MY187700A - Method for manufacturing pad conditioner and pad conditioner - Google Patents
Method for manufacturing pad conditioner and pad conditionerInfo
- Publication number
- MY187700A MY187700A MYPI2016702816A MYPI2016702816A MY187700A MY 187700 A MY187700 A MY 187700A MY PI2016702816 A MYPI2016702816 A MY PI2016702816A MY PI2016702816 A MYPI2016702816 A MY PI2016702816A MY 187700 A MY187700 A MY 187700A
- Authority
- MY
- Malaysia
- Prior art keywords
- pad conditioner
- abrasive grains
- photosensitive film
- manufacturing
- plating layer
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000006061 abrasive grain Substances 0.000 abstract 4
- 238000007747 plating Methods 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 2
- 238000000151 deposition Methods 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Disclosed are herein a pad conditioner (10) and a method for manufacturing the same. The method comprises depositing a photosensitive film (23) on a base substrate, followed by etching to form a plurality of receiving holes in the photosensitive film (23); inserting abrasive grains (27) into the receiving holes (25) and blanketing a plating layer over the photosensitive film and the abrasive grains; removing the base substrate and then the photosensitive film (23); and melting a part of the plating layer to expose a part of each of the abrasive grains (27). The pad conditioner has abrasive grains (27) homogeneously protruding at a uniform height from the plating layer.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020140034834A KR101558449B1 (en) | 2014-03-25 | 2014-03-25 | Manufacturing method of pad conditioner |
Publications (1)
Publication Number | Publication Date |
---|---|
MY187700A true MY187700A (en) | 2021-10-12 |
Family
ID=54195877
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2016702816A MY187700A (en) | 2014-03-25 | 2014-11-11 | Method for manufacturing pad conditioner and pad conditioner |
Country Status (5)
Country | Link |
---|---|
KR (1) | KR101558449B1 (en) |
CN (1) | CN105940484B (en) |
MY (1) | MY187700A (en) |
SG (1) | SG11201606279YA (en) |
WO (1) | WO2015147401A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107336150A (en) * | 2017-08-01 | 2017-11-10 | 华侨大学 | A kind of method that deposition prepares abrasive particle pattern distribution mill |
CN107336148A (en) * | 2017-08-01 | 2017-11-10 | 华侨大学 | A kind of quick method for preparing abrasive particle pattern distribution mill |
KR102013386B1 (en) * | 2018-01-29 | 2019-08-22 | 새솔다이아몬드공업 주식회사 | Manufacturing method of pad conditioner by reverse plating and pad conditioner thereof |
KR20210008872A (en) | 2018-05-22 | 2021-01-25 | 테이코쿠 이온 가부시키가이샤 | Wear-resistant film, wear-resistant member, method of manufacturing abrasion-resistant film and sliding mechanism |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100508300B1 (en) * | 2003-05-06 | 2005-08-17 | (주)디디다이아 | Method of fabricating a chemical mechanical polishing pad conditioner using ceramic material and chemical mechanical polishing pad conditioner fabricated thereby |
JP2007260886A (en) * | 2006-03-30 | 2007-10-11 | Mitsubishi Materials Corp | Cmp conditioner and manufacturing method therefor |
KR20090078647A (en) * | 2008-01-15 | 2009-07-20 | 이화다이아몬드공업 주식회사 | Conditioner for chemical mechanical planarization pad. |
KR20110124988A (en) * | 2010-05-12 | 2011-11-18 | 신한다이아몬드공업 주식회사 | Cmp pad conditioner and its manufacutring method |
KR101178849B1 (en) * | 2010-07-30 | 2012-08-31 | 신한다이아몬드공업 주식회사 | Cmp pad conditioner and its manufacturing method |
JP6014835B2 (en) * | 2011-12-14 | 2016-10-26 | 帝国イオン株式会社 | CMP pad conditioner and method of manufacturing the CMP pad conditioner |
-
2014
- 2014-03-25 KR KR1020140034834A patent/KR101558449B1/en active IP Right Grant
- 2014-11-11 WO PCT/KR2014/010798 patent/WO2015147401A1/en active Application Filing
- 2014-11-11 CN CN201480074561.4A patent/CN105940484B/en active Active
- 2014-11-11 MY MYPI2016702816A patent/MY187700A/en unknown
- 2014-11-11 SG SG11201606279YA patent/SG11201606279YA/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO2015147401A1 (en) | 2015-10-01 |
SG11201606279YA (en) | 2016-09-29 |
CN105940484B (en) | 2018-10-16 |
CN105940484A (en) | 2016-09-14 |
KR101558449B1 (en) | 2015-10-07 |
KR20150111202A (en) | 2015-10-05 |
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