US3449191A
(en)
*
|
1964-02-03 |
1969-06-10 |
Boeing Co |
Polymer bonding process and product
|
US3891597A
(en)
*
|
1970-12-21 |
1975-06-24 |
Phillips Petroleum Co |
Rotational molding of crosslinkable polymers
|
JPS5148196B2
(pt)
*
|
1972-03-11 |
1976-12-18 |
|
|
US4015058A
(en)
*
|
1974-11-27 |
1977-03-29 |
Union Carbide Corporation |
Composition with dicumyl peroxide and process for avoiding scorching of ethylene polymer composition
|
JP2855875B2
(ja)
*
|
1990-04-16 |
1999-02-10 |
日本油脂株式会社 |
エチレン系ポリマーの架橋可能な組成物及び架橋方法
|
CA2063478A1
(en)
*
|
1991-03-22 |
1992-09-23 |
Michael F. Novits |
Scorch extending curing/crosslinking compositions
|
US5272213A
(en)
*
|
1992-05-14 |
1993-12-21 |
Air Products And Chemicals, Inc. |
Scorch retardant polyacrylate elastomers
|
US20040198920A1
(en)
*
|
2003-04-03 |
2004-10-07 |
Atofina |
Scorch-retardant composition
|
FR2875502B1
(fr)
*
|
2004-09-22 |
2007-01-05 |
Arkema Sa |
Composition retardant le grillage
|
US20080115825A1
(en)
*
|
2006-09-20 |
2008-05-22 |
Patel Rajen M |
Electronic Device Module Comprising an Ethylene Multi-Block Copolymer
|
US8581094B2
(en)
*
|
2006-09-20 |
2013-11-12 |
Dow Global Technologies, Llc |
Electronic device module comprising polyolefin copolymer
|
DE602007006826D1
(de)
|
2006-09-20 |
2010-07-08 |
Dow Global Technologies Inc |
Modul einer elektronischen vorrichtung mit einem ethylen-multiblock-copolymer
|
US7465769B2
(en)
*
|
2006-10-09 |
2008-12-16 |
Dow Global Technologies Inc. |
Nitroxide compounds for minimizing scorch in crosslinkable compositions
|
US20100120955A1
(en)
*
|
2007-03-14 |
2010-05-13 |
Chaudhary Bharat I |
Isocyanate, Diisocyanate and (Meth) Acrylate Compounds for Minimizing Scorch and Diisocyanate Compounds for Promoting Cure in Crosslinkable Compositions
|
EP2155816A1
(en)
*
|
2007-06-08 |
2010-02-24 |
Union Carbide Chemicals & Plastics Technology LLC |
Crosslinkable compositions having reduced scorch inhibitor migration, method of reducing such migration, and articles made therefrom
|
JP2013528241A
(ja)
|
2010-05-26 |
2013-07-08 |
ダウ グローバル テクノロジーズ エルエルシー |
低不飽和および任意のビニルシランを有するポリオレフィンコポリマーを含む電子素子モジュール
|
BR112012030650A2
(pt)
|
2010-06-04 |
2016-08-16 |
Dow Global Technologies Llc |
módulo de dispositivo eletrônico compreendendo película de copolímero de poliolefina homogêneo e silano enxertado
|
BR112012030649A2
(pt)
|
2010-06-04 |
2016-08-16 |
Dow Global Technologies Llc |
módulo de dispositivo eletrônico compreendendo película de copolímero de poliolefina homogêneo e polímero de enxerto realçador de propriedade adesiva
|
EP2585292A1
(en)
|
2010-06-24 |
2013-05-01 |
Dow Global Technologies LLC |
Electronic device module comprising heterogeneous polyolefin copolymer and optionally silane
|
EP2585293A2
(en)
|
2010-06-24 |
2013-05-01 |
Dow Global Technologies LLC |
Electronic device module comprising long chain branched (lcb), block, or interconnected copolymers of ethylene and optionally silane
|
CN104114592A
(zh)
|
2012-02-03 |
2014-10-22 |
陶氏环球技术有限责任公司 |
包括含硅烷的乙烯互聚物配方的膜和包括其的电子设备模块
|
EP3048649A1
(en)
|
2015-01-23 |
2016-07-27 |
Yparex B.V. |
Electronic device module
|