NL172085C - METHOD FOR PREPARING A BATH FOR ELECTROLYTIC DEPOSITION OF DUCTILE, GLOSSY COPPER, AND USE OF THE BATH PREPARED FOR ELECTROLYTIC COATING OF A DUCTILE, GLOSSY COPPER LAYER ON A SUBSTRATE. - Google Patents

METHOD FOR PREPARING A BATH FOR ELECTROLYTIC DEPOSITION OF DUCTILE, GLOSSY COPPER, AND USE OF THE BATH PREPARED FOR ELECTROLYTIC COATING OF A DUCTILE, GLOSSY COPPER LAYER ON A SUBSTRATE.

Info

Publication number
NL172085C
NL172085C NLAANVRAGE7100321,A NL7100321A NL172085C NL 172085 C NL172085 C NL 172085C NL 7100321 A NL7100321 A NL 7100321A NL 172085 C NL172085 C NL 172085C
Authority
NL
Netherlands
Prior art keywords
ductile
bath
glossy copper
electrolytic
preparing
Prior art date
Application number
NLAANVRAGE7100321,A
Other languages
Dutch (nl)
Other versions
NL7100321A (en
Original Assignee
Udylite Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Udylite Corp filed Critical Udylite Corp
Publication of NL7100321A publication Critical patent/NL7100321A/xx
Application granted granted Critical
Publication of NL172085C publication Critical patent/NL172085C/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
NLAANVRAGE7100321,A 1970-02-12 1971-01-11 METHOD FOR PREPARING A BATH FOR ELECTROLYTIC DEPOSITION OF DUCTILE, GLOSSY COPPER, AND USE OF THE BATH PREPARED FOR ELECTROLYTIC COATING OF A DUCTILE, GLOSSY COPPER LAYER ON A SUBSTRATE. NL172085C (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US1102470A 1970-02-12 1970-02-12

Publications (2)

Publication Number Publication Date
NL7100321A NL7100321A (en) 1971-08-16
NL172085C true NL172085C (en) 1983-07-01

Family

ID=21748527

Family Applications (1)

Application Number Title Priority Date Filing Date
NLAANVRAGE7100321,A NL172085C (en) 1970-02-12 1971-01-11 METHOD FOR PREPARING A BATH FOR ELECTROLYTIC DEPOSITION OF DUCTILE, GLOSSY COPPER, AND USE OF THE BATH PREPARED FOR ELECTROLYTIC COATING OF A DUCTILE, GLOSSY COPPER LAYER ON A SUBSTRATE.

Country Status (6)

Country Link
JP (1) JPS5118894B1 (en)
BR (1) BR7100263D0 (en)
FR (1) FR2079372B1 (en)
GB (1) GB1313197A (en)
NL (1) NL172085C (en)
ZA (1) ZA708430B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ZA739310B (en) * 1972-12-14 1974-11-27 M & T Chemicals Inc Electrode position of copper
JPS53114596U (en) * 1977-02-14 1978-09-12
CA1105045A (en) * 1977-05-04 1981-07-14 Hans G. Creutz (Deceased) Electrodeposition of copper
AU559896B2 (en) * 1983-06-10 1987-03-26 Omi International Corp. Electrolytic copper depositing processes
US7316772B2 (en) 2002-03-05 2008-01-08 Enthone Inc. Defect reduction in electrodeposited copper for semiconductor applications
US8002962B2 (en) 2002-03-05 2011-08-23 Enthone Inc. Copper electrodeposition in microelectronics
CN103397354B (en) * 2013-08-08 2016-10-26 上海新阳半导体材料股份有限公司 A kind of additive in cavity after reducing silicon through hole technology copper facing annealing
CN114351195A (en) * 2022-03-19 2022-04-15 深圳市创智成功科技有限公司 Electro-coppering formula for pulse through hole filling and electro-coppering process thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1246347B (en) * 1966-03-08 1967-08-03 Schering Ag Acid galvanic copper bath
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths

Also Published As

Publication number Publication date
FR2079372A1 (en) 1971-11-12
BR7100263D0 (en) 1973-05-24
ZA708430B (en) 1971-09-29
DE2105472B2 (en) 1975-11-20
JPS5118894B1 (en) 1976-06-14
FR2079372B1 (en) 1974-02-22
DE2105472A1 (en) 1971-08-26
NL7100321A (en) 1971-08-16
GB1313197A (en) 1973-04-11

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Owner name: OMI INTERNATIONAL CORPORATION

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