MY196409A - Surface Protection Adhesive Tape for Semiconductor Wafer Backgrinding, And Semiconductor Wafer Grinding Method - Google Patents

Surface Protection Adhesive Tape for Semiconductor Wafer Backgrinding, And Semiconductor Wafer Grinding Method

Info

Publication number
MY196409A
MY196409A MYPI2018701530A MYPI2018701530A MY196409A MY 196409 A MY196409 A MY 196409A MY PI2018701530 A MYPI2018701530 A MY PI2018701530A MY PI2018701530 A MYPI2018701530 A MY PI2018701530A MY 196409 A MY196409 A MY 196409A
Authority
MY
Malaysia
Prior art keywords
semiconductor wafer
adhesive tape
grinding
surface protection
grinding method
Prior art date
Application number
MYPI2018701530A
Inventor
Yokoi Hirotoki
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of MY196409A publication Critical patent/MY196409A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Adhesive Tapes (AREA)

Abstract

A surface-protective adhesive tape (3) for back-grinding of a semiconductor wafer (5), comprising: a substrate (1); and a temporally adhesive layer (2) provided on one side of the substrate (1), wherein a surface roughness Rz of the side of the substrate (1) on which the temporally adhesive layer (2) has not been formed is from 0.7 to 5.0 ?m, wherein a total light transmittance of the surface-protective adhesive tape (3) for back-grinding of the semiconductor wafer (5) at an wavelength of 500 to 600 nm is from 40 to 80%, wherein a difference (?ET-?EM) between a color difference (?EM) of a mirror wafer and a color difference (?ET) under a condition that the surface-protective adhesive tape (3) for back-grinding of the semiconductor wafer (5) has been laminated on the mirror wafer is more than 6.5, and wherein the surface-protective adhesive tape (3) for back-grinding of the semiconductor wafer (5) is laminated on a surface of the semiconductor wafer (5) having a notch (6) and is used in the step of back-grinding of the semiconductor wafer (5); and a method of grinding a semiconductor wafer (5) using the same.
MYPI2018701530A 2015-10-21 2015-10-21 Surface Protection Adhesive Tape for Semiconductor Wafer Backgrinding, And Semiconductor Wafer Grinding Method MY196409A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2015/079665 WO2017068659A1 (en) 2015-10-21 2015-10-21 Surface protection adhesive tape for semiconductor wafer backgrinding, and semiconductor wafer grinding method

Publications (1)

Publication Number Publication Date
MY196409A true MY196409A (en) 2023-03-29

Family

ID=58557948

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2018701530A MY196409A (en) 2015-10-21 2015-10-21 Surface Protection Adhesive Tape for Semiconductor Wafer Backgrinding, And Semiconductor Wafer Grinding Method

Country Status (5)

Country Link
KR (1) KR102060981B1 (en)
CN (1) CN107431007B (en)
MY (1) MY196409A (en)
SG (1) SG11201802886RA (en)
WO (1) WO2017068659A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220012515A (en) 2020-07-23 2022-02-04 주식회사 엘지화학 Method for determination of adhesive tape cutting properties
JP7260017B1 (en) 2022-01-31 2023-04-18 大日本印刷株式会社 Adhesive tape for semiconductor processing

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3511346B2 (en) * 1996-12-05 2004-03-29 三井化学株式会社 Method for grinding back surface of semiconductor wafer and pressure-sensitive adhesive film used in the method
JP4585164B2 (en) * 2002-07-18 2010-11-24 日東電工株式会社 UV curable adhesive sheet
JP5165829B2 (en) * 2004-02-26 2013-03-21 日東電工株式会社 Rolled wafer processing adhesive sheet
JP5019619B2 (en) * 2008-03-27 2012-09-05 古河電気工業株式会社 Wafer surface protection tape
JP2011054934A (en) * 2009-08-04 2011-03-17 Nitto Denko Corp Sheet for processing semiconductor
JP5764600B2 (en) 2012-03-22 2015-08-19 古河電気工業株式会社 Surface protective adhesive tape for back surface grinding of semiconductor wafer and method of processing semiconductor wafer
JP5117629B1 (en) * 2012-06-28 2013-01-16 古河電気工業株式会社 Adhesive tape for wafer processing
JP6095996B2 (en) * 2013-02-08 2017-03-15 日東電工株式会社 Adhesive tape
JP6071712B2 (en) * 2013-04-05 2017-02-01 日東電工株式会社 Adhesive tape
JP6374199B2 (en) * 2014-03-31 2018-08-15 日東電工株式会社 Die bond film, dicing die bond film and laminated film
JP2016210837A (en) * 2015-04-30 2016-12-15 日東電工株式会社 Rear face protective film, film, manufacturing method of semiconductor device and manufacturing method of protective chip

Also Published As

Publication number Publication date
SG11201802886RA (en) 2018-05-30
WO2017068659A1 (en) 2017-04-27
CN107431007A (en) 2017-12-01
KR102060981B1 (en) 2019-12-31
CN107431007B (en) 2020-09-18
KR20180005158A (en) 2018-01-15

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