MY196926A - Processing device for electronic components - Google Patents
Processing device for electronic componentsInfo
- Publication number
- MY196926A MY196926A MYPI2019006612A MYPI2019006612A MY196926A MY 196926 A MY196926 A MY 196926A MY PI2019006612 A MYPI2019006612 A MY PI2019006612A MY PI2019006612 A MYPI2019006612 A MY PI2019006612A MY 196926 A MY196926 A MY 196926A
- Authority
- MY
- Malaysia
- Prior art keywords
- sub
- electronic components
- processing mechanism
- step processing
- holding
- Prior art date
Links
- 230000007246 mechanism Effects 0.000 abstract 8
- 230000002093 peripheral effect Effects 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/80—Turntables carrying articles or materials to be transferred, e.g. combined with ploughs or scrapers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Specific Conveyance Elements (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
This processing device (I) for electronic components (S) has a main table (2), a step processing mechanism (5a to 5j), a sub-table (10), and a direction correcting part (Se). The main table (2) has a plurality of holding mechanisms (6) for holding electronic components (S) and conveys the electronic components (S). The step processing mechanism (5a to 5j) is provided peripheral to the main table (2). The sub-table (I 0) is provided between the main table (2) and the step processing mechanism (5a to 5j). The sub-table (10) receives, at a first handover position (T1). an electronic component (S) from a holding mechanism ( 6) and conveys same to a processing position of the step processing mechanism (5a to 5j). The electronic component (S) step-processed in the step processing mechanism is handed over by the sub-table (10) to the holding mechanism (6) again at a second handover position (T2). The direction correcting part (Se) corrects misalignment in direction arising from the handover of the electronic component (S) to the sub-table (10). (FIG. 1)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018021614A JP6516132B1 (en) | 2018-02-09 | 2018-02-09 | Electronic component processing device |
PCT/JP2019/003995 WO2019156055A1 (en) | 2018-02-09 | 2019-02-05 | Processing device for electronic components |
Publications (1)
Publication Number | Publication Date |
---|---|
MY196926A true MY196926A (en) | 2023-05-11 |
Family
ID=66625479
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2019006612A MY196926A (en) | 2018-02-09 | 2019-02-05 | Processing device for electronic components |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6516132B1 (en) |
CN (1) | CN110622285B (en) |
MY (1) | MY196926A (en) |
WO (1) | WO2019156055A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021004109A (en) * | 2019-06-25 | 2021-01-14 | 上野精機株式会社 | Processing device of electronic component |
JP6817648B1 (en) * | 2019-09-20 | 2021-01-20 | 上野精機株式会社 | Electronic component processing equipment |
JP6836816B1 (en) * | 2020-05-28 | 2021-03-03 | 上野精機株式会社 | Electronic component processing equipment |
JP6860249B1 (en) * | 2020-05-28 | 2021-04-14 | 上野精機株式会社 | Electronic component processing equipment |
JP6842732B1 (en) * | 2020-09-24 | 2021-03-17 | 上野精機株式会社 | Electronic component processing equipment |
WO2023229030A1 (en) * | 2022-05-27 | 2023-11-30 | 上野精機株式会社 | Component conveyance device |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1126477A (en) * | 1997-06-30 | 1999-01-29 | Toshiba Corp | Method and device for manufacturing semiconductor device |
JP3613122B2 (en) * | 2000-03-16 | 2005-01-26 | 松下電器産業株式会社 | Electronic component mounting equipment |
JP4554852B2 (en) * | 2001-09-05 | 2010-09-29 | Necエンジニアリング株式会社 | Electronic component measuring device |
JP4849661B2 (en) * | 2005-03-30 | 2012-01-11 | 上野精機株式会社 | Electronic component processing equipment |
JP2008173744A (en) * | 2007-01-22 | 2008-07-31 | Tokyo Electron Ltd | Conveying position alignment method for conveying system |
WO2013084297A1 (en) * | 2011-12-06 | 2013-06-13 | 上野精機株式会社 | Post-operation processing device, transportation device for externally placed unit, and electronic component transportation device |
JP5975556B1 (en) * | 2015-12-11 | 2016-08-23 | 上野精機株式会社 | Transfer equipment |
-
2018
- 2018-02-09 JP JP2018021614A patent/JP6516132B1/en active Active
-
2019
- 2019-02-05 MY MYPI2019006612A patent/MY196926A/en unknown
- 2019-02-05 WO PCT/JP2019/003995 patent/WO2019156055A1/en active Application Filing
- 2019-02-05 CN CN201980002326.9A patent/CN110622285B/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN110622285B (en) | 2022-10-28 |
CN110622285A (en) | 2019-12-27 |
JP2019140218A (en) | 2019-08-22 |
JP6516132B1 (en) | 2019-05-22 |
WO2019156055A1 (en) | 2019-08-15 |
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