MY193375A - Conductive paste for forming external electrode of multilayer ceramic electronic component - Google Patents
Conductive paste for forming external electrode of multilayer ceramic electronic componentInfo
- Publication number
- MY193375A MY193375A MYPI2021000470A MYPI2021000470A MY193375A MY 193375 A MY193375 A MY 193375A MY PI2021000470 A MYPI2021000470 A MY PI2021000470A MY PI2021000470 A MYPI2021000470 A MY PI2021000470A MY 193375 A MY193375 A MY 193375A
- Authority
- MY
- Malaysia
- Prior art keywords
- conductive paste
- electronic component
- external electrode
- multilayer ceramic
- ceramic electronic
- Prior art date
Links
- 239000000919 ceramic Substances 0.000 title 1
- 238000010304 firing Methods 0.000 abstract 3
- 239000011521 glass Substances 0.000 abstract 3
- 239000002184 metal Substances 0.000 abstract 3
- 229910052751 metal Inorganic materials 0.000 abstract 3
- 239000000843 powder Substances 0.000 abstract 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 239000010949 copper Substances 0.000 abstract 2
- 239000000203 mixture Substances 0.000 abstract 2
- 229910052717 sulfur Inorganic materials 0.000 abstract 2
- 239000011593 sulfur Substances 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Conductive Materials (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
The conductive paste of the present invention includes a metal powder containing copper, a glass composition and an organic vehicle, in which the glass composition contains sulfur (S) and the content of the sulfur (S) is 10 ppm or more and 370 ppm or less with respect to the metal powder. According to the present invention, it is possible to provide a conductive paste that has a wide firing window and is less likely to cause problems such as voids and glass floating after firing as a result of appropriately controlling the firing behavior of the single metal powder containing copper.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018156627 | 2018-08-23 | ||
PCT/JP2019/032446 WO2020040138A1 (en) | 2018-08-23 | 2019-08-20 | Electroconductive paste |
Publications (1)
Publication Number | Publication Date |
---|---|
MY193375A true MY193375A (en) | 2022-10-07 |
Family
ID=69593293
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2021000470A MY193375A (en) | 2018-08-23 | 2019-08-20 | Conductive paste for forming external electrode of multilayer ceramic electronic component |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP6950833B2 (en) |
KR (1) | KR102441705B1 (en) |
CN (1) | CN112602158B (en) |
MY (1) | MY193375A (en) |
TW (1) | TWI772671B (en) |
WO (1) | WO2020040138A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102545056B1 (en) * | 2021-07-13 | 2023-06-21 | (주)창성 | Cupper paste having branch shape and the ceramic product using thereof |
JP7434407B2 (en) | 2022-04-25 | 2024-02-20 | 株式会社ノリタケカンパニーリミテド | Paste for external electrodes |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63308803A (en) * | 1987-01-09 | 1988-12-16 | Hitachi Ltd | Conductive paste and electronic circuit parts using it and its manufacture |
JPH05242725A (en) * | 1992-02-27 | 1993-09-21 | Taiyo Yuden Co Ltd | Conductive paste |
JP3206496B2 (en) * | 1997-06-02 | 2001-09-10 | 昭栄化学工業株式会社 | Metal powder and method for producing the same |
JP4789392B2 (en) * | 2002-11-22 | 2011-10-12 | 京セラ株式会社 | Manufacturing method of ceramic laminate |
JP4291857B2 (en) * | 2007-01-24 | 2009-07-08 | 三ツ星ベルト株式会社 | Copper conductor paste, conductor circuit board and electronic components |
JP4807581B2 (en) * | 2007-03-12 | 2011-11-02 | 昭栄化学工業株式会社 | Nickel powder, method for producing the same, conductor paste, and multilayer ceramic electronic component using the same |
TWI421882B (en) * | 2009-06-08 | 2014-01-01 | Daiken Chemical Co Ltd | Barium titanate powder, nickel paste, preparation method and laminated ceramic capacitors |
WO2013018408A1 (en) * | 2011-07-29 | 2013-02-07 | 株式会社ノリタケカンパニーリミテド | Conductive paste composition for solar cells |
JP2013072091A (en) * | 2011-09-26 | 2013-04-22 | Hitachi Cable Ltd | Metal microparticle and method for producing the same, metal paste containing the metal microparticle, and metal coat made of the metal paste |
JP5958749B2 (en) | 2012-06-22 | 2016-08-02 | 株式会社村田製作所 | Method for producing metal powder |
JP5937904B2 (en) * | 2012-06-26 | 2016-06-22 | 株式会社ノリタケカンパニーリミテド | Paste composition for solar cell electrode |
JP6324253B2 (en) | 2014-07-30 | 2018-05-16 | Jx金属株式会社 | Conductive paste and manufacturing method thereof |
JP2016115448A (en) * | 2014-12-11 | 2016-06-23 | 株式会社村田製作所 | Conductive paste and ceramic electronic component |
KR102561035B1 (en) * | 2015-10-01 | 2023-07-28 | 쇼에이 가가쿠 가부시키가이샤 | Method for forming terminal electrodes of conductive paste and laminated ceramic parts |
CN106024095B (en) * | 2016-05-25 | 2018-05-15 | 苏州晶银新材料股份有限公司 | A kind of solar cell anaerobic glass electrocondution slurry |
-
2019
- 2019-08-20 KR KR1020217006666A patent/KR102441705B1/en active IP Right Grant
- 2019-08-20 CN CN201980055269.0A patent/CN112602158B/en active Active
- 2019-08-20 JP JP2020538406A patent/JP6950833B2/en active Active
- 2019-08-20 WO PCT/JP2019/032446 patent/WO2020040138A1/en active Application Filing
- 2019-08-20 MY MYPI2021000470A patent/MY193375A/en unknown
- 2019-08-22 TW TW108130054A patent/TWI772671B/en active
Also Published As
Publication number | Publication date |
---|---|
WO2020040138A1 (en) | 2020-02-27 |
KR102441705B1 (en) | 2022-09-07 |
TWI772671B (en) | 2022-08-01 |
KR20210048503A (en) | 2021-05-03 |
TW202020895A (en) | 2020-06-01 |
CN112602158B (en) | 2023-11-28 |
JPWO2020040138A1 (en) | 2021-06-03 |
CN112602158A (en) | 2021-04-02 |
JP6950833B2 (en) | 2021-10-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
MY193375A (en) | Conductive paste for forming external electrode of multilayer ceramic electronic component | |
TW200731292A (en) | Conductive compositions and processes for use in the manufacture of semiconductor devices | |
ATE326759T1 (en) | CONDUCTIVE PASTE FOR TERMINAL ELECTRODE OF A CERAMIC MULTI-LAYER ELECTRONIC COMPONENT | |
TW200739611A (en) | Thermosetting type conductive paste and laminated ceramic electronic component having an external electrode formed by using such thermosetting type conductive paste | |
MY186590A (en) | Conductive paste and terminal electrode forming method for laminated ceramic part | |
MX2016001257A (en) | Copper alloy for electronic and electrical equipment, plastically worked copper alloy material for electronic and electrical equipment, and component and terminal for electronic and electrical equipment. | |
TW200733145A (en) | Electron attachment assisted formation of electrical conductors | |
ATE278502T1 (en) | IMPROVED SOFT SOLDERING MATERIALS | |
TW200621412A (en) | Soldering paste and soldering method using same | |
MX2017010892A (en) | Surface-treated metal sheet, coated member and method for producing coated member. | |
MX2017012917A (en) | Method for specifically adjusting the electrical conductivity of conversion coatings. | |
TW200634112A (en) | Coating composition for dielectric insulating film, dielectric insulating film prepared therefrom, and electric or electronic device comprising the same | |
EP3326745A4 (en) | Solder alloy, solder paste, and electronic circuit board | |
BR112015003280A2 (en) | window with electrical connection element | |
MY189234A (en) | Epoxy resin composition, resin layer-attached carrier material metal base circuit substrate, and electronic device | |
EP3712904A4 (en) | Paste composition, semiconductor device, and electrical/electronic component | |
TW200516112A (en) | Organopolysiloxane composition for use in the encapsulation and sealing of precision electronic parts, preventing or retarding the corrosion of the precision electronic part, and silver-containing precision electronic part therewith | |
EP1780747A3 (en) | A conductive electrode powder, a method for preparing the same, and uses thereof | |
TW200505310A (en) | Silver alloy material, circuit substrate, electronic device, and method for manufacturing circuit substrate | |
PH12020551485A1 (en) | Copper alloy for electronic/electric device, copper alloy sheet/strip material for electronic/electric device, component for electronic/electric device, terminal, and busbar | |
TW200741755A (en) | Transparent conductive film and method for making the same | |
TW200705462A (en) | Black conductive thick film compositions, black electrodes, and methods of forming thereof | |
EA201490666A1 (en) | GLASS PANEL, INCLUDING THE FIRST GLASS SHEET, AT LEAST, PARTLY COVERED ELECTROCONDUCTING COATING | |
SG11202011635TA (en) | Electronic content based on neural networks | |
MX2019002691A (en) | Methods of coating an electrically conductive substrate and related electrodepositable compositions including graphenic carbon particles. |