NL187456C - Werkwijze voor het vervaardigen van een legitimatiekaart of dergelijke. - Google Patents

Werkwijze voor het vervaardigen van een legitimatiekaart of dergelijke.

Info

Publication number
NL187456C
NL187456C NLAANVRAGE8102393,A NL8102393A NL187456C NL 187456 C NL187456 C NL 187456C NL 8102393 A NL8102393 A NL 8102393A NL 187456 C NL187456 C NL 187456C
Authority
NL
Netherlands
Prior art keywords
manufacturing
certificate card
certificate
card
Prior art date
Application number
NLAANVRAGE8102393,A
Other languages
English (en)
Other versions
NL187456B (nl
NL8102393A (nl
Original Assignee
Gao Ges Automation Org
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gao Ges Automation Org filed Critical Gao Ges Automation Org
Publication of NL8102393A publication Critical patent/NL8102393A/nl
Publication of NL187456B publication Critical patent/NL187456B/nl
Application granted granted Critical
Publication of NL187456C publication Critical patent/NL187456C/nl

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12043—Photo diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S283/00—Printed matter
    • Y10S283/904—Credit card
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y10T428/24331—Composite web or sheet including nonapertured component

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Credit Cards Or The Like (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
NLAANVRAGE8102393,A 1980-05-20 1981-05-15 Werkwijze voor het vervaardigen van een legitimatiekaart of dergelijke. NL187456C (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19803019207 DE3019207A1 (de) 1980-05-20 1980-05-20 Traegerelement fuer einen ic-chip
DE3019207 1980-05-20

Publications (3)

Publication Number Publication Date
NL8102393A NL8102393A (nl) 1981-12-16
NL187456B NL187456B (nl) 1991-05-01
NL187456C true NL187456C (nl) 1991-10-01

Family

ID=6102851

Family Applications (1)

Application Number Title Priority Date Filing Date
NLAANVRAGE8102393,A NL187456C (nl) 1980-05-20 1981-05-15 Werkwijze voor het vervaardigen van een legitimatiekaart of dergelijke.

Country Status (10)

Country Link
US (2) US4474292A (nl)
JP (1) JPS5710258A (nl)
BE (1) BE888851A (nl)
CH (1) CH654952A5 (nl)
DE (1) DE3019207A1 (nl)
FR (1) FR2483128B1 (nl)
GB (1) GB2076223B (nl)
IT (1) IT1135843B (nl)
NL (1) NL187456C (nl)
SE (1) SE461693B (nl)

Families Citing this family (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3029667A1 (de) * 1980-08-05 1982-03-11 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-baustein
US4501960A (en) * 1981-06-22 1985-02-26 Motorola, Inc. Micropackage for identification card
DE3248385A1 (de) * 1982-12-28 1984-06-28 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit integriertem schaltkreis
FR2580416B1 (fr) * 1985-04-12 1987-06-05 Radiotechnique Compelec Procede et dispositif pour fabriquer une carte d'identification electronique
FR2588695B1 (fr) * 1985-10-11 1988-07-29 Eurotechnique Sa Procede de fabrication d'un microboitier, microboitier a contacts effleurants et application aux cartes contenant des composants
FR2590052B1 (fr) * 1985-11-08 1991-03-01 Eurotechnique Sa Procede de recyclage d'une carte comportant un composant, carte prevue pour etre recyclee
FR2590051B1 (fr) * 1985-11-08 1991-05-17 Eurotechnique Sa Carte comportant un composant et micromodule a contacts de flanc
JPS6283672U (nl) * 1985-11-12 1987-05-28
US4742215A (en) * 1986-05-07 1988-05-03 Personal Computer Card Corporation IC card system
FR2599893B1 (fr) * 1986-05-23 1996-08-02 Ricoh Kk Procede de montage d'un module electronique sur un substrat et carte a circuit integre
KR910004797B1 (ko) * 1987-04-08 1991-07-13 가시오 게이상기 가부시기가이샤 소형 전자기기 및 그 제조방법
GB2205683B (en) * 1987-04-08 1990-08-22 Casio Computer Co Ltd An electronic apparatus and a method for manufacturing the same
US4827376A (en) * 1987-10-05 1989-05-02 Olin Corporation Heat dissipating interconnect tape for use in tape automated bonding
US4849857A (en) * 1987-10-05 1989-07-18 Olin Corporation Heat dissipating interconnect tape for use in tape automated bonding
FR2625067A1 (fr) * 1987-12-22 1989-06-23 Sgs Thomson Microelectronics Procede pour fixer sur un support un composant electronique et ses contacts
FR2627879B1 (fr) * 1988-02-26 1990-06-15 Sgs Thomson Microelectronics Procede d'encartage pour cartes a puces
DE3809005A1 (de) * 1988-03-17 1989-09-28 Hitachi Semiconductor Europ Gm Chipmodul und seine herstellung und verwendung
US4931906A (en) * 1988-03-25 1990-06-05 Unitrode Corporation Hermetically sealed, surface mountable component and carrier for semiconductor devices
JPH07122713B2 (ja) * 1988-07-11 1995-12-25 株式会社東芝 フレキシブル配線基板及びその製造方法及び電子部品
USRE35578E (en) * 1988-12-12 1997-08-12 Sgs-Thomson Microelectronics, Inc. Method to install an electronic component and its electrical connections on a support, and product obtained thereby
USRE35385E (en) * 1988-12-12 1996-12-03 Sgs-Thomson Microelectronics, Sa. Method for fixing an electronic component and its contacts to a support
US5041396A (en) * 1989-07-18 1991-08-20 Vlsi Technology, Inc. Reusable package for holding a semiconductor chip and method for reusing the package
US5006963A (en) * 1989-12-18 1991-04-09 Mcdonnell Douglas Corporation Selectable chip carrier
EP0463758A1 (en) * 1990-06-22 1992-01-02 Digital Equipment Corporation Hollow chip package and method of manufacture
FR2673017A1 (fr) * 1991-02-18 1992-08-21 Schlumberger Ind Sa Procede de fabrication d'un module electronique pour carte a memoire et module electronique ainsi obtenu.
US5210375A (en) * 1991-06-28 1993-05-11 Vlsi Technology, Inc. Electronic device package--carrier assembly ready to be mounted onto a substrate
DE4122049A1 (de) * 1991-07-03 1993-01-07 Gao Ges Automation Org Verfahren zum einbau eines traegerelements
JPH05169885A (ja) * 1991-12-26 1993-07-09 Mitsubishi Electric Corp 薄型ｉｃカード
US5255430A (en) * 1992-10-08 1993-10-26 Atmel Corporation Method of assembling a module for a smart card
US5477611A (en) * 1993-09-20 1995-12-26 Tessera, Inc. Method of forming interface between die and chip carrier
DE4336501A1 (de) * 1993-10-26 1995-04-27 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Ausweiskarten mit elektronischen Modulen
US5834339A (en) 1996-03-07 1998-11-10 Tessera, Inc. Methods for providing void-free layers for semiconductor assemblies
US5776796A (en) * 1994-05-19 1998-07-07 Tessera, Inc. Method of encapsulating a semiconductor package
ES2135656T3 (es) * 1994-06-15 1999-11-01 Rue Cartes Et Systemes De Procedimiento de fabricacion y ensamblaje de una tarjeta con circuito integrado.
DE4421607A1 (de) * 1994-06-21 1996-01-04 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Datenträgern
CA2199041A1 (en) * 1994-09-02 1996-03-14 Victor Chartrand Multimedia golf handicap interactive touch-screen system with electronic card
US5929517A (en) 1994-12-29 1999-07-27 Tessera, Inc. Compliant integrated circuit package and method of fabricating the same
US5817207A (en) 1995-10-17 1998-10-06 Leighton; Keith R. Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards
EP0774888B1 (en) 1995-11-16 2003-03-19 Matsushita Electric Industrial Co., Ltd Printed wiring board and assembly of the same
US6013948A (en) 1995-11-27 2000-01-11 Micron Technology, Inc. Stackable chip scale semiconductor package with mating contacts on opposed surfaces
US5674785A (en) * 1995-11-27 1997-10-07 Micron Technology, Inc. Method of producing a single piece package for semiconductor die
US6861290B1 (en) * 1995-12-19 2005-03-01 Micron Technology, Inc. Flip-chip adaptor package for bare die
US5986890A (en) * 1995-12-22 1999-11-16 Giesecke & Devrient Gmbh Semifinished product with an electronic module
DE19607212C1 (de) * 1996-02-26 1997-04-10 Richard Herbst Verbundkörper, Verfahren und Kunststoff-Spritzgießwerkzeug zur Herstellung eines solchen
JPH09327990A (ja) * 1996-06-11 1997-12-22 Toshiba Corp カード型記憶装置
JP2777114B2 (ja) * 1996-09-02 1998-07-16 株式会社日立製作所 テープキャリア
US6664616B2 (en) * 1996-11-21 2003-12-16 Hitachi, Ltd. Semiconductor device and manufacturing method thereof
DE19745648A1 (de) * 1997-10-15 1998-11-26 Siemens Ag Trägerelement für einen Halbleiterchip zum Einbau in Chipkarten
US6208019B1 (en) 1998-03-13 2001-03-27 Kabushiki Kaisha Toshiba Ultra-thin card-type semiconductor device having an embredded semiconductor element in a space provided therein
USRE43112E1 (en) 1998-05-04 2012-01-17 Round Rock Research, Llc Stackable ball grid array package
DE19858343A1 (de) * 1998-12-17 2000-06-21 Giesecke & Devrient Gmbh Verfahren und Vorrichtung zum Herstellen von personalisierten Chipkarten
DE19903652B4 (de) * 1999-01-29 2005-04-14 Ab Elektronik Gmbh Verfahren zur Herstellung von gehäusten Schaltkreiseinheiten
US6214640B1 (en) 1999-02-10 2001-04-10 Tessera, Inc. Method of manufacturing a plurality of semiconductor packages
GB2352999A (en) * 1999-07-21 2001-02-14 Allan Walter Sills Smart card with chip carrier with contact pads fitted into aperture of card base
DE19953322B4 (de) * 1999-11-05 2005-12-15 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Handhabungselement für Kleinteile und Verfahren zur Herstellung
US6565380B1 (en) * 2001-02-27 2003-05-20 Mobigence, Inc. Battery contact arrangement
FR2824018B1 (fr) 2001-04-26 2003-07-04 Arjo Wiggins Sa Couverture incorporant un dispositif d'identification radiofrequence
DE10135572A1 (de) * 2001-07-20 2003-02-13 Infineon Technologies Ag Löt- und klebbares Gehäuse für Chipmodul und Chipmodul
MXPA04002588A (es) * 2001-09-18 2004-06-18 Nagraid Sa Etiqueta electronica de poco espesor y metodo para la fabricacion de la misma.
DE10297316T5 (de) * 2001-10-09 2004-12-09 Tessera, Inc., San Jose Gestapelte Baugruppen
US6977440B2 (en) * 2001-10-09 2005-12-20 Tessera, Inc. Stacked packages
US7335995B2 (en) * 2001-10-09 2008-02-26 Tessera, Inc. Microelectronic assembly having array including passive elements and interconnects
AU2003266825A1 (en) * 2002-05-08 2003-11-11 Drexler Technology Corporation Method of making secure personal data card
WO2005057479A1 (ja) 2003-12-10 2005-06-23 Oji Paper Co., Ltd. Ｉｃチップ内蔵テープ及びｉｃチップ内蔵シート
JP4334335B2 (ja) * 2003-12-24 2009-09-30 三洋電機株式会社 混成集積回路装置の製造方法
JP4500060B2 (ja) * 2004-01-26 2010-07-14 トッパン・フォームズ株式会社 スレッド及びその製造方法、シート
JP4504693B2 (ja) * 2004-01-30 2010-07-14 トッパン・フォームズ株式会社 スレッド、ｉｃチップ入りシート及びその製造方法
FR2877462B1 (fr) * 2004-10-29 2007-01-26 Arjowiggins Security Soc Par A Structure comportant un dispositif electronique pour la fabrication d'un document de securite.
EP1724712A1 (fr) * 2005-05-11 2006-11-22 Stmicroelectronics Sa Micromodule, notamment pour carte à puce
KR100651563B1 (ko) * 2005-07-07 2006-11-29 삼성전기주식회사 전자부품이 내장된 배선기판의 제조방법
FR2892842B1 (fr) * 2005-10-28 2008-02-15 Oberthur Card Syst Sa Procede de fabrication d'une pluralite de cartes a microcircuit
DE102006055576A1 (de) * 2006-11-21 2008-05-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Herstellen eines dehnbaren Schaltungsträgers und dehnbarer Schaltungsträger
US10804188B2 (en) 2018-09-07 2020-10-13 Intel Corporation Electronic device including a lateral trace

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL121501C (nl) * 1959-12-16
US3385426A (en) * 1966-03-18 1968-05-28 Sprague Electric Co Lead protecting structure
US3484534A (en) * 1966-07-29 1969-12-16 Texas Instruments Inc Multilead package for a multilead electrical device
US3417865A (en) * 1966-10-03 1968-12-24 Signetics Corp Flat package carrier block and assembly
NL6714336A (nl) * 1967-10-21 1969-04-23
DE1909480C2 (de) * 1968-03-01 1984-10-11 General Electric Co., Schenectady, N.Y. Trägeranordnung und Verfahren zur elektrischen Kontaktierung von Halbleiterchips
US3570115A (en) * 1968-05-06 1971-03-16 Honeywell Inc Method for mounting electronic chips
DE1915501C3 (de) * 1969-03-26 1975-10-16 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zum Verbinden einer integrierten Schaltung mit äußeren elektrischen Zuleitungen
DE2150828C3 (de) * 1970-10-13 1974-02-14 International Harvester Co., Chicago, Ill. (V.St.A.) Vorrichtung zur Beeinflussung der Hubendgeschwindigkeit eines in einem Zylinder verschiebbar geführten, mit einem Dämpfungsglied versehenen Kolbens
DE2151765C2 (de) * 1970-11-05 1983-06-16 Honeywell Information Systems Italia S.p.A., Caluso, Torino Verfahren zum Kontaktieren von integrierten Schaltungen mit Beam-Lead-Anschlüssen
US3858721A (en) * 1971-10-01 1975-01-07 Western Electric Co Loading of compliant tape
US3838984A (en) * 1973-04-16 1974-10-01 Sperry Rand Corp Flexible carrier and interconnect for uncased ic chips
FR2238247B1 (nl) * 1973-06-27 1976-11-12 Honeywell Bull Soc Ind
DE2414297C3 (de) * 1974-03-25 1980-01-17 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zur teilautomatischen Herstellung von Zwischenträgern für Halbleiterbauelemente
JPS50137445A (nl) * 1974-04-18 1975-10-31
JPS51112177A (en) * 1975-03-27 1976-10-04 Mitsubishi Electric Corp Semiconductor equipment
US3984620A (en) * 1975-06-04 1976-10-05 Raytheon Company Integrated circuit chip test and assembly package
DE2528119A1 (de) * 1975-06-24 1977-01-20 Siemens Ag Elektrisch leitendes band
US3994394A (en) * 1975-10-02 1976-11-30 Hewlett-Packard Company Shipping package for semiconductor devices
US4216577A (en) * 1975-12-31 1980-08-12 Compagnie Internationale Pour L'informatique Cii-Honeywell Bull (Societe Anonyme) Portable standardized card adapted to provide access to a system for processing electrical signals and a method of manufacturing such a card
FR2337381A1 (fr) * 1975-12-31 1977-07-29 Honeywell Bull Soc Ind Carte portative pour systeme de traitement de signaux electriques et procede de fabrication de cette carte
US4222516A (en) * 1975-12-31 1980-09-16 Compagnie Internationale Pour L'informatique Cii-Honeywell Bull Standardized information card
US4034854A (en) * 1976-07-16 1977-07-12 M I Systems, Inc. Electrode package
JPS5357971A (en) * 1976-11-05 1978-05-25 Matsushita Electric Ind Co Ltd Production of semiconductor device
US4142287A (en) * 1976-12-27 1979-03-06 Amp Incorporated Electrical devices such as watches and method of construction thereof
FR2395609A1 (fr) * 1977-06-24 1979-01-19 Radiotechnique Compelec Panneau generateur a cellules solaires noyees dans un stratifie et procede pour l'obtenir
JPS53117172U (nl) * 1978-02-09 1978-09-18
FR2438339A1 (fr) * 1978-10-05 1980-04-30 Suisse Horlogerie Liaison electrique d'un circuit integre
DE2920012B1 (de) * 1979-05-17 1980-11-20 Gao Ges Automation Org Ausweiskarte mit IC-Baustein und Verfahren zur Herstellung einer derartigen Ausweiskarte
DE3123198C2 (de) * 1980-12-08 1993-10-07 Gao Ges Automation Org Trägerelemente für einen IC-Baustein

Also Published As

Publication number Publication date
US4474292A (en) 1984-10-02
DE3019207C2 (nl) 1989-11-23
BE888851A (fr) 1981-09-16
SE8102962L (sv) 1981-11-21
JPS5710258A (en) 1982-01-19
CH654952A5 (de) 1986-03-14
GB2076223A (en) 1981-11-25
FR2483128B1 (fr) 1986-08-22
NL187456B (nl) 1991-05-01
SE461693B (sv) 1990-03-12
JPH041499B2 (nl) 1992-01-13
NL8102393A (nl) 1981-12-16
IT1135843B (it) 1986-08-27
US4829666A (en) 1989-05-16
IT8121778A0 (it) 1981-05-18
DE3019207A1 (de) 1981-11-26
FR2483128A1 (fr) 1981-11-27
GB2076223B (en) 1985-04-17

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