MY196431A - Photosensitive Element, Resin Composition For Forming Barrier Layer, Method For Forming Resist Pattern, And Method For Producing Printed Wiring Board - Google Patents

Photosensitive Element, Resin Composition For Forming Barrier Layer, Method For Forming Resist Pattern, And Method For Producing Printed Wiring Board

Info

Publication number
MY196431A
MY196431A MYPI2018700383A MYPI2018700383A MY196431A MY 196431 A MY196431 A MY 196431A MY PI2018700383 A MYPI2018700383 A MY PI2018700383A MY PI2018700383 A MYPI2018700383 A MY PI2018700383A MY 196431 A MY196431 A MY 196431A
Authority
MY
Malaysia
Prior art keywords
barrier layer
forming
photosensitive element
resin composition
wiring board
Prior art date
Application number
MYPI2018700383A
Inventor
Kume Masakazu
Ono Hiroshi
Matsumura Ryo
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of MY196431A publication Critical patent/MY196431A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

Abstract

An object is to provide a photosensitive element capable of improving the releasability between a barrier layer and a support film without using a release accelerator, and provided is a photosensitive element comprising a support film, a barrier layer, and a photosensitive layer in this order, wherein the barrier layer contains a water-soluble resin, and a C3 or higher alcohol.
MYPI2018700383A 2015-07-30 2016-07-20 Photosensitive Element, Resin Composition For Forming Barrier Layer, Method For Forming Resist Pattern, And Method For Producing Printed Wiring Board MY196431A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015150530 2015-07-30
PCT/JP2016/071311 WO2017018299A1 (en) 2015-07-30 2016-07-20 Photosensitive element, resin composition for forming barrier layer, method for forming resist pattern, and method for producing printed wiring board

Publications (1)

Publication Number Publication Date
MY196431A true MY196431A (en) 2023-04-10

Family

ID=57885609

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2018700383A MY196431A (en) 2015-07-30 2016-07-20 Photosensitive Element, Resin Composition For Forming Barrier Layer, Method For Forming Resist Pattern, And Method For Producing Printed Wiring Board

Country Status (6)

Country Link
JP (1) JP6870612B2 (en)
KR (2) KR102572426B1 (en)
CN (3) CN107924130B (en)
MY (1) MY196431A (en)
TW (1) TWI705307B (en)
WO (1) WO2017018299A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018180168A (en) * 2017-04-07 2018-11-15 ホヤ レンズ タイランド リミテッドＨＯＹＡ Ｌｅｎｓ Ｔｈａｉｌａｎｄ Ｌｔｄ Method for manufacturing optical member with processed pattern formed thereon
JP2019179135A (en) * 2018-03-30 2019-10-17 ホヤ レンズ タイランド リミテッドＨＯＹＡ Ｌｅｎｓ Ｔｈａｉｌａｎｄ Ｌｔｄ Spectacle lens, spectacles, and method of fabricating spectacle lens
WO2019215848A1 (en) * 2018-05-09 2019-11-14 日立化成株式会社 Photosensitive element, barrier layer forming resin composition, resist pattern forming method, and printed wiring board manufacturing method
EP3723459A1 (en) 2019-04-10 2020-10-14 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with high passive intermodulation (pim) performance
WO2020261523A1 (en) * 2019-06-27 2020-12-30 昭和電工マテリアルズ株式会社 Transfer-type photosensitive film, method for forming resin cured film and method for producing substrate with resin cured film
KR20220135885A (en) * 2021-03-31 2022-10-07 코오롱인더스트리 주식회사 Photosensitive laminate, and method of manufacturing a circuit board using the same
KR20220135886A (en) * 2021-03-31 2022-10-07 코오롱인더스트리 주식회사 Photosensitive laminate, and method of manufacturing a circuit board using the same
KR20220135887A (en) * 2021-03-31 2022-10-07 코오롱인더스트리 주식회사 Photosensitive laminate, and method of manufacturing a circuit board using the same
KR20220135884A (en) * 2021-03-31 2022-10-07 코오롱인더스트리 주식회사 Photosensitive laminate, method of manufacturing a photosensitive laminate, and method of manufacturing a circuit board using the same
WO2024009432A1 (en) * 2022-07-06 2024-01-11 株式会社レゾナック Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing semiconductor package substate or printed wiring board

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5551255Y2 (en) 1976-04-12 1980-11-28
JPS5483734U (en) 1977-11-26 1979-06-13
US4374190A (en) * 1978-09-28 1983-02-15 Am International, Inc. Erasable intermediate diazo-type paper
JPS59137948A (en) * 1983-01-27 1984-08-08 Mitsubishi Chem Ind Ltd Photoresist material like dry film
JPS59137948U (en) * 1983-03-07 1984-09-14 コ−リツエンジニアリング株式会社 coke oven lid
US4835086A (en) * 1988-02-12 1989-05-30 Hoechst Celanese Corporation Polysulfone barrier layer for bi-level photoresists
JP2687187B2 (en) * 1990-12-01 1997-12-08 富士写真フイルム株式会社 Image forming method and transfer material
JPH11288095A (en) * 1998-03-31 1999-10-19 Nippon Paper Industries Co Ltd Oxygen intercepting film forming material and oxygen intercepting film
WO2003050620A1 (en) * 2001-12-13 2003-06-19 Fuji Photo Film Co., Ltd. Image forming material
JP2005202066A (en) * 2004-01-14 2005-07-28 Fuji Photo Film Co Ltd Light-sensitive transfer sheet, light-sensitive laminate, image pattern forming method, and wiring pattern forming method
TWI352875B (en) * 2003-08-15 2011-11-21 Fujifilm Corp Photosensitive transcription sheet, photosensitive
WO2007125992A1 (en) * 2006-04-28 2007-11-08 Asahi Kasei Emd Corporation Photosensitive resin laminate
US7799504B2 (en) * 2007-06-05 2010-09-21 Eastman Kodak Company Mask film to form relief images and method of use
JP2010085552A (en) * 2008-09-30 2010-04-15 Fujifilm Corp Photomask blanks and photomask
JP5481339B2 (en) * 2009-09-30 2014-04-23 富士フイルム株式会社 Planographic printing plate precursor and plate making method
JP5814667B2 (en) 2011-07-15 2015-11-17 旭化成イーマテリアルズ株式会社 Photosensitive element
JP5743783B2 (en) * 2011-07-27 2015-07-01 富士フイルム株式会社 Photosensitive composition, planographic printing plate precursor, and polyurethane
CN104871088A (en) * 2012-12-12 2015-08-26 日立化成株式会社 Photosensitive resin composition and photosensitive film using same
JP6205925B2 (en) * 2013-07-12 2017-10-04 日立化成株式会社 Photosensitive conductive film, conductive pattern forming method using the same, and conductive pattern substrate
JP6284849B2 (en) * 2013-08-23 2018-02-28 富士フイルム株式会社 Laminate

Also Published As

Publication number Publication date
CN107924130A (en) 2018-04-17
TWI705307B (en) 2020-09-21
KR102572426B1 (en) 2023-08-30
TW201710796A (en) 2017-03-16
CN110225665B (en) 2021-04-06
CN110161802B (en) 2022-08-23
CN110225665A (en) 2019-09-10
JPWO2017018299A1 (en) 2018-05-17
KR20180035827A (en) 2018-04-06
JP6870612B2 (en) 2021-05-12
CN107924130B (en) 2022-01-14
CN110161802A (en) 2019-08-23
KR20230129587A (en) 2023-09-08
WO2017018299A1 (en) 2017-02-02

Similar Documents

Publication Publication Date Title
MY196431A (en) Photosensitive Element, Resin Composition For Forming Barrier Layer, Method For Forming Resist Pattern, And Method For Producing Printed Wiring Board
EP3614206A4 (en) Photosensitive composition for euv light, pattern forming method, and method for producing electronic device
KR20180084713A (en) Pattern formation method, lithography apparatus, lithography system, and article manufacturing method
EP3492982A4 (en) Photosensitive resin composition, cured film, laminate, method for producing cured film, method for producing laminate, and semiconductor device
EP3158578A4 (en) Adhesion layer composition, method for forming film by nanoimprinting, methods for manufacturing optical component, circuit board and electronic apparatus
EP3348542A4 (en) Compound, resin, resist composition or radiation-sensitive composition, method for forming resist pattern, method for producing amorphous film, material for forming lithographic underlayer film, compostion for forming lithographic underlayer film, method for forming circuit pattern, and purification method
EP3257835A4 (en) Compound, resin, lithography underlayer film forming material, lithography underlayer film forming composition, lithography underlayer film, method for forming resist pattern, method for forming circuit pattern, and method for purifying compound or resin
EP3346334A4 (en) Material for forming underlayer films for lithography, composition for forming underlayer films for lithography, underlayer film for lithography and method for producing same, and resist pattern forming method
EP3040777A4 (en) Pattern forming method using resist underlayer film
EP3017460A4 (en) Method of producing film, method of producing optical component, method of producing circuit board, method of producing electronic component, and photocurable composition
EP3395845A4 (en) Compound, resin, composition, method for forming resist pattern, and method for forming circuit pattern
EP3410215A4 (en) Film mask, method for manufacturing same, and method for forming pattern using film mask and pattern formed thereby
TW201713184A (en) Three-dimensional wiring board production method, three-dimensional wiring board, and substrate for three-dimensional wiring board
EP2940527A4 (en) Photosensitive resin composition, photosensitive film, and method for forming resist pattern
BR112017009818A2 (en) multilayer deflector structure and method for producing the multilayer deflector structure
EP3346335A4 (en) Material for forming underlayer films for lithography, composition for forming underlayer films for lithography, underlayer film for lithography and method for producing same, pattern forming method, resin, and purification method
EP2715451A4 (en) Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition, resist film, method for manufacturing electronic device, and electronic device
EP3128369A4 (en) Photosensitive resin composition, lithographic printing original plate and method for producing lithographic printing plate
EP3483214A4 (en) Resin composition, resin film, laminate, multilayer printed wiring board and method for producing multilayer printed wiring board
EP3410214A4 (en) Film mask, method for manufacturing same, and method for forming pattern using film mask and pattern formed thereby
SG11201606713QA (en) Curable composition for photoimprint, cured product, and method of producing film having pattern, optical component, circuit board, or electronic component using the composition
EP3437894A4 (en) Lithographic printing plate original plate and laminate thereof and method for manufacturing lithographic printing plate original plate
EP3267256A4 (en) Underlayer film-forming material for lithography, underlayer film-forming composition for lithography, underlayer film for lithography, resist pattern-forming method, and circuit pattern-forming method
EP3718762A4 (en) Mold release film and method for producing laminate
EP3865297A4 (en) Transparent resin film, decorative board, and method for producing decorative board