MY193023A - Socket for testing electronic components and test site arrangement - Google Patents
Socket for testing electronic components and test site arrangementInfo
- Publication number
- MY193023A MY193023A MYPI2017703301A MYPI2017703301A MY193023A MY 193023 A MY193023 A MY 193023A MY PI2017703301 A MYPI2017703301 A MY PI2017703301A MY PI2017703301 A MYPI2017703301 A MY PI2017703301A MY 193023 A MY193023 A MY 193023A
- Authority
- MY
- Malaysia
- Prior art keywords
- contact spring
- socket
- force
- sense
- electronic components
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Connecting Device With Holders (AREA)
Abstract
A socket for testing electronic components comprises: a plurality of force-sense pairs, each force-sense pair comprising a force contact spring and a sense contact spring, wherein the force contact spring and the sense contact spring are lying adjacent to each other and wherein at least one of the force contact spring and the sense contact spring is coated with an electrically isolating coating where the force contact spring and the sense contact spring abut against each other.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP16187905 | 2016-09-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY193023A true MY193023A (en) | 2022-09-22 |
Family
ID=56893823
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2017703301A MY193023A (en) | 2016-09-08 | 2017-09-07 | Socket for testing electronic components and test site arrangement |
Country Status (3)
Country | Link |
---|---|
CN (1) | CN107807256B (en) |
DE (1) | DE102017120837B4 (en) |
MY (1) | MY193023A (en) |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11233216A (en) * | 1998-02-16 | 1999-08-27 | Nippon Denki Factory Engineering Kk | Ic socket for test |
JP2005339894A (en) * | 2004-05-25 | 2005-12-08 | Three M Innovative Properties Co | Socket for testing ball grid array integrated circuit |
KR101012712B1 (en) * | 2005-06-10 | 2011-02-09 | 델라웨어 캐피탈 포메이션, 인코포레이티드 | Compliant electrical interconnect and electrical contact probe |
CN201141874Y (en) * | 2007-05-10 | 2008-10-29 | 曹宏国 | Ceramic four-side lead wire piece type carrier element aging test jack |
CN101334425A (en) * | 2007-06-29 | 2008-12-31 | 京元电子股份有限公司 | Integrated circuit element test jack, socket substrate and test machine platform and method of manufacture |
CN101884141B (en) * | 2008-06-12 | 2013-09-11 | 综合测试电子***有限公司 | Contact base |
JP5486866B2 (en) * | 2009-07-29 | 2014-05-07 | ルネサスエレクトロニクス株式会社 | Manufacturing method of semiconductor device |
CN201955353U (en) * | 2010-11-12 | 2011-08-31 | 安拓锐高新测试技术(苏州)有限公司 | Semiconductor chip test socket |
CN202145214U (en) * | 2011-06-30 | 2012-02-15 | 上海韬盛电子科技有限公司 | Semiconductor chip test socket based on Kelvin principle |
US9429591B1 (en) * | 2013-03-15 | 2016-08-30 | Johnstech International Corporation | On-center electrically conductive pins for integrated testing |
CN203350289U (en) * | 2013-06-28 | 2013-12-18 | 中国电子科技集团公司第四十研究所 | CQFP packaged element burn-in test socket provided with floating bracket |
US9354251B2 (en) * | 2014-02-25 | 2016-05-31 | Titan Semiconductor Tool, LLC | Integrated circuit (IC) test socket using Kelvin bridge |
DE102015117354B4 (en) | 2015-10-12 | 2020-02-20 | Multitest Elektronische Systeme Gmbh | Cantilever contact spring and method for producing a cantilever contact spring |
-
2017
- 2017-09-07 MY MYPI2017703301A patent/MY193023A/en unknown
- 2017-09-08 DE DE102017120837.2A patent/DE102017120837B4/en active Active
- 2017-09-08 CN CN201710805082.0A patent/CN107807256B/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN107807256B (en) | 2021-05-25 |
DE102017120837A1 (en) | 2018-03-08 |
DE102017120837B4 (en) | 2019-10-17 |
CN107807256A (en) | 2018-03-16 |
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