NL149674B - Werkwijze voor het tot stand brengen van elektrische verbindingen en elektrische verbindingen vervaardigd volgens deze werkwijze. - Google Patents
Werkwijze voor het tot stand brengen van elektrische verbindingen en elektrische verbindingen vervaardigd volgens deze werkwijze.Info
- Publication number
- NL149674B NL149674B NL676703605A NL6703605A NL149674B NL 149674 B NL149674 B NL 149674B NL 676703605 A NL676703605 A NL 676703605A NL 6703605 A NL6703605 A NL 6703605A NL 149674 B NL149674 B NL 149674B
- Authority
- NL
- Netherlands
- Prior art keywords
- electrical connections
- procedure
- accordance
- manufactured
- establishing
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/38—Conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/2401—Structure
- H01L2224/2402—Laminated, e.g. MCM-L type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/241—Disposition
- H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/24225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/24227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01018—Argon [Ar]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01024—Chromium [Cr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01032—Germanium [Ge]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01043—Technetium [Tc]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/15165—Monolayer substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US53307366A | 1966-03-09 | 1966-03-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
NL6703605A NL6703605A (nl) | 1967-09-11 |
NL149674B true NL149674B (nl) | 1976-05-17 |
Family
ID=24124356
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL676703605A NL149674B (nl) | 1966-03-09 | 1967-03-08 | Werkwijze voor het tot stand brengen van elektrische verbindingen en elektrische verbindingen vervaardigd volgens deze werkwijze. |
Country Status (7)
Country | Link |
---|---|
US (1) | US3614832A (nl) |
CH (1) | CH448198A (nl) |
DE (1) | DE1591186B1 (nl) |
FR (1) | FR1521440A (nl) |
GB (1) | GB1162184A (nl) |
NL (1) | NL149674B (nl) |
SE (1) | SE345343B (nl) |
Families Citing this family (96)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2057126C3 (de) * | 1970-05-14 | 1975-11-06 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Anordnung und Verfahren zur Kontaktierung von Halbleiterbauelementen |
DE2151765C2 (de) * | 1970-11-05 | 1983-06-16 | Honeywell Information Systems Italia S.p.A., Caluso, Torino | Verfahren zum Kontaktieren von integrierten Schaltungen mit Beam-Lead-Anschlüssen |
FR2150214A1 (nl) * | 1971-08-20 | 1973-04-06 | Thomson Csf | |
NL159818B (nl) * | 1972-04-06 | 1979-03-15 | Philips Nv | Halfgeleiderinrichting, bevattende een flexibele isolerende folie, die aan een zijde is voorzien van metalen geleider- sporen. |
JPS49131863U (nl) * | 1973-03-10 | 1974-11-13 | ||
JPS5429239B2 (nl) * | 1974-12-04 | 1979-09-21 | ||
US4062107A (en) * | 1976-07-14 | 1977-12-13 | U.S. Philips Corporation | Method of manufacturing infra-red detector |
CH645208A5 (de) * | 1978-10-31 | 1984-09-14 | Bbc Brown Boveri & Cie | Verfahren zur herstellung von elektrischen kontakten an halbleiterbauelementen. |
EP0015100B1 (en) * | 1979-02-26 | 1983-08-17 | National Research Development Corporation | Method of incorporating a distributed microwave circuit element in a microwave integrated circuit |
US4251852A (en) * | 1979-06-18 | 1981-02-17 | International Business Machines Corporation | Integrated circuit package |
DE3005662C2 (de) * | 1980-02-15 | 1983-10-27 | G. Rau GmbH & Co, 7530 Pforzheim | Verfahren zur Herstellung eines Kontaktelementes |
US4544989A (en) * | 1980-06-30 | 1985-10-01 | Sharp Kabushiki Kaisha | Thin assembly for wiring substrate |
US4508402A (en) * | 1981-02-27 | 1985-04-02 | Sharp Kabushiki Kaisha | Integrated circuit package and display panel |
US4404453A (en) * | 1981-09-10 | 1983-09-13 | Asta, Ltd. | Laser bonding of microelectronic circuits |
US4635354A (en) * | 1982-07-22 | 1987-01-13 | Texas Instruments Incorporated | Low cost electronic apparatus construction method |
EP0117348B1 (en) * | 1982-12-06 | 1987-03-11 | The Welding Institute | Bonding leads to semiconductor devices |
DE3247338A1 (de) * | 1982-12-21 | 1984-06-28 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum laserloeten von flexiblen verdrahtungen |
US4531044A (en) * | 1983-01-24 | 1985-07-23 | Ford Motor Company | Method of laser soldering |
JPS60500204A (ja) * | 1983-01-24 | 1985-02-21 | フオ−ド モ−タ− カンパニ− | レ−ザはんだ付け法 |
US4527330A (en) * | 1983-08-08 | 1985-07-09 | Motorola, Inc. | Method for coupling an electronic device into an electrical circuit |
KR900001273B1 (ko) * | 1983-12-23 | 1990-03-05 | 후지쑤 가부시끼가이샤 | 반도체 집적회로 장치 |
US5049434A (en) * | 1984-04-30 | 1991-09-17 | National Starch And Chemical Investment Holding Corporation | Pre-patterned device substrate device-attach adhesive transfer system |
US4631820A (en) * | 1984-08-23 | 1986-12-30 | Canon Kabushiki Kaisha | Mounting assembly and mounting method for an electronic component |
US4645114A (en) * | 1985-06-17 | 1987-02-24 | Northern Telecom Limited | Shaped solder pad for surface mounting electronic devices and a surface mounting position incorporating such shaped pads |
DE3534502A1 (de) * | 1985-09-27 | 1987-04-09 | Licentia Gmbh | Verfahren zum herstellen einer klebekontaktierung |
US5917707A (en) | 1993-11-16 | 1999-06-29 | Formfactor, Inc. | Flexible contact structure with an electrically conductive shell |
JPS62169434A (ja) * | 1986-01-22 | 1987-07-25 | Sharp Corp | Lsi搭載方式 |
US4780795A (en) * | 1986-04-28 | 1988-10-25 | Burr-Brown Corporation | Packages for hybrid integrated circuit high voltage isolation amplifiers and method of manufacture |
GB8620057D0 (en) * | 1986-08-18 | 1986-10-01 | Philips Nv | Cathode ray tube display device |
US4884122A (en) * | 1988-08-05 | 1989-11-28 | General Electric Company | Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer |
US4937203A (en) * | 1986-09-26 | 1990-06-26 | General Electric Company | Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer |
US4945399A (en) * | 1986-09-30 | 1990-07-31 | International Business Machines Corporation | Electronic package with integrated distributed decoupling capacitors |
US4704304A (en) * | 1986-10-27 | 1987-11-03 | International Business Machines Corporation | Method for repair of opens in thin film lines on a substrate |
US4744008A (en) * | 1986-11-18 | 1988-05-10 | International Business Machines Corporation | Flexible film chip carrier with decoupling capacitors |
DE3641353A1 (de) * | 1986-12-03 | 1988-06-09 | Schoeller & Co Elektrotech | Einrichtung zur kontaktierung von anschluessen |
US4766670A (en) * | 1987-02-02 | 1988-08-30 | International Business Machines Corporation | Full panel electronic packaging structure and method of making same |
US4855867A (en) * | 1987-02-02 | 1989-08-08 | International Business Machines Corporation | Full panel electronic packaging structure |
US4755866A (en) * | 1987-02-27 | 1988-07-05 | United Technologies Corporation | Electronic circuit module |
FR2625067A1 (fr) * | 1987-12-22 | 1989-06-23 | Sgs Thomson Microelectronics | Procede pour fixer sur un support un composant electronique et ses contacts |
US4892245A (en) * | 1988-11-21 | 1990-01-09 | Honeywell Inc. | Controlled compression furnace bonding |
USRE35578E (en) * | 1988-12-12 | 1997-08-12 | Sgs-Thomson Microelectronics, Inc. | Method to install an electronic component and its electrical connections on a support, and product obtained thereby |
USRE35385E (en) * | 1988-12-12 | 1996-12-03 | Sgs-Thomson Microelectronics, Sa. | Method for fixing an electronic component and its contacts to a support |
US5285107A (en) * | 1989-04-20 | 1994-02-08 | Sanyo Electric Co., Ltd. | Hybrid integrated circuit device |
JPH02306690A (ja) * | 1989-05-22 | 1990-12-20 | Toshiba Corp | 表面実装用配線基板の製造方法 |
JP3280394B2 (ja) * | 1990-04-05 | 2002-05-13 | ロックヒード マーティン コーポレーション | 電子装置 |
US5170029A (en) * | 1990-04-19 | 1992-12-08 | Matsushita Electric Works, Ltd. | Energy-beam welding method |
GB2244374B (en) * | 1990-05-22 | 1994-10-05 | Stc Plc | Improvements in hybrid circuits |
US5241456A (en) * | 1990-07-02 | 1993-08-31 | General Electric Company | Compact high density interconnect structure |
IT1242420B (it) * | 1990-09-03 | 1994-03-04 | Ri Co Srl | Metodo di montaggio per l'applicazione di componenti elettronici su circuiti stampati flessibili. |
US5148266A (en) * | 1990-09-24 | 1992-09-15 | Ist Associates, Inc. | Semiconductor chip assemblies having interposer and flexible lead |
US5258330A (en) * | 1990-09-24 | 1993-11-02 | Tessera, Inc. | Semiconductor chip assemblies with fan-in leads |
US5148265A (en) | 1990-09-24 | 1992-09-15 | Ist Associates, Inc. | Semiconductor chip assemblies with fan-in leads |
US5679977A (en) * | 1990-09-24 | 1997-10-21 | Tessera, Inc. | Semiconductor chip assemblies, methods of making same and components for same |
US7198969B1 (en) | 1990-09-24 | 2007-04-03 | Tessera, Inc. | Semiconductor chip assemblies, methods of making same and components for same |
US5227604A (en) * | 1991-06-28 | 1993-07-13 | Digital Equipment Corporation | Atmospheric pressure gaseous-flux-assisted laser reflow soldering |
JP2839795B2 (ja) * | 1991-08-09 | 1998-12-16 | シャープ株式会社 | 半導体装置 |
JP2702839B2 (ja) * | 1991-11-20 | 1998-01-26 | シャープ株式会社 | 配線基板の電極構造 |
EP0547807A3 (en) * | 1991-12-16 | 1993-09-22 | General Electric Company | Packaged electronic system |
US5240166A (en) * | 1992-05-15 | 1993-08-31 | International Business Machines Corporation | Device for thermally enhanced ultrasonic bonding with localized heat pulses |
US5604831A (en) * | 1992-11-16 | 1997-02-18 | International Business Machines Corporation | Optical module with fluxless laser reflow soldered joints |
US5289632A (en) * | 1992-11-25 | 1994-03-01 | International Business Machines Corporation | Applying conductive lines to integrated circuits |
US5444600A (en) * | 1992-12-03 | 1995-08-22 | Linear Technology Corporation | Lead frame capacitor and capacitively-coupled isolator circuit using the same |
US5457878A (en) * | 1993-10-12 | 1995-10-17 | Lsi Logic Corporation | Method for mounting integrated circuit chips on a mini-board |
US5820014A (en) * | 1993-11-16 | 1998-10-13 | Form Factor, Inc. | Solder preforms |
US7073254B2 (en) | 1993-11-16 | 2006-07-11 | Formfactor, Inc. | Method for mounting a plurality of spring contact elements |
US6232152B1 (en) | 1994-05-19 | 2001-05-15 | Tessera, Inc. | Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures |
US5776796A (en) * | 1994-05-19 | 1998-07-07 | Tessera, Inc. | Method of encapsulating a semiconductor package |
US5834339A (en) | 1996-03-07 | 1998-11-10 | Tessera, Inc. | Methods for providing void-free layers for semiconductor assemblies |
US6359335B1 (en) | 1994-05-19 | 2002-03-19 | Tessera, Inc. | Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures |
US5904868A (en) * | 1994-06-16 | 1999-05-18 | International Business Machines Corporation | Mounting and/or removing of components using optical fiber tools |
US5567648A (en) * | 1994-08-29 | 1996-10-22 | Motorola, Inc. | Process for providing interconnect bumps on a bonding pad by application of a sheet of conductive discs |
US5915170A (en) * | 1994-09-20 | 1999-06-22 | Tessera, Inc. | Multiple part compliant interface for packaging of a semiconductor chip and method therefor |
US5929517A (en) | 1994-12-29 | 1999-07-27 | Tessera, Inc. | Compliant integrated circuit package and method of fabricating the same |
US5994152A (en) * | 1996-02-21 | 1999-11-30 | Formfactor, Inc. | Fabricating interconnects and tips using sacrificial substrates |
US8033838B2 (en) | 1996-02-21 | 2011-10-11 | Formfactor, Inc. | Microelectronic contact structure |
US6030856A (en) * | 1996-06-10 | 2000-02-29 | Tessera, Inc. | Bondable compliant pads for packaging of a semiconductor chip and method therefor |
KR0185570B1 (ko) * | 1996-07-15 | 1999-03-20 | 김광호 | 칩 스케일 패키지의 제조 방법 |
US6075711A (en) * | 1996-10-21 | 2000-06-13 | Alpine Microsystems, Inc. | System and method for routing connections of integrated circuits |
US5937276A (en) | 1996-12-13 | 1999-08-10 | Tessera, Inc. | Bonding lead structure with enhanced encapsulation |
US6686015B2 (en) | 1996-12-13 | 2004-02-03 | Tessera, Inc. | Transferable resilient element for packaging of a semiconductor chip and method therefor |
US5877555A (en) * | 1996-12-20 | 1999-03-02 | Ericsson, Inc. | Direct contact die attach |
US6294407B1 (en) | 1998-05-06 | 2001-09-25 | Virtual Integration, Inc. | Microelectronic packages including thin film decal and dielectric adhesive layer having conductive vias therein, and methods of fabricating the same |
US6510606B2 (en) | 1998-06-15 | 2003-01-28 | Lockheed Martin Corporation | Multichip module |
US6214640B1 (en) | 1999-02-10 | 2001-04-10 | Tessera, Inc. | Method of manufacturing a plurality of semiconductor packages |
SE517944C2 (sv) * | 2000-04-06 | 2002-08-06 | Ericsson Telefon Ab L M | Förfarande och styrelement för fastsättning av ett mönsterkort på ett element |
SE518778C2 (sv) * | 2000-04-19 | 2002-11-19 | Ericsson Telefon Ab L M | Förfarande och anordning för montering av en elektronisk eller mekanisk komponent på ett mönsterkort samt ett styrelement anordnat att ytmonteras på ett mönsterkort |
US7335995B2 (en) | 2001-10-09 | 2008-02-26 | Tessera, Inc. | Microelectronic assembly having array including passive elements and interconnects |
US6977440B2 (en) | 2001-10-09 | 2005-12-20 | Tessera, Inc. | Stacked packages |
US6897565B2 (en) * | 2001-10-09 | 2005-05-24 | Tessera, Inc. | Stacked packages |
US20040152242A1 (en) * | 2003-01-30 | 2004-08-05 | Wong Chun Kit | Device package utilizing interconnect strips to make connections between package and die |
US7288472B2 (en) * | 2004-12-21 | 2007-10-30 | Intel Corporation | Method and system for performing die attach using a flame |
KR100651563B1 (ko) * | 2005-07-07 | 2006-11-29 | 삼성전기주식회사 | 전자부품이 내장된 배선기판의 제조방법 |
CN102835193A (zh) * | 2010-04-15 | 2012-12-19 | 古河电气工业株式会社 | 基板以及基板的制造方法 |
US20150380369A1 (en) * | 2013-09-30 | 2015-12-31 | Nantong Fujitsu Microelectronics Co., Ltd | Wafer packaging structure and packaging method |
US9296056B2 (en) * | 2014-07-08 | 2016-03-29 | International Business Machines Corporation | Device for thermal management of surface mount devices during reflow soldering |
US10507541B2 (en) * | 2017-02-14 | 2019-12-17 | John Nelson | Soldering jig assembly |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1044689A (en) * | 1962-09-21 | 1966-10-05 | Standard Telephones Cables Ltd | Improvements in or relating to mountings for semi-conductor devices |
DE1931563U (de) * | 1965-10-29 | 1966-01-27 | Bbc Brown Boveri & Cie | Modulleiste fuer ein aufbausystem fuer integrierte schaltungen. |
-
1966
- 1966-03-09 US US533073A patent/US3614832A/en not_active Expired - Lifetime
-
1967
- 1967-02-14 FR FR8355A patent/FR1521440A/fr not_active Expired
- 1967-03-03 DE DE19671591186 patent/DE1591186B1/de not_active Withdrawn
- 1967-03-07 SE SE3123/67A patent/SE345343B/xx unknown
- 1967-03-08 NL NL676703605A patent/NL149674B/nl unknown
- 1967-03-09 CH CH348767A patent/CH448198A/de unknown
- 1967-03-09 GB GB01043/67A patent/GB1162184A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
US3614832A (en) | 1971-10-26 |
GB1162184A (en) | 1969-08-20 |
SE345343B (nl) | 1972-05-23 |
NL6703605A (nl) | 1967-09-11 |
CH448198A (de) | 1967-12-15 |
FR1521440A (fr) | 1968-04-19 |
DE1591186B1 (de) | 1971-01-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
NL149674B (nl) | Werkwijze voor het tot stand brengen van elektrische verbindingen en elektrische verbindingen vervaardigd volgens deze werkwijze. | |
NL147592B (nl) | Werkwijze en inrichting voor het krimpen van een elektrisch verbindingsorgaan op een elektrische draad. | |
NL155134B (nl) | Elektrische verbindingsinrichting met insteekbare en uitneembare bus- of penvormige verbindingsorganen. | |
NL139418B (nl) | Inrichting voor het opslaan van elektrische energie, negatieve elektrode voor deze inrichting en werkwijze voor het vervaardigen van deze elektrode. | |
NL159912C (nl) | Werkwijze voor het vormen van voorwerpen en inrichting voor het uitvoeren van de werkwijze. | |
NL153709B (nl) | Werkwijze voor het vervaardigen van een elektrisch geleidend voorwerp, alsmede voorwerp, vervaardigd volgens deze werkwijze. | |
NL140370B (nl) | Werkwijze voor het maken van een elektrische stekerpen of opneemorgaan met tussen buisvormige delen in gelegen getwiste contactdelen vormende stroken en een elektrische stekerpen of opneemorgaan verkregen volgens deze werkwijze. | |
NL160681C (nl) | Door pulsen bestuurbare halfgeleiderinrichting met twee stabiele geleidingstoestanden voor het tot stand brengen en het onderbreken van een elektrische stroombaan. | |
NL152116B (nl) | Werkwijze voor het vervaardigen van een ingekapselde halfgeleiderinrichting en ingekapselde halfgeleiderinrichting vervaardigd volgens de werkwijze. | |
NL152724B (nl) | Elektrische keten voor het verschaffen van een gelijkspanning voor het tot stand brengen en onderhouden van het werkpunt van een halfgeleiderversterker. | |
NL156078B (nl) | Inrichting voor het onderling evenwijdig richten van in hoofdzaak staafvormige voorwerpen. | |
NL142264B (nl) | In de lengterichting waterdichte elektrische kabel en werkwijze voor het vervaardigen daarvan. | |
NL149714B (nl) | Werkwijze voor het door diffusie tot stand brengen van een gebied met gewijzigde elektrische eigenschappen in een halfgeleiderplaatje en aldus verkregen halfgeleiderplaatjes. | |
NL149650B (nl) | Elektrische verbindingsinrichting voor het verbinden van twee coaxiale elektrische kabels. | |
NL152410B (nl) | Inrichting voor het vervaardigen van spoelen en het aanbrengen van deze spoelen in binnen liggende gleuven van elektrische machines. | |
NL156280B (nl) | Werkwijze voor het maken van een schijfanker voor een elektrische machine en volgens deze werkwijze vervaardigd schijfanker. | |
NL146889B (nl) | Werkwijze voor het strekken en kroezen van kunstmatige draden en draden vervaardigd volgens deze werkwijze. | |
NL171257C (nl) | Werkwijze voor het isoleren van dichloorbutenen en butadieen. | |
NL153729B (nl) | Elektrochemisch element met een niet-waterhoudende elektrolyt en werkwijze voor het bereiden van een dergelijke elektrolyt. | |
NL144442B (nl) | Werkwijze en inrichting voor het vervaardigen van elektrische elementen. | |
NL145718B (nl) | Werkwijze voor het vervaardigen van een elektrisch circuitsamenstel, alsmede elektrisch circuitsamenstel, vervaardigd volgens deze werkwijze. | |
NL159372B (nl) | Werkwijze voor het sulfoneren van alfa-naftylamine. | |
NL145398B (nl) | Werkwijze voor het schakelen van een geintegreerde elektrische schakeling, en geintegreerde elektrische schakeling voor het toepassen van deze werkwijze. | |
NL145285B (nl) | Werkwijze voor het vervaardigen van elektrisch geleidende onderdelen en aldus verkregen voorwerp. | |
NL166585C (nl) | Werkwijze voor het vormen van een elektrische verbin- ding in een accumulator. |