OVENS. |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE102007063017B4 (en) |
NL (1) | NL2002362C (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120168143A1 (en) * | 2010-12-30 | 2012-07-05 | Poole Ventura, Inc. | Thermal Diffusion Chamber With Heat Exchanger |
DE102013105818B4 (en) | 2013-06-06 | 2017-01-26 | Von Ardenne Gmbh | Housing for receiving a plurality of plate-shaped substrates |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4572101A (en) * | 1983-05-13 | 1986-02-25 | Asq Boats, Inc. | Side lifting wafer boat assembly |
US4996436A (en) * | 1989-03-07 | 1991-02-26 | French State Represented By The Minister Of Post, Telecommunications And Space | Automatic apparatus for controlling the size of wafer-supporting boats |
WO1991017839A1 (en) * | 1990-05-18 | 1991-11-28 | Bp Chemicals (Hitco) Inc. | Materials for chemical vapor deposition processes |
JPH0410530A (en) * | 1990-04-27 | 1992-01-14 | Toshiba Ceramics Co Ltd | Diffusion boat for semiconductor |
US5782979A (en) * | 1993-04-22 | 1998-07-21 | Mitsubishi Denki Kabushiki Kaisha | Substrate holder for MOCVD |
US6227590B1 (en) * | 1996-05-17 | 2001-05-08 | Micron Technology, Inc. | Method of constructing a wafer carrier |
US20050205501A1 (en) * | 2004-03-18 | 2005-09-22 | Juan Chuang | Reformed wafer boat |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3183131A (en) * | 1961-08-23 | 1965-05-11 | Motorola Inc | Semiconductor diffusion method |
US4355974A (en) * | 1980-11-24 | 1982-10-26 | Asq Boats, Inc. | Wafer boat |
EP0100539A3 (en) * | 1982-07-30 | 1985-05-22 | Tecnisco Ltd. | Assembled device for supporting semiconductor wafers or the like |
DE3807710A1 (en) * | 1988-03-09 | 1989-09-21 | Heraeus Schott Quarzschmelze | Support trestle |
JP2878399B2 (en) * | 1990-06-12 | 1999-04-05 | 東芝セラミックス株式会社 | Carbon jig for semiconductor diffusion furnace |
-
2007
- 2007-12-21 DE DE200710063017 patent/DE102007063017B4/en not_active Expired - Fee Related
-
2008
- 2008-12-22 NL NL2002362A patent/NL2002362C/en not_active IP Right Cessation
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4572101A (en) * | 1983-05-13 | 1986-02-25 | Asq Boats, Inc. | Side lifting wafer boat assembly |
US4996436A (en) * | 1989-03-07 | 1991-02-26 | French State Represented By The Minister Of Post, Telecommunications And Space | Automatic apparatus for controlling the size of wafer-supporting boats |
JPH0410530A (en) * | 1990-04-27 | 1992-01-14 | Toshiba Ceramics Co Ltd | Diffusion boat for semiconductor |
WO1991017839A1 (en) * | 1990-05-18 | 1991-11-28 | Bp Chemicals (Hitco) Inc. | Materials for chemical vapor deposition processes |
US5782979A (en) * | 1993-04-22 | 1998-07-21 | Mitsubishi Denki Kabushiki Kaisha | Substrate holder for MOCVD |
US6227590B1 (en) * | 1996-05-17 | 2001-05-08 | Micron Technology, Inc. | Method of constructing a wafer carrier |
US20050205501A1 (en) * | 2004-03-18 | 2005-09-22 | Juan Chuang | Reformed wafer boat |
Also Published As
Publication number | Publication date |
---|---|
DE102007063017A1 (en) | 2009-06-25 |
NL2002362A1 (en) | 2009-06-23 |
DE102007063017B4 (en) | 2012-03-01 |
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