NL109558C - - Google Patents

Info

Publication number: NL109558C
Authority: NL; Netherlands

Application number

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1955-05-10

Publication date

1900-01-01

1900-01-01 Application granted granted Critical

1900-01-01 Publication of NL109558C publication Critical patent/NL109558C/xx

1955-05-10 Priority claimed from US507312A external-priority patent/US2763822A/en

1955-08-01 Priority claimed from US525595A external-priority patent/US2801375A/en

Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/492—Bases or plates or solder therefor
- H01L23/4924—Bases or plates or solder therefor characterised by the materials
- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H—ELECTRICITY
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- H01L2924/01005—Boron [B]
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- H01L2924/01006—Carbon [C]
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- H01L2924/01012—Magnesium [Mg]
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- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H01L2924/01019—Potassium [K]
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- H01L2924/01024—Chromium [Cr]
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- H01L2924/01025—Manganese [Mn]
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- H01L2924/01029—Copper [Cu]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0103—Zinc [Zn]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01032—Germanium [Ge]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H01L2924/01039—Yttrium [Y]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01049—Indium [In]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01051—Antimony [Sb]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01057—Lanthanum [La]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01072—Hafnium [Hf]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01076—Osmium [Os]
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- H01L2924/01078—Platinum [Pt]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance

Landscapes

Engineering & Computer Science (AREA)
Chemical & Material Sciences (AREA)
Power Engineering (AREA)
Microelectronics & Electronic Packaging (AREA)
Computer Hardware Design (AREA)
General Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
Materials Engineering (AREA)
Physics & Mathematics (AREA)
Mechanical Engineering (AREA)
Organic Chemistry (AREA)
Metallurgy (AREA)
Electrochemistry (AREA)
Chemical Kinetics & Catalysis (AREA)
Manufacturing & Machinery (AREA)
Ceramic Engineering (AREA)
Electrodes Of Semiconductors (AREA)
Contacts (AREA)
Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Ceramic Products (AREA)
Die Bonding (AREA)

NL109558D 1955-05-10 NL109558C (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US507312A US2763822A (en)	1955-05-10	1955-05-10	Silicon semiconductor devices
US525595A US2801375A (en)	1955-08-01	1955-08-01	Silicon semiconductor devices and processes for making them

Publications (1)

Publication Number	Publication Date
NL109558C true NL109558C (en)	1900-01-01

Family

ID=27055794

Family Applications (2)

Application Number	Title	Priority Date	Filing Date
NL208617D NL208617A (en)	1955-05-10
NL109558D NL109558C (en)	1955-05-10

Family Applications Before (1)

Application Number	Title	Priority Date	Filing Date
NL208617D NL208617A (en)	1955-05-10

Country Status (6)

Country	Link
BE (2)	BE550001A (en)
CH (2)	CH350720A (en)
DE (2)	DE1050450B (en)
FR (2)	FR1153475A (en)
GB (2)	GB832067A (en)
NL (2)	NL109558C (en)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE1285068B (en) *	1957-01-11	1968-12-12	Siemens Ag	Alloy contact on semiconductor crystals provided with a gold layer
NL243222A (en) *	1958-09-10	1900-01-01
NL242265A (en) *	1958-09-30	1900-01-01
NL239127A (en) *	1959-05-12
DE1233949B (en) *	1959-07-13	1967-02-09	Siemens Ag	Method for producing a semiconductor rectifier arrangement with a single-crystal semiconductor body
NL249694A (en) *	1959-12-30
DE1113519B (en) *	1960-02-25	1961-09-07	Bosch Gmbh Robert	Silicon rectifier for high currents
NL260951A (en) *	1960-03-07
DE1141029B (en) *	1960-06-23	1962-12-13	Siemens Ag	Semiconductor device and method for its manufacture
DE1153461B (en) *	1960-06-23	1963-08-29	Siemens Ag	Semiconductor device
NL269346A (en) *	1960-09-20
DE1133834B (en) *	1960-09-21	1962-07-26	Siemens Ag	Silicon rectifier and process for its manufacture
NL270339A (en) *	1960-10-20
DE1229649B (en) *	1961-08-10	1966-12-01	Siemens Ag	Method for producing a semiconductor element and semiconductor arrangement with a semiconductor element produced by this method
DE1240187B (en) *	1961-08-10	1967-05-11	Siemens Ag	Process for creating a lock-free contact by alloying aluminum
DE1246129B (en) *	1961-12-28	1967-08-03	Westinghouse Electric Corp	Method for manufacturing a semiconductor component
DE1185731B (en) *	1962-03-28	1965-01-21	Siemens Ag	Semiconductor element with pn transition
DE1295697B (en) *	1962-05-23	1969-05-22	Walter Brandt Gmbh	Semiconductor component and method for its manufacture
US3368120A (en) *	1965-03-22	1968-02-06	Gen Electric	Multilayer contact system for semiconductor devices
DE1483298B1 (en) *	1965-06-11	1971-01-28	Siemens Ag	Electrical contact arrangement between a germanium-silicon semiconductor body and a contact piece and method for producing the same
FR2046593A5 (en) *	1970-04-30	1971-03-05	Silec Semi Conducteurs
GB2031223A (en) *	1978-09-22	1980-04-16	Gen Instrument Corp	Method for bonding a refractory metal contact member to a semiconductor body
SE9203533L (en) *	1992-11-24	1994-05-24	Asea Brown Boveri	Apparatus for cooling disc-shaped power electronics elements as well as disc-shaped power electronics elements intended to be mounted in such a cooling device
JP6079375B2 (en) *	2013-03-29	2017-02-15	三菱マテリアル株式会社	Solder powder, method for producing the same, and solder paste using the powder
DE102015108056A1 (en)	2015-05-21	2016-11-24	Osram Opto Semiconductors Gmbh	Optoelectronic semiconductor component, optoelectronic assembly and method for producing an optoelectronic semiconductor component

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2220961A (en) *	1937-11-06	1940-11-12	Bell Telephone Labor Inc	Soldering alloy
US2555001A (en) *	1947-02-04	1951-05-29	Bell Telephone Labor Inc	Bonded article and method of bonding
US2567970A (en) *	1947-12-24	1951-09-18	Bell Telephone Labor Inc	Semiconductor comprising silicon and method of making it
DE872602C (en) *	1951-03-20	1953-04-02	Siemens Ag	Method of fastening semiconductors
BE522837A (en) *	1952-09-16
NL104654C (en) *	1952-12-31	1900-01-01
GB8817261D0 (en) *	1988-07-20	1988-08-24	Sperry Sun Inc	Down-hole bearing assemblies for maintaining survey instrument assembly & core barrel orientation

0
- BE BE547698D patent/BE547698A/xx unknown
- NL NL208617D patent/NL208617A/xx unknown
- NL NL109558D patent/NL109558C/xx active
1956
- 1956-04-30 DE DEW18965A patent/DE1050450B/en active Pending
- 1956-05-04 GB GB13826/56A patent/GB832067A/en not_active Expired
- 1956-05-09 FR FR1153475D patent/FR1153475A/en not_active Expired
- 1956-05-09 CH CH350720D patent/CH350720A/en unknown
- 1956-07-11 DE DEW19399A patent/DE1292260B/en active Pending
- 1956-07-27 GB GB23230/56A patent/GB823559A/en not_active Expired
- 1956-07-30 FR FR1157057D patent/FR1157057A/en not_active Expired
- 1956-07-31 CH CH3604156A patent/CH367896A/en unknown
- 1956-08-01 BE BE550001A patent/BE550001A/en unknown

Also Published As

Publication number	Publication date
DE1292260B (en)	1969-04-10
DE1050450B (en)	1959-02-12
GB832067A (en)	1960-04-06
CH350720A (en)	1960-12-15
BE550001A (en)	1956-08-31
GB823559A (en)	1959-11-11
FR1157057A (en)	1958-05-27
BE547698A (en)	1900-01-01
FR1153475A (en)	1958-03-11
NL208617A (en)	1900-01-01
CH367896A (en)	1963-03-15

Publication	Publication Date	Title
DE7702562U1 (en)	1900-01-01
DE7632903U1 (en)	1900-01-01
AT2597B (en)	1900-11-10
AT2799B (en)	1900-11-26
AT2699B (en)	1900-11-10
AT12600B (en)	1903-07-25
AT11345B (en)	1903-03-26
AT6471B (en)	1902-01-10
AT10781B (en)	1903-02-25
AT12751B (en)	1903-07-25
AT12752B (en)	1903-07-25
AT12875B (en)	1903-08-10
AT6375B (en)	1902-01-10
AT2961B (en)	1900-12-10
AT10935B (en)	1903-02-25
AT11435B (en)	1903-04-10
AT2955B (en)	1900-12-10
AT10831B (en)	1903-02-25
AT2896B (en)	1900-12-10
AT2883B (en)	1900-12-10
AT2655B (en)	1900-11-10
AT12910B (en)	1903-08-10
AT2745B (en)	1900-11-26
AT12934B (en)	1903-08-10
AT2717B (en)	1900-11-26