MY194250A - Electrolytic treatment assembly and surface treatment apparatus using same - Google Patents

Electrolytic treatment assembly and surface treatment apparatus using same

Info

Publication number
MY194250A
MY194250A MYPI2019007260A MYPI2019007260A MY194250A MY 194250 A MY194250 A MY 194250A MY PI2019007260 A MYPI2019007260 A MY PI2019007260A MY PI2019007260 A MYPI2019007260 A MY PI2019007260A MY 194250 A MY194250 A MY 194250A
Authority
MY
Malaysia
Prior art keywords
anode
surface treatment
nozzle
unit
same
Prior art date
Application number
MYPI2019007260A
Inventor
Katsumi Ishii
Shigeyuki Watanabe
Original Assignee
Almex Pe Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Almex Pe Inc filed Critical Almex Pe Inc
Publication of MY194250A publication Critical patent/MY194250A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)

Abstract

An electrolytic treatment assembly 100 attached to a surface treatment tank 10 used for electrolytically treating a surface of a work 1 set as a cathode includes a nozzle unit 200 and an anode unit 300 integrally coupled to the nozzle unit. The nozzle unit includes a plurality of nozzle tubes 210, a common pipe 220, and a piping joint 230 that couples the common pipe to an external pipe. The anode unit includes an anode box 320 and a power receiving part 330 that is adapted to connect an insoluble anode to an external power feeding part 40 installed in the surface treatment tank. The anode box includes at least one insoluble anode 310 disposed at a position horizontally apart from the plurality of nozzle tubes, and partition walls disposed horizontally apart from the insoluble anode. Figure 1
MYPI2019007260A 2017-09-20 2018-09-12 Electrolytic treatment assembly and surface treatment apparatus using same MY194250A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017180041 2017-09-20
PCT/JP2018/033749 WO2019059058A1 (en) 2017-09-20 2018-09-12 Electrolytic treatment assembly and surface treatment apparatus using same

Publications (1)

Publication Number Publication Date
MY194250A true MY194250A (en) 2022-11-24

Family

ID=65810719

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019007260A MY194250A (en) 2017-09-20 2018-09-12 Electrolytic treatment assembly and surface treatment apparatus using same

Country Status (7)

Country Link
JP (1) JP6779547B2 (en)
KR (1) KR20200054134A (en)
CN (1) CN110753763A (en)
MY (1) MY194250A (en)
PH (1) PH12019502478A1 (en)
TW (1) TWI706060B (en)
WO (1) WO2019059058A1 (en)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3352081B2 (en) 2001-02-01 2002-12-03 株式会社アスカエンジニアリング Printed circuit board copper plating equipment
JP2003013291A (en) * 2001-06-29 2003-01-15 Almex Inc Plating apparatus
JP5613499B2 (en) 2010-08-25 2014-10-22 アルメックスＰｅ株式会社 Surface treatment equipment
KR101472637B1 (en) * 2012-12-27 2014-12-15 삼성전기주식회사 Electro Plating Cover Plate and Electro Plating Device having it
JP5785312B2 (en) * 2014-07-04 2015-09-30 アルメックスＰｅ株式会社 Surface treatment equipment
CN104862767B (en) * 2015-05-29 2017-05-10 东莞市开美电路板设备有限公司 Copper plating tank

Also Published As

Publication number Publication date
TW201925540A (en) 2019-07-01
KR20200054134A (en) 2020-05-19
JPWO2019059058A1 (en) 2020-03-26
CN110753763A (en) 2020-02-04
WO2019059058A1 (en) 2019-03-28
PH12019502478A1 (en) 2020-07-20
TWI706060B (en) 2020-10-01
JP6779547B2 (en) 2020-11-04

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