NL1041403B1

NL1041403B1 - Method and device for positioning a substrate and a component for mounting thereon relative to each other.

Info

Publication number: NL1041403B1
Application number: NL1041403A
Authority: NL
Inventors: Gerard Van Den Brink Hans
Original assignee: Brilan Tech B V
Priority date: 2015-07-21
Filing date: 2015-07-21
Publication date: 2017-02-07

Abstract

A method and device for positioning a substrate and a component for mounting thereon relative to each other. An apparatus is used which comprises a dividing mirror and an arm pivoting aorund a pivot point. A component (44) is picked from a donor wafer disk (DWD) and placed on a receiver wafer disk (RWD).

Description

Method and device for positioning a substrate and a component for mounting thereon relative to each other.

FIELD OF THE INVENTION

The present invention relates to a method and device for positioning a substrate and a component for mounting thereon relative to each other. Such devices are per se known and are for instance applied for the manual manufacture or repair of electronic circuits. An object of the invention is to position the component here relative to the substrate such that associated electrical contacts of the respective component and substrate can be mutually connected, for instance by means of soldering, bonding or glueing or using via connections.

BACKGROUND ART

The European patent EP 0 694 248 describes a device intended for positioning an electronic component on a substrate, making use of an optical system comprising a dividing mirror. Optically, the spaces in front of and behind the dividing mirror are hereby the mirror image of each other. Essential in this invention is the simultaneous observation via an observation system of the underside of the object for placing and the intended destination of the object. The trend tends however towards increasingly smaller tolerances, and the requirements set for placing accuracy are approaching the limit of the achievable.

The device known from EP 0 694 248 has some drawbacks.

To overcome the drawbacks EP 2 380 418 describes a device comprising a mirror, with a semitransparent plane of the mirror, a substrate holder which is adapted to hold a surface of the substrate on which the component has to be mounted in a plane at a first angle relative to the plane of the mirror, a component holder adapted to determine an aligning position, wherein the surface of the component to be mounted on the substrate is situated in a plane at a second angle, equal to the first but in opposite direction thereto, relative to the plane of the mirror, wherein the intersecting line of the surface of the component and the surface of the substrate with the plane of the mirror coincide, and a mounting position, wherein the surface of the component to be mounted on the substrate lies on the surface of the substrate on which the component has to be mounted, and aligning means for mutually aligning the component and the substrate.

Because the component holder is adapted to determine an aligning position in which the surface of the component to be mounted on the substrate is situated in a plane at a second angle, equal to the first but in opposite direction thereto, relative to the plane of the mirror, as the substrate, for an observer looking at the mirror via per se known optics their images lie in the same plane. Relative to prior art devices, in which no explicit provisions are made precisely for the purpose of positioning the surfaces to be mounted on each other at equal but opposite angles relative to the plane of the mirror, EP 2 380 418 states that the advantage is provided of a correct positioning irrespective of the thickness of a component.

In a favourable embodiment described in EP 2 380 418 the component holder is adapted to determine a pick-up position for the component, wherein a surface of the component to be mounted on the substrate lies in the plane of the mirror.

It is remarked that in the devices known from EP 2 380 418 an optical observation system is used whose lines of sight is perpendicular to the mounting surface and the component holder is moved through an angle on an arm which pivots around a pivot point.

Such a set-up wherein the line of sight is perpendicular on the mounting surface and the movement is a pivoting movement around a pivot point of an arm is inherently superior in terms of placing accuracy than a set-up in which the line of sight of the camera is at an angle to the mounting surface and the component holder moves up and down from and towards the mounting surface, thus not pivoting. A set-up in which the optical system looks at the mounting surface at an angle is for instance known from WO 2011/084058.

In WO 2011/084508 the optical observation system comprises a camera system with a very complex optical design.

In said document set-ups are shown using only one camera as well as using two cameras.

In practice two camera systems are needed providing for a even more complex design and even then accuracy is limited due to the inherent limitations of the system.

None of the documents describe taking an electronic component of a first donor wafer disk and mounting it on a second receiver wafer disk.

Wafer disks comprise many electrical components usually called chips. There are a number of, to some extent diverging, trends in wafer disks; on the one hand there are very general type of electronic components, which are multi-purpose electronic components. Being multipurpose there is inherently some overkill in the electronic components capacity. Such general multi-purpose components can do almost anything, but inherently for any given purpose they are actually too complex and are thus often too costly and too complicated.

On the other hand there are chips specifically designed for specific purposes. Those specific chips have the draw back that their use is restricted to specific purposes.

Combining a general purpose chip, for those processes that are common for a lot of processes with a specific purpose chip mounted on top of the general purpose chip, or vice versa, can reduces the problems and make for a more efficient design. Therefor by combining two different electronic components new more efficient designs become possible.

In principle this can be done anywhere, chips are placed onto chips and interconnected. However processes, wherein on a small scale basis electronic components are placed on each other, are difficult and ill suited for large scale industrial purposes. By taking a component directly from a wafer disk and placing it on an electronic component on a second wafer disk the process of combining different electronic components is moved from a back-end manufacturing stage, thus on finished chips to a front-end manufacturing stage, i.e. performing the process on wafer disk. This allows the use of the capacity, knowledge and capability of the wafer disk manufacturer, which is better suited for large scale manufacturing, yet still allowing many different designs. The electronic components, the chips, themselves are very small and the placing accuracy required is very high.

The dimensions of electronic components on wafer disk are small, thus a very high degree of placing accuracy is required.

As stated above the general design as shown in EP 2 380 418 is superior to designs in which cameras look at the mounting surface under an angle, but even so, the design of EP 2380 418 can be improved to improve the placing accuracy.

DISCLOSURE OF THE INVENTION

To this end the device in a first aspect of the invention comprises an optical system comprising a dividing mirror and a component platform for holding a component in a pick-up position with a lower component surface and a substrate holder for holding in a mounting position a substrate with an upper substrate surface, the device having means for moving the component holder through an angle on an arm which pivots around a pivot point, and is characterized in that the device is arranged for holding the lower component surface in the pick-up position substantially in a first plane going through the pivot point and, in the mounting position, the upper surface of the substrate substantially in a second plane parallel to the first plane and also going through the pivot point.

The component and the substrate are held, during pick-up position and mounting position in substantially parallel positions. However, the component and the substrate as such, for instance a chip and a receiving wafer disk are not held on precisely the same level.

The upper surface of the substrate is positioned, during mounting, substantially at the plane of the lower surface of the component during pick-up.

The device according to the first aspect of the invention differs from the set-up shown in EP 2 380 418 in which the pick-up position lies in the plane of the mirror. In the device of EP 2 380 418 the substrate is at an angle to the plane of the mirror.

The device according to the first aspect of the invention also differs from a setup in which the component is placed on a surface, picked up and moved away from the surface and thereafter the substrate is placed on the same surface and the component is placed on the substrate by the reverse movement. In that case the lower surface of the component and the lower surface of the substrate substantially lie in the same plane, in which case during mounting the upper surface of the substrate is at a distance equivalent to the thickness of the subtrate from the lower surface of the component during pick-up.

Also, the mentioned planes both go through the pivot point.

The method of placing a component on a substrate, wherein a component is picked up by a component holder having an arm with a pivot point, the component is brought in a viewing position, and a substrate and the component are viewed via a dividing mirror, the viewing position of the component and the substrate being at equal angles to the dividing mirror whereby the images of the component and substrate overlap, wherein the images are made to / match and upon matching the component is lowered onto the substrate by pivoting the arm around the pivot point is characterized in that the lower component surface in the pick-up position is held substantially in a first plane going through the pivot point and, in the mounting position, the upper surface of the substrate is held substantially in a second plane parallel to the first plane and also going through the pivot point.

There are several embodiments in which the invention can be embodied.

It is remarked that the element for holding the component in the pick-up position is called “the component platform”. This word is used to more easily distinguish this element from the component holder on the arm thus for purpose of ease or reading. The difference in words between “platform” and “holder” is not to be understood as to indicate any necessary fundamental or functional or constructional difference between the platform and the holder. The component platform could also be called a further component holder.

In a first embodiment the device comprises a component platform and a substrate holder which can be placed under the optical observation system wherein the bottom of the component platform and the bottom of the substrate holder are in parallel planes, wherein the distance between the planes is fixed at a non zero value. When the thickness of the component is known, the distance is equivalent to the thickness of the substrate. Preferably the distance is the thickness of a wafer disk. The thinkness is a function of the diameter of the wafer disk and range typically for silicon wafer disk from 275 to 625 micrometer for small disk to 675 to 975 micrometer for large wafer disks. This is a preferred embodiment if the dimensions of the substrate is known and no stacking of components occurs.

In a second embodiment the bottom of the component platform and the bottom of the substrate holder holder are in parallel planes, and the device comprises means for adjusting the distance between the parallel planes. As mentioned above the thickness of substrates, for instance wafer disks, may vary with the size of the disk. Having means for adjusting the distance between the bottom of the component platform in the pick-up position and the bottom of the substrate holder in the mounting position may account for the differences in substrate thickness. This embodiment is in particular preferred when stacking of components is performed. The bottom of the component platform is the surface on which the component is laid before pick-up,; the lower surface of the component lies on the bottom surface of the component platform.

Stacking means: mounting one component on a substrate and then mounting a further second component on the first mounted component etc. The preferred embodiment allows the substrate holder to be lowered when the next layer is to be positioned upon a component previously positioned on a substrate for more accurate positioning.

In the above mentioned embodiments the optical observation system and the pick-up device are stationary. An alternative is that the relative vertical, i.e. transverse to the mounting surface, positions of the component holder and the substrate holder are fixed and substantially the same, but that the device comprises means for, after pick-up of the component, moving the optical observation system and the pick-up device in a direction transverse to the mounting surface of the substrate. Moving the optical observation system and pick-up device including the arm with pivot point while keeping the position of the substrate holder stationary is the equivalent of moving the substrate holder while keeping the position of the optical observation system and pick-up system with pivot point stationary.

Again, as above the movement can be over a fixed distance, if the thickness of the substrate is pre-known or means for varying the moving distance can be provided, to account for differences in substrate thickness or in case of stacking of components. In effect in both embodiments the relative position of the pivot point and the surfaces is adjustable, in one embodiment by being able to move the holder(s) up and/or down with respect to the pivot point of the arm, in the second embodiment by moving the arm, and thus the pivot point up and down with respect to the holder(s). A third possibility is that during pick-up the component holder is moved with respect to the pivot point of the arm, in a direction perpendicular to the mentioned plane, over a distance equivalent to the thickness of the substrate.

Preferably the component is a part of a donor wafer disk and the substrate is a receiving wafer disk. The component holder and the substrate holder preferably comprise a holder for a wafer disk.

Preferably the device comprises means for alternatively moving the substrate holder and the component holder under the optical observation system. Alternatively the substrate holder and the component holder are fixed in position and the optical observation system and pick-up system move alternatively move from the substrate holder to the component holder and vice versa. The latter movement can be lateral as wel as rotational movement.

Preferably the device comprise means for moving, placed under the optical observation system the component holder and/or the substrate holder in directions perpendicular to an optical axis of the optical observation system.

Alternatively the device comprise means for moving the optical observation system plus pickup system, placed over a component holder and/or a substrate holder in directions in directions perpendicular to an optical axis of the optical observation system.

It will be clear that, where above two alternatives for relative movement of parts of the device are mentioned a mix of the alternatives is also within the scope of the invention.

Where the substrate holder is for a wafer disk with a diameter of more than 10 inches, it is preferred that the device comprises more than one optical observation system plus associated pick-up system and arm. Each system then covers a part of the disk. This allows the system and in particular the arm of the pick-up system to be relatively short, which increases the speed and/or accuracy.

In order to enable placing the component, the component holder or the arm in the pick-up position, the aligning position and the mounting position, it is advantageous that the device be provided with a displaceable mirror holder with which the mirror can be displaced from at least a position between the component holder and the substrate holder, so that the mirror can be used to align the components, and at least a position in which the component holder can be displaced from the aligning position to the mounting position.

The mirror holder can be adapted here to displace the mirror only within the plane of the mirror. Such a displacement requires few degrees of freedom of movement, and for this purpose results in a construction which is not susceptible, or hardly so, to wear and inaccuracy resulting therefrom. A very simple and robust construction can be obtained by disposing the mirror holder for rotation around an axis perpendicularly of the plane of the mirror.

It is remarked that this is a preferred embodiment, preferably the two equal angles are relatively small. When that is the case, the mirror intersects the trajectory of the arm.

However, if the angles are relatively large, the arm may pass in front of the mirror in which case the mirror can be at a fixed position. Also, when the arm is very narrow, the mirror may comprise a slit through which the arm may pass.

For alignment of the component relative to the substrate either the component or the substrate can be translated or rotated. For this purpose the device preferably comprises either means for translating the substrate parallel to the surface of the substrate or means for translating the component parallel to the surface of the component; and either means for rotating the substrate about a rotation axis perpendicularly of the surface of the substrate or means for translating the component about a rotation axis perpendicularly of the surface of the component. If desired, both the substrate and the component holder can each be arranged for both translation and rotation of the substrate or substrate holder.

For the purpose of providing a good view during alignment, lighting can be provided for the substrate and lighting for the component. Translation and rotation of the component or the substrate are in this way possible during the alignment until the two illuminated images overlap each other and match. The lighting for the component and the lighting for the substrate can here have different colours, and/or for instance be switched on and off repeatedly. When use is made of a camera system for observations the light need not be in the visible range. Especially wafer disk makers have great expertise in using light outside the visible range. Using such lights the accuracy of placement may be increased, “matching” is not to be understood that the two mages must be exactly the same, the one image shows tha bottom part of a chip, with for instance a number of connection points. The other image shows a chip on a receiver wafer disk, also with connection points. The connection points of the two chips are made to match, by varying the relative positions of the disk (and thus the chip on the receiving disk) and the chip in the component holder; the rest of the two images may have different forms or shapes that do not necessarily match.

In a second aspect of the invention the device comprises means for establishing the relative positions of the pivot point of the arm and a reference surface of the substrate holder, convert the established relative position into a signal fed to a controller, said controller being arranged to convert the said signal into a control signal sent to means for moving the component holder and/or the arm for moving the substrate holder and/or the arm to have the pivot point concide with a plane going through the surface.

If the device comprises two or more arms, the device preferably also comprises means for establishing a line or plane through the pivot point of the arms, and means for moving at least one arm to have all pivot points lying in a horizontal plane.

The invention also relate to the use of a described apparatus for placing a part of a donor wafer disk on a receiver wafer disk.

In preferred embodiments the invention relates to a device and method in which the first electronic component forms part of a first wafer disk, being taken from said first wafer disk and positioned on an electronic component on a second wafer disk.

BRIEF DESCRIPTION OF DRAWINGS

The invention will now be elucidated on the basis of the following non-limitative figures, in which like components are designated with like reference numerals.

In the figures

Figures la- Id show a device as known from EP 2 380 428 in a pick-up position; Figures 2a-2d show the same device in an aligning position;

Figures 3a-3c show the same device in a mounting position;

Figures 4A to 4F illustrate a device and method in accordance with a first aspect of the invention;

Figure 5 shows a top view of a platform P having two holders;

Figure 6 and 7 illustrate devices comprising more than one arm;

Figure 8 illustrates an embodiment with an arm that can be rotated.

Figure 9 illustrates stacking of chips on a wafer disk

Figure lOAto 10C illustrate an embodiment in which movement of the tip is used

Figure 11 illustrates aligning a DWD

Figure 12 illustrates a second aspect of the invention.

PREFERRED EMBODIMENTS OF THE INVENTION

Figure la shows a perspective view of a device 1 of EP 2 380 428, comprising a mirror 2 with a semitransparent plane of the mirror, a substrate holder 3 and a component holder 4. A substrate 5 is fixed in substrate holder 3 and a component 6, which also rests on mirror holder 7, is fixed to component holder 4. Mirror holder 7 has an upper plane coinciding with the plane of the mirror of mirror 2. Component holder 4 is mounted for rotation around shaft 9 via an arm 8, which shaft is coaxial with the intersecting line 10 of the plane of the minor of mirror 2 and the surface of substrate 5 on which component 6 has to be mounted. Component 6 is placed in the pick-up position, wherein the surface of component 6 to be mounted on substrate 5 is situated in the plane of the mirror.

Figure lb shows device 1 of figure la as seen from the direction indicated with arrow D in figure la. It can be seen that a user of device 1 looking through viewer 12 is viewing at the position of component 6 on substrate holder 3, and does not see mirror 2 in the pick-up position. Instead of a viewer through which the user looks directly, it is also possible to make use of a camera provided with a display unit, such as a monitor, optionally placed at a distance.

Figure lc shows device 1 of figure la as seen from the direction of arrow E. Line 13 indicates how a user of the device can look at the component via viewer 12. Also indicated is the plane of mirror 14 of mirror 2, which in the device of EP 2 380 428 corresponds with the upper surface of mirror holder 7.

Figures la-lc show how arm 8 rests on stop 16, wherein component holder 4 rests precisely on the component. Figure Id shows a situation prior thereto, in which arm 8 does not yet quite rest on stop 16. When arm 8 is displaced from the situation shown in figure Id in the direction of arrow 15, component holder 4 comes into contact with component 6 at a given moment before arm 8 is limited in its rotation by stop 16.

Component holder 4 is for this purpose connected for translation to the arm. When the arm is now moved further until it lies against stop 16, the arm displaces relative to component holder 4, which remains lying against the component. As soon as the situation is reached as shown in figures la-lc, the arm lies at a predetermined position while the surface of the component to be mounted on the substrate lies in the device of EP 2 380 428 precisely in the plane of minor 14 of mirror 2. This plane of mirror 14 is formed by the upper side of mirror holder 7. That this upper side corresponds with the plane of mirror 14 is brought about in that mirror 2 is preferably formed by two mirror parts, the upper of which is greater than the lower, and between which the plane of the mirror is situated. Since upper mirror part 21 is larger than lower mirror part 22, the dimensions of which correspond with those of a recess 17 in mirror holder 7, upper mirror part 21 of mirror 2 rests precisely on the upper side of mirror holder 7. Holding of the component by component holder 4 can for instance take place in that the component holder is provided with suction means and can apply a vacuum. The translation of the component holder relative to the arm can likewise be blocked or released by means of such provisions. In order to allow the displacement of the arm and the component to take place in as controlled a manner as possible, arm 8 may be provided on the side remote from component holder 4 with a counterweight 27, which is preferably displaceable relative to rotation axis 10 so as to enable control of the moment exerted by counterweight 27.

Figure 2a shows device 1 of the foregoing figures, wherein arm 8 is rotated with the component holder and the component through an angle 18. Angle 18 is equal to the angle between the plane of the mirror and the surface of substrate 5 on which the component has to be placed. The component is hereby placed in the aligning position. Mirror holder 7 is also rotated about shaft 19, whereby a user of the device looking through viewer 12 in direction 13 is now looking at the mirror, as can be seen in figure 2b.

Figure 2c shows that the surface of the substrate on which the component has to be mounted and the surface of the component to be mounted on the substrate are situated in a plane at an equal but opposite angle relative to the plane of mirror 14, wherein the intersecting line 10 of the surface of the component and the surface of the substrate with the plane of mirror 14 coincide. A user of device 1 who is looking in direction 13 now sees an image of substrate 5, because mirror 2 transmits light in direction 13', as well as an image of component 6 because the mirror reflects light in direction 13". Figure 2d shows this in more detail. Shown are an incident light beam 13 and a transmitted light beam 13' as well as a reflected light beam 13". Mirror 2 is preferably constructed from a first part 21 and a second part 22, which are manufactured from optical glass which is cut and polished in the same operation so that they have exactly the same optical thickness. In this way the inevitable parallax 26 (the distance between light beam 13 and the line 25 coinciding with light beam 13') resulting from the refraction by mirror 2 becomes the same for the image of the component and the image of the substrate irrespective of the angle at which viewing takes place through viewer 12. This increases still further the possibility of accurate positioning of a component on a substrate using the present invention.

Figure 3a shows device 1 of figures 1 and 2, wherein the surface of component 6 to be mounted on substrate 5 lies on the surface of the substrate 5 on which component 6 has to be mounted.

To enable movement of component 6 into position, mirror holder 7 is once again rotated about rotation shaft 19 so that mirror 2 and the mirror holder are situated outside the circular path described by component holder 4 when arm 8 is rotated about shaft 9, as shown in figure 3b.

In this position component 6 can be mounted on substrate 5.

In the shown set up the line of sight, forming the optical axis of the optical system, is perpendicular on the mounting surface and the movement is a pivoting movement aroun the pivot point of arm 8. This set up is inherently superior in terms of placing accuracy than a setup in which the line of sight of the camera is at an angle to the mounting surface and the component holder moves up and down from and towards the mounting surface, thus not pivoting.

Such a set-up is for instance known from WO 2011/084058. In WO 2011/084508 the optical observation system comprises a camera system with a very complex optical design.

Although in said document set-ups are shown using only one camera as well as using two camera, in practice two camera systems are needed thus providing for a even more complex design and even then accuracy is limited due to the inherent limitations of the system.

Figures 4A to 4F illustrate a device and method in accordance with a first aspect of the invention.

Wherein in EP 2 380 428 the pick-up position was in the plane of the mirror, in a device in accordance with the invention the pick-up position is given by a platform P. A plane 41 parallel or in this case through the top surface of the platform P intersects the pivoting point of the arm. In figure 4A the arm 8 is in a position wherein the angles 23 and 24 are substantially equal. On the platform P, serving as a means for providing a component to be picked-up, a donor wafer disk DWD is positioned. One of the chips 44 on the disk is to become a component to be placed on an acceptor wafer disk. The camera of the optical system looks at the donor wafer disk at right angles and, via mirror 2, also at the tip 4 of arm 8, which tip comprises means for picking up a selected chip from the donor wafer disk DWD. Given that the plane through the top surface of the platform P intersects the pivoting point 43 of the arm 8, a plane through the bottom surface of donor wafer disk DWD lying on the top surface of the platform also intersects the pivot point 43 of arm 8. The donor wafer disk DWD has a thickness tl.

The platform P is moved via translation means and/or rotation means in one or more directions perpendicular to the plane of the platform P. The camera C records the two images of chip 44 and tip and sends the images to a computer 42. The computer 42 controls the movement of thé platform P. The signals from the camera C to the computer 42 and from the computer to the movement means for the platform may be by any means for transferring data signals, so for instance transfer of the signals could be done wireless. The computer 42 can be any device capable of performing the steps of receiving the data signals from the camera, processing said data to arrive at signals to control movement of the platform P. The computer can be a computing device specific for the device or a central computer controlling more than one device.

It can also be in the form of an app or performed via a server. Such automated control systems are well known.

When the tip 4 is aligned with a to be picked up part of the donor wafer disk DWD, in this case chip 44, the mirror 2 is moved out of the swing trajectory of the arm 8. The tip 4 of the arm 8 is placed on a component, such as e.g. a chip, 44 to be picked up as shown in figure 4C and the chip is picked up, the arm is then swung upwards to a position wherein the angles 23 and 24 are the same. The tip 4 may for instance comprise a vacuum suction device and may be provided with piezo-electric elements to fine tune the position of the tip to the surface and position of the chip on donor wafer disk DWD to be picked up.

Figure 4B shows a preferred step in the method. The arm 8 is positioned sligthly above the donor disk DWD. The distance between a reference plane or point RF on or associated with arm 8 and the top surface of disk DWD is measured, preferably contactless, for instance by means of a laser beam or more than one laser beams being reflected of the top surface of the disk DWD. Alternatively the distance to the upper surface of the platform may be measured contactless, also using the reflection of a laser beam of a reflective surface on the platform. The tip is, in first instance, held at a position where there is always a distance between the tip and the upper surface of the disk DWD to prevent the tip from unwanted bumping on the wafer disk. When this distance is smaller than a threshold, the movement of the arm is arrested and the tip is moved downwards towards the disk DWD, for instance using a inch worm or a piezoelectric device. The distance between the tip and the upper surface of the disk can be calculated, so that it is known how much the downward movement of the tip should at least be within certain margins.

Even so, in preferred embodiments the distance between the tip and the donor disk is measured, this can also be done optically, using the reflection of one or more laser beams. Another possibility is to use a transparent slide attached to the tip held parallel to the upper surface of the disk and shine light on it. When the distance becomes in the order of micrometers, optical interference patterns will appear indicating the distance of the tip to the top surface of disk DWD. It is also possible to use a capacitive distance measurement. Once the distance is below a threshold value, suction is applied to attach the disk to the tip of arm 4. It is remarked that this is a preferred embodiment, preferably the two equal angles 23 and 24 are relatively small. The smaller the movement, the better the accuracy and the faster the speed of procesing. Preferably the angles 23 and 24 are less than 25 degrees, most preferably less than 20 degrees. When that is the case, the mirror, unless very small, intersects the trajectory of the arm 8. However, if the angles are relatively large, there is enough room, when using a small mirror, to have the arm 8 pass in front of the mirror 2 in which case the mirror 2 can remain at a fixed position. Also, even when the angles 23 and 24 are small, when the arm is made very narrow, the mirror may comprise a slit through which the arm may pass. That will have some detrimental effect on the image, but using a camera and a image processing algorithm one can compensate for such effects. Alternatively, the tip may be arranged in such a way, for instance via a joint on the arm, that, while the arm is moving downwards or upwards, the tip swings from a first position to a second position, moving out of the way of the mirror, and then, after having passed the mirror, swings back to the first position. Yet alternatively the arm may make, instead of a straight up- and down wards pivoting movement, a movement along a curve, passing around the mirror.

However, it is preferred that the arm makes a simple pivoting movement, wherein, during the movement, the tip stays in a fixed position. Any additional movement of parts of the arm or in a direction perpendicular to the pivoting movement during the swing introduces possible causes of errors.

It is remarked that what is shown in figure 4A, i.e. aligning of the tip 4 of arm 8 with a chip on donor wafer disk DWD using the optical system is a preferred embodiment.

It is preferred since this allows to make a very accurate match of position of the tip 4 with a to be picked up chip on donor wafer disk DWD.

However, the process step for picking up a chip from the donor disk DWD is a preferred process step, not an essential feature for the invention.

One can also by other means find out, establish or calculate the position of a chip on a disk with respect to the tip 4. For instance when a donor wafer disk DWD is of a well known and fixed dimension with particular chips being positioned on known positions on the donor wafer disk DWD, and the position on the platform of the donor wafer disk DWD is well defined and the platform coordinates are known or measured with respect to where the tip T will land on the donor wafer disk, it is possible to align the tip with the donor disk DWD witouth making use of the optical system. The donor wafer disk DWD may also be provided with for instance optical markings that allow, using the camera or another optical system, to accurately determine the position of the donor disk on the platform. The position of the platform vis-a-vis the arm 8 may likewise be found out, established or calculated. The arm 8 is then kept in an almost horizontal position hovering a small distance above the donor wafer disk, the donor wafer disk is moved to a position where the tip 4 of the arm 8 is accurately above the chip to be picked up and the tip is guided to a position where it can pick the chip from the donor disk. Once the relative position of the tip and the donor disk are correct within an error margin the tip is lowered onto the donor disk and the chip 44 is picked up.

Such methods in general will not have the same accuracy as when using the optical system as described above, but for picking up of the chip the accuracy can be less than for placing the chip on top of a donor disk. The advantage of using the optical system is that the chip can be very accurately positioned on the tip of the arm thus providing a well known and accurate starting position for the placement process step.

However, there is also a disadvantage: it requires moving the mirror 2 back and forth. Also, when a chip has been positioned on a receiver (see figure 4F) the arm 8 is in an almost horizontal position, so it may be useful to keep the arm in such almost horizontal position, lift it slightly and then slide the donor disk under the arm, position the correct chip under the tip, for instance using markings on the wafer disk and then pick up the intended chip from the donor wafer disk.

Figure 4E illustrates the situation when the arm 8 with the chip 44 attached to tip 4 has been positioned such that angles 23 and 24 are equal.

The mirror 2 is returned to the position as shown in previous figures, such as in figure 4A, the optical axis of the optical system going through the mirror 2.

The next step if that a receiver wafer disk RWD is put in position. The plane through the top surface of the receiver wafer disk RWD corresponds to the plane 41 through the bottom surface of donor wafer disk DWD in figure 4A, both of the mentioned planes going through the pivot point 43 of the arm 8.

Figure 4E shows an embodiment in which the platform is lowered by a distance equal to the thickness t2 of the receiver wafer disk RWD. The upper sruface of the receiver wafer disk lies in a plane 45, parallel to the plane 41 and also going through the pivot point 43. Using the optical system, and the means for moving platform P the chip 44 and an element on the receiver wafer disk are optically aligned with respect to each other, for instance such that electrical connections on the bottom of the chip 44 accurately align with corresponding electrical connections on the top surface of the receiver wafer disk RWD. The chip and the receiver disk may also be provided with markings, for instance around the chip 44 and around the receiving chip on disk RWD, for purpose of alignment. The chip 44 and the disk RWD may be aligned by means of the means for moving the platform P. Alternatively or in addition, in embodiments, the tip 4 is provided with means for moving the chip 44 in directions perpendicular to the plane of the chip 44. When there is a combination of movements, i.e. the platform P is moved as well as the tip 4, both movements may be controlled by the computer by means of signals S2 for controlling the position of the disk RWD and signals S3 for controlling position of the tip 4. For both movements the computer may provide signals for movement on the basis of measurements taken by the camera system and provided via signal 51 to the computer. However, it is also possible that for instance a coarse adjustment is done by moving the disk to more or less the correct position without using the measurement taken by the optical system.

The position of the tip 4 is roughly known and the type of chip 44 attached to the tip 4 is known, it is also known on which part of the disk RWD the chip 44 will be attached.

This makes it possible to move the disk RWD to more or less the correct position by signals 52 from the computer to the means for moving the disk holder, even without using the optical system and then use the camera system for fine-tuning the position of the chip 44 vis-a-vis the disk RWD by means of moving the end of the tip 4 via signal S3 and or the platform by means of further signals.

For instance inch-worms can be used for such fine movements of tip 4.

Coarse tuning of the relative position of disk RWD and chip 44 is then done by movement of the large object, the disk, and for such coarse movement there is no need (although it can be used if useful) for using the optical system. Fine tuning of the relative position of chip and disk can then be established by moving the small object, the chip 44, rather than the large object and using the optical system.

Placing markings around the relevant chips on donor and receiver disk DWD, RWD has the advantage, providing that the making process is such that with very high accuracy the markings are position vis-a-vis the chips, that the accuracy can be improved. The distance between the markings can be larger than the extent of the electrical connections, which can improve the accuracy of placement.

The first aspect of the invention lies in having the top surface of the receiver disk RWD (or more in general the substrate) and the bottom surface of the donor disk DWD (or more in general the component to be placed on the substrate) lying, of course within practical error margins, in parallel planes, both of said planes going through the pivot point of the arm 8. Finally, as illustrated schematically in figure 4F, the arm is lowered so that the chip 44 lands on the receiver wafer disk RWD and is released. A similar process as schematically shown in figure 4C may be used to guide this process, i.e. the arm 8 is pivoted, while measuring, preferably contactless, the distance between a reference point or plane on the arm, and when a particular distance is obtained indicating that the tip is close to the surface, the speed of movement is slowed down, so that the arm 8 lands softly on the disk. Suction is then stopped, and the chip is released. A slight charge difference may be applied between chip 44 and disk RWD so that the chip 44 adheres to the disk. Also, the suction action may be replaced by a gentle air flow.

Embodiments in which this may be accomplished are provided in following figures.

In figure 5 a top view is provided of a platform P which has two holders for wafer disks, one for a donor wafer disk DWD and one for a receiver donor disk RWD. The holder for the receiver donor disk RWD is a somewhat deeper holder, deeper that is when compared to the holder for the donor wafer disk DWD, being deeper by a depth difference corresponding to the thickness t2 of the receiver wafer disk RWD. An alternative is that both holders have the same depth but the platform as a whole is lowered by the thickness t2 of the receiver wafer disk RWD, when the receiver wafer disk is positioned under the arm 8 .

Yet another embodiment may be that not the platform P as a whole is lowered, but only the holder part holding the receiver wafer disk RWD.

Preferably the substrate holder for holding the receiver wafer disk RWD and the component platform for holding the donor wafer disk form a single integral unit. This is preferred. It allows the unit holding both the donor wafer disk and the receiver wafer disk to be moved back and forth under the optical system, which increases speed and accuracy.

Yet another possibility is that the platform is kept on the same height and also the disks are on the same height, but, starting from the situation of figure 4C the optical system and the arm with the chip 44 are raised by the thickness t2 and then the receiver wafer disk is placed on platform P in the position under arm 8. This will lead to the same situation as shown in figure 4D. Of course any combination of movements is also possible.

Figure 6 illustrates a preferred embodiment. Two systems are used for a donor respectively receiver wafer disk. Instead of using a single system reaching all over the disk, two systems are used at either side of the disk. This increases the accuracy, independent of the advantage of having the planes of the bottom of the donor disk and the top of the receiver disk both going through the pivot point of the arms, since a shorter arm 8 can be used and the movements of the arm are relatively smaller, which also increases the speed of the mounting process. For both system schematically the arm 8, respectively 8’ and the camera C, respectively C’are shown in figure 6. The pivot points of both arms 8 and 8’ are preferably in a plane going through the plane formed by the bottom of the donor disk and or the top of the receiver disk.

Figure 7 illustrates a further embodiment. Whereas in the other figures the disk platform is moved back and forth under the arm or arms, in the embodiment of figure 7 the platform P and thus the disks RWD and DWD are kept stationary and the devices with the arms 8 and optical systems are moved relative to the stationary disks.

Figure 8 illustrates yet a further embodiment. In this embodiment the arm and the rest of the system is swung over an angle going from one disk to another. When the angle is 90 degrees this allows to switch orientation in the chip. Providing the arm with means for swing the arm is preferred. The chips usually have a rectangular or square form. It is important that the chip alignment as far as vertical and horizontal is concerned is accurate. Of course, one way of doing so is rotating the receiver disk. However, when misalignments are small, a few degrees for instance, one can also swing the arm over a small angle to get good alignment.

In the figures 5 to 8 situations are shown in which a single donor disk and a single receiver disk is used. This is not a restriction, there may be more than one donor disk, for instance two at either side of the receiver disk. There could also be four donor disks arranged in a cross shaped platform round a central receiver disk. Likewise there could be more than one receiver disk for a donor disk.

Figure 9 illustrates a further embodiment. In this embodiment chips are stacked upon a receiver disk. In a first step a first chip is mounted on the receiver wafer disk. Then, the platform is lowered a distance equivalent to the thickness of the component. This need not be the same thickness as the thickness of the receiver wafer disk. If the donor disk from which the first component placed on the receiving wafer disk is taken has a different thickness t2 than the thickness tl of the receiver wafer disk, than in the next stacking step the platform holding the receiving wafer disk is lowered by a distance t2 (or the optical system plus arm is raised by t2). Alternatively it can be measured by optical means just how much the component placed upon the receiver disk extends beyond the disk and then this measurement is used to lower the platform P the appropriate amount.

There where mention is made of planes going through the pivot point, or movements over a distance equivalent to a thickness, this, of course, is not to be taken to be meant in the purely hypothetical mathematical ideal sense of the words, but to be understood on a practical level.

The devices and methods of the invention are not restricted to the above provided examples. Many variations are possible within the scope of the invention.

Figures 10A to 10D provide an example of a variation within the scope of the invention in which the upper surface of the substrate RWD is positioned, during mounting, substantially at the plane of the lower surface of the component 44 during pick-up.

In this example the tip 4 is provided with means for moving the tip in a direction perpendicular to the planes throught the pivot point of the arm. The arm 8 is laid to rest to a stop P, which accurately establishes the position of the arm, when in this position vis-a-vis the other components. The upper surface of the donor disk DWD is aligned with a plane through the pivot point of the arm. The outer end of the tip 4 is also aligned with a plane through the pivot point of the arm 8 and the angles 23 and 24 are the same. The tip 4 has means to move the outer end of the tip in the indicated direction. This is schematically illustrated in figure 10A. The mirror 2 is moved out of the way, and the arm 8 is lowered on disk DWD, the outer end of the tip 4 grapping, for instance by suction action, a chip 44 to be picked up from disk DWD. This is schemetically illustrated in figure 10B. Then the means to move the end of the tip 4, for instance comprising an inch worm, move upwards over a distance tl, the thickness of the disk DWD, to lift the chip 44 vertically just out of the disk DWD. This is schematically illustrated in figure IOC. In this example it is assumed that both disks have the same thickness so tl is equal to t2. This lifting of chip 44 may be done automatically over a known distance or a feedback system such as shown in figure 11 may be used.

During pick-up the bottom surface of the component, chip 44, is thus brought substantially at level with the plane of the upper surface of the disk DWD. This is an illustration of an embodiment in which during pick-up the component holder is moved with respect to the pivot point of the arm, in a direction perpendicular to the mentioned plane, over a distance equivalent to the thickness of the substrate.

The arm is brought back to the stop, and the receiver disk RWD is laid on platform P.

In this example said disk has the same thickness as donor disk DWD. This is illustrated in figure 10D, which is in essence the same as figure 4D. In this embodiment the platform need not have means for moving it up and done, the required movement to bring the bottom surface of the component 44 on one level with the top surface of the receiver disk RWD is performed by means for moving the end of the tip 4 holding the chip 44 upwards over the distance tl.

Figure 11 schematically illustrates a feed-back system for lifting the chip 44 so that it is lifted precisely over the thickness tl of the donor disk. A laser L is shone over the disk. Once the chip 44 is raised just higher than the disk DWD, light will pass under the chip 44. This is detected by a detector and this is used to control the movement at the tip 4. It is also possible to use more than one laser to ensure that all around the chip it is at level with the surface of disk 44.

Figures 4A to 11 describe a first aspect of the invention, namely that the bottom surface of the component during pick-up and the top surface of the substrate lies substantially in the same plane going through the pivot point of arm 8. “Substantially through the same plane” is not to be confused with theoretically mathematically going through the same plane. Practically there will be some difference between the two planes, “subtantially” means that the difference is below a threshold, such as for instance less than 20% of the thickness of the substrate, preferably less than 10% or even less than 5% of the thickness tl of the subtrate. Preferably the two planes coincide within less than 0.2, preferably less than 0.1 even more preferably less than 0.05 mm.

Figure 12 illustrates a second aspect of the invention.

The planes ideally go through the pivot point of the arm. When a static arrangement is used in a single integrated device, with a fixed platform such as shown in figures lAto 3C, this is relatively easy to accomplish.

However, when during the operation the substrate holder moves back and forth, this can not be guaranteed. The substrate holder then has to be moved separate from the arm and this can cause errors. To reduce such errors, in a second aspect of the invention, schematically illustrated in figure 12, the device has means for establishing the plane through a surface of the substrate holder, establishing the position of said plane with respect to the pivot point of the arm, and move the plane and/or the arm for letting the plane intersect the pivot point of the arm.

Figure 12 illustrates this schematically.

The arm is positioned in a bias position. The orientation of the plane 41 through the top surface of platform P is measured. This can for instance be done by measuring the reflection of a laser beam LB1 emanating from the arm on a reflective surface on the platform. If the thickness of a disk is known to accurate enough precision this can also be done via reflection of a laser beam of a disk lying on the platform. Alternatively, one could use a laser beam LB2 that is aligned horizontally and passes through the pivot point (or in a horizontal plane intersecting the pivot point) and aligning the platform P to be parallel, exactly horizonal and in line with said laser beam. Schematically this is illustrated by the arrow going through the pivot point and into a detector, schematically indicated by an eye symbol. Signals S4 and/or S5 indicating the relative position of the top surface of platform P with respect to the pivot point 43 of arm 8 are provided to computer 42. These signals S4 and/or S5 are converted into signals S6 for moving the platform P up or down, as the case may be, to have the plane 41 intersect the pivot point 43 of arm 8. Alternatively, the arm 8 with pivot point 43 may be moved up or down to achieve the same result or a combination of both movements. This is the case if said plane is to pass through the pivot point. In the situation as shown in figure 4A or 10B the plane 41 is to extend a distance tl under the pivot point 43. The same or similar means can be used.

This aspect is in particular advantageous when two or more arms are used,such as schematically illustrated in figures 6 and 7. The pivot points of both arms are preferably in line with the surface 41 of the platform.

In the second aspect of the invention the device comprises means for establishing the relative positions of the pivot point of the arm and a reference surface of the substrate holder, convert the established relative position into a signal fed to a controller, said controller being arranged to convert the said signal into a control signal sent to means for moving the component holder and/or the arm for moving the substrate holder and/or the arm for to have the pivot point concide with the surface. If the device comprises two or more arms, the device preferably also comprises means for establishing a line or plane through the pivot points of the arms, and means for moving at least one arm to have all pivot points lying in a horizontal plane.

If more than one arm 8 is used, it is advantageous if all pivot points extend, at least in a known starting position, in a horizontal plane. The platform P can then also he held in a horizontal plane.

The crux of the second aspect lies in using measuring means for measuring the alignment of the plane through a plane parallel to the top surface of the substrate holder with respect to the pivot point of the arm, and the device having a system for converting the measurement position into signals for moving the substrate holder and/or the arm in a direction perpendicular to the plane for having the plane and the pivot point coincide.

In short the invention can be described as follows: A method and device for positioning a substrate and a component for mounting thereon relative to each other. An apparatus is used which comprises a dividing mirror and an arm pivoting around a pivot point. For instance a component (44), a chip, is picked from a donor wafer disk (DWD) brought to an alignment position and aligned with respect to a receiver wafer disk and placed on a receiver wafer disk (RWD).

The various figures illustrate embodiments of this general idea.

It is remarked that any of the technical features shown in figures may be combined with technical features shown in other figures.

Means for moving of elements or parts of elements as schematically shown in the figures may for instance be stepmotors, hydraulic means, inch worms, piezo-electrical elements, motor or electrically driven screws etc. etc.

Claims

1. Apparaat voor het uitlijnen van een component (44) en een substraat (RWD) en het plaatsen van de component (44) op het substraat (RWD) waarbij het apparaat een optisch systeem bevat met een verdeelspiegel (2), een substraathouder voor het tijdens het uitlijnen houden van een bovenste oppervlak van het substraat in een eerste vlak dat een eerste hoek (23) maakt met de verdeelspiegel (2) en een componenthouder (4) voor het houden van een oppervlak van de component (44) in een tweede vlak dat een tweede hoek (24) maakt met de verdeelspiegel (2), gelijk aan de eerste hoek maar in tegengestelde richting, en middelen voor het over de eerste en tweede hoeken (23+24) bewegen van een uitgelijnde component door draaien van een arm (2) over een draaipunt (43) en een componentplatform voor het houden van de component (44) met een onderste oppervlak in een oppakpositie met het kenmerk, dat het apparaat middelen bevat voor het houden, tijdens het oppakken, van een onderste oppervlak van de component (44) in hoofdzaak in een eerste vlak (41) door het draaipunt (43) van de arm (8), en, in de plaatsingspositie, houden van het bovenste oppervlak van het substraat (RWD) in hoofdzaak in een tweede vlak (45) parallel aan het eerste vlak en ook door het draaipunt (43) van de arm (8).An apparatus for aligning a component (44) and a substrate (RWD) and placing the component (44) on the substrate (RWD), wherein the apparatus comprises an optical system with a distribution mirror (2), a substrate holder for maintaining an upper surface of the substrate during alignment in a first plane making a first angle (23) with the distribution mirror (2) and a component holder (4) for holding a surface of the component (44) in a second plane making a second angle (24) with the distribution mirror (2), equal to the first angle but in opposite direction, and means for moving an aligned component through the first and second corners (23 + 24) by rotating an arm (2) over a pivot point (43) and a component platform for holding the component (44) with a lower surface in a picking position, characterized in that the device comprises means for holding, during picking up, a lower surface of the compos graft (44) substantially in a first plane (41) through the pivot point (43) of the arm (8), and, in the placement position, holding the upper surface of the substrate (RWD) substantially in a second plane ( 45) parallel to the first plane and also through the pivot point (43) of the arm (8).

2. Apparaat voor het uitlijnen van een component (44) en een substraat (RWD) en het plaatsen van de component (44) op het substraat (RWD) waarbij het apparaat een optisch systeem bevat met een verdeelspiegel (2), een substraathouder voor het tijdens het uitlijnen houden van een bovenste oppervlak van het substraat in een eerste vlak dat een eerste hoek (23) maakt met de verdeelspiegel (2) en een componenthouder (4) voor het houden van een oppervlak van de component (44) in een tweede vlak dat een tweede hoek (24) maakt met de verdeelspiegel (2), gelijk aan de eerste hoek maar in tegengestelde richting, en middelen voor het over de eerste en tweede hoeken (23+24) bewegen van een uitgelijnde component door draaien van een arm (2) over een draaipunt (43) en een componentplatform voor het houden van de component (44) met een onderste oppervlak in een oppakpositie met het kenmerk, dat het apparaat middel bevat voor het vaststellen van de relatieve positie van een oppervlak van de substraathouder ten opzichte van het draaipunt (43) van de arm (8), en middelen voor het ten opzichte van het draaipunt van de arm bewegen van de substraathouder of een deel van de substraathouder dat genoemd oppervlak bevat voor het uitlijnen van een vlak door genoemd oppervlak en het draaipunt van de arm.An apparatus for aligning a component (44) and a substrate (RWD) and placing the component (44) on the substrate (RWD), the apparatus comprising an optical system with a distribution mirror (2), a substrate holder for maintaining an upper surface of the substrate during alignment in a first plane making a first angle (23) with the distribution mirror (2) and a component holder (4) for holding a surface of the component (44) in a second plane making a second angle (24) with the distribution mirror (2), equal to the first angle but in opposite direction, and means for moving an aligned component through the first and second corners (23 + 24) by rotating an arm (2) over a pivot point (43) and a component platform for holding the component (44) with a lower surface in a pick-up position, characterized in that the apparatus comprises means for determining the relative position of a surface of the substrate parent relative to the pivot point (43) of the arm (8), and means for moving the substrate holder or a portion of the substrate holder relative to the pivot point of the arm that includes said surface for aligning a plane through said surface and pivot point of the arm.

3. Apparaat volgens conclusie 1 of 2, met het kenmerk, dat het apparaat een component platform en een substraathouder bevat, geschikt om onder het optisch systeem te worden geplaatst, waarbij het component platform en de substraat houder bodemoppervlakken hebben die zich in parallelle vlakken uitstrekken, op een vastgestelde afstand van elkaar, gemeten in een richting dwars op de bodemoppervlakken.An apparatus according to claim 1 or 2, characterized in that the apparatus comprises a component platform and a substrate holder suitable for being placed under the optical system, the component platform and the substrate holder having bottom surfaces extending in parallel planes , at a set distance from each other, measured in a direction transverse to the bottom surfaces.

4. Apparaat volgens conclusie een der voorgaande conclusies, met het kenmerk, dat het apparaat middelen bevat om een afstand tussen een bodemoppervlak van het component platform en de substraathouder, dwars op het bodemoppervlak, te variëren.Apparatus as claimed in any one of the preceding claims, characterized in that the apparatus comprises means for varying a distance between a bottom surface of the component platform and the substrate holder, transverse to the bottom surface.

5. Apparaat volgens conclusie een der voorgaande conclusies, met het kenmerk, dat het apparaat middelen bevat voor het bewegen, ten opzichte van de substraathouder, van het optisch systeem en arm (8) met draaipunt (43) in een richting dwars op een bodemoppervlak van de substraathouder.Apparatus according to one of the preceding claims, characterized in that the apparatus comprises means for moving, relative to the substrate holder, the optical system and arm (8) with pivot point (43) in a direction transverse to a bottom surface from the substrate holder.

6. Apparaat volgens een der voorgaande conclusies, met het kenmerk, dat de componenthouder middelen bevat voor het, na oppakken van de component, bewegen van de opgepakte component (44), bij vast draaipunt van de arm, in een richting dwars op de component.Apparatus as claimed in any one of the preceding claims, characterized in that the component holder comprises means for moving the picked up component (44) after picking up the component, at a fixed pivot point of the arm, in a direction transverse to the component .

7. Apparaat volgens een der voorgaande conclusies, waarbij het apparaat van meer dan een arm met draaipunt voorzien is.Device as claimed in any of the foregoing claims, wherein the device is provided with more than one arm with pivot point.

8. Apparaat volgens conclusie 7, met het kenmerk, dat de substraathouder ingericht is voor het houden van een disk met een doorsnede van 10 inches of meer,Device as claimed in claim 7, characterized in that the substrate holder is adapted to hold a disc with a diameter of 10 inches or more,

9. Apparaat volgens conclusie 8, waarbij het apparaat voorzien is van middelen voor het op een horizontaal vlak instellen van de draaipunten van de armen.Device as claimed in claim 8, wherein the device is provided with means for setting the pivot points of the arms on a horizontal plane.

10. Apparaat volgens conclusie 7, 8 of 9, met het kenmerk, dat het bereik van de armen een overlap vertonen.Device according to claim 7, 8 or 9, characterized in that the region of the arms has an overlap.

11. Apparaat volgens een der voorgaande conclusies, met het kenmerk, dat het component platform ingericht is om een donor wafer disk (DWD) te ontvangen.An apparatus according to any one of the preceding claims, characterized in that the component platform is arranged to receive a donor wafer disk (DWD).

12. Apparaat volgens een der voorgaande conclusies, met het kenmerk, dat de substraathouder ingericht is om een receiver wafer disk (RWD) te ontvangen.An apparatus according to any one of the preceding claims, characterized in that the substrate holder is adapted to receive a receiver wafer disk (RWD).

13. Apparaat volgens een der voorgaande conclusies, met het kenmerk, dat het componentplatform en de substraathouder een integraal onderdeel vormen.Device according to one of the preceding claims, characterized in that the component platform and the substrate holder form an integral part.

14. Gebruik van een apparaat voor het uitlijnen van een component (44) en een substraat (RWD) ten opzichte van elkaar en het vervolgens plaatsen van de component (44) op het substraat (RWD) waarbij het apparaat een optisch systeem bevat met een verdeelspiegel (2), een substraathouder bevat voor het tijdens het uitlijnen houden van een bovenste oppervlak van het substraat in een eerste vlak dat een eerste hoek (23) maakt met de verdeelspiegel (2) en een componenthouder (4) voor het houden van een oppervlak van de component (44) in een tweede vlak dat een tweede hoek (24) maakt met de verdeelspiegel (2), gelijk aan de eerste hoek maar in tegengestelde richting, waarbij het apparaat middelen bevat voor het over de eerste en tweede hoeken (23+24) bewegen van een uitgelijnde component door draaien van een arm (2) over een draaipunt (43) en een componentplatform (P) voor het houden van de component (44) met een onderste oppervlak in een oppakpositie voor het oppakken van een component (44) van een donor wafer disk (DWD), gelegen in een vlak parallel aan een vlak door een receiver wafer disk (RWD), het brengen van de component in een uitlijnpositie, het uitlijnen van component en receiver wafer disk, en het plaatsen van de component (44) op de receiver wafer disk (RWD).Use of an apparatus for aligning a component (44) and a substrate (RWD) with respect to each other and then placing the component (44) on the substrate (RWD) wherein the apparatus includes an optical system with a distribution mirror (2), a substrate holder for holding an upper surface of the substrate during alignment in a first plane making a first angle (23) with the distribution mirror (2) and a component holder (4) for holding a surface of the component (44) in a second plane making a second angle (24) with the distribution mirror (2), equal to the first angle but in the opposite direction, the apparatus including means for passing over the first and second angles ( 23 + 24) moving an aligned component by rotating an arm (2) over a pivot point (43) and a component platform (P) for holding the component (44) with a lower surface in a pick up position for picking up a component (44) v a donor wafer disk (DWD) located in a plane parallel to a plane through a receiver wafer disk (RWD), bringing the component into an alignment position, aligning the component and receiver wafer disk, and placing the component (44) on the receiver wafer disk (RWD).

15. Gebruik van een apparaat volgens een der conclusies 1 tot en met 12, voor het het houden van de component (44) met een onderste oppervlak in een oppakpositie voor het oppakken van een component (44) van een donor wafer disk (DWD), gelegen in een vlak parallel aan een vlak door een receiver wafer disk (RWD), het brengen van de component in een uitlijnpositie, het uitlijnen van component en receiver wafer disk, en het plaatsen van de component op de receiver wafer disk.Use of an apparatus according to any of claims 1 to 12, for holding the component (44) with a lower surface in a pick-up position for picking up a component (44) of a donor wafer disk (DWD) located in a plane parallel to a plane through a receiver wafer disk (RWD), bringing the component into an alignment position, aligning the component and receiver wafer disk, and placing the component on the receiver wafer disk.

16. Gebruik volgens conclusies 14 of 15, met het kenmerk, dat het apparaat twee armen bevat, die beide een gebied van de receiver wafer disk bestrijken, waarbij de gebieden een overlap vertonen.Use according to claims 14 or 15, characterized in that the device comprises two arms, both covering an area of the receiver wafer disk, the areas having an overlap.

17. Gebruik van een apparaat volgens conclusie 14, met het kenmerk, dat de receiver wafer disk (RWD) een diameter heeft groter dan 10 inches.Use of an apparatus according to claim 14, characterized in that the receiver wafer disk (RWD) has a diameter greater than 10 inches.