MY179056A - Blackened surface treated copper foil and copper foil with carrier foil - Google Patents

Blackened surface treated copper foil and copper foil with carrier foil

Info

Publication number
MY179056A
MY179056A MYPI2017700671A MYPI2017700671A MY179056A MY 179056 A MY179056 A MY 179056A MY PI2017700671 A MYPI2017700671 A MY PI2017700671A MY PI2017700671 A MYPI2017700671 A MY PI2017700671A MY 179056 A MY179056 A MY 179056A
Authority
MY
Malaysia
Prior art keywords
copper foil
foil
jis
surface treated
stripe
Prior art date
Application number
MYPI2017700671A
Inventor
Misato Mizoguchi
Sakiko Tomonaga
Original Assignee
Mitsui Mining & Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co Ltd filed Critical Mitsui Mining & Smelting Co Ltd
Publication of MY179056A publication Critical patent/MY179056A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

There is provided a surface blackened copper foil treated by fine roughening using copper particles. There is provided the surface blackened copper foil, wherein the treated surface has a root mean square slope R?q of 25 or less of the roughness profile measured in accordance with JIS B 0601 (2001) and a lightness L* of 30 or less of the L*a*b* color system in accordance with JIS Z 8729 (2004) and JIS Z 8722 (2009). According to the present invention, there is provided a surface blackened copper foil which can impart higher transparency to the film after etching of copper foil in the case where the foil laminated to the resin film is processed into stripe or mesh-shaped lines for touch panels, and also can achieve desirable black color sufficient to reduce the visibility of the stripe or mesh-shaped lines.
MYPI2017700671A 2014-09-02 2015-08-25 Blackened surface treated copper foil and copper foil with carrier foil MY179056A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014177946 2014-09-02

Publications (1)

Publication Number Publication Date
MY179056A true MY179056A (en) 2020-10-26

Family

ID=55439670

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017700671A MY179056A (en) 2014-09-02 2015-08-25 Blackened surface treated copper foil and copper foil with carrier foil

Country Status (6)

Country Link
JP (1) JP6539281B2 (en)
KR (1) KR101895256B1 (en)
CN (1) CN106687623B (en)
MY (1) MY179056A (en)
TW (1) TWI568894B (en)
WO (1) WO2016035604A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6848243B2 (en) * 2016-07-25 2021-03-24 住友金属鉱山株式会社 Manufacturing method of conductive substrate
JP7039224B2 (en) * 2016-10-13 2022-03-22 芝浦メカトロニクス株式会社 Electronic component manufacturing equipment and electronic component manufacturing method
KR102394732B1 (en) 2018-04-27 2022-05-09 제이엑스금속주식회사 Surface-treated copper foil, copper clad laminate and printed wiring board
US11753735B2 (en) * 2018-09-06 2023-09-12 Proterial, Ltd. Nickel-coated copper foil and method for manufacturing the same
CN109082697B (en) * 2018-09-12 2020-05-19 河北工业大学 Preparation method of columnar copper particle film
JP7120890B2 (en) * 2018-11-16 2022-08-17 田中貴金属工業株式会社 Conductive substrate provided with metal wiring, method for manufacturing the conductive substrate, and metal ink for forming metal wiring
TWI776168B (en) * 2019-06-19 2022-09-01 金居開發股份有限公司 Advanced reverse-treated electrodeposited copper foil and copper clad laminate using the same
US11332839B2 (en) 2019-06-19 2022-05-17 Co-Tech Development Corp. Advanced electrodeposited copper foil and copper clad laminate using the same
US10619262B1 (en) * 2019-06-27 2020-04-14 Chang Chun Petrochemical Co., Ltd. Electrodeposited copper foil
CN116367414A (en) * 2020-06-11 2023-06-30 三井金属矿业株式会社 Double-sided copper-clad laminate

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4354271B2 (en) * 2003-12-26 2009-10-28 三井金属鉱業株式会社 Browned surface-treated copper foil, method for producing the same, and electromagnetic shielding conductive mesh for front panel of plasma display using the browned surface-treated copper foil
TW200718347A (en) 2005-07-14 2007-05-01 Mitsui Mining & Smelting Co Blackening surface treated copper foil and electromagnetic wave shielding conductive mesh for front panel of plasma display using the blackening surface treated copper foil
JP2009004423A (en) * 2007-06-19 2009-01-08 Hitachi Cable Ltd Copper foil with carrier foil
WO2009041292A1 (en) * 2007-09-28 2009-04-02 Nippon Mining & Metals Co., Ltd. Copper foil for printed circuit and copper clad laminate
JP5256747B2 (en) * 2008-01-21 2013-08-07 宇部興産株式会社 Manufacturing method of copper wiring insulating film by semi-additive method, and copper wiring insulating film manufactured therefrom
JP5167181B2 (en) * 2009-03-25 2013-03-21 大日本印刷株式会社 Electromagnetic wave shielding filter
JP5115527B2 (en) * 2009-08-20 2013-01-09 日立電線株式会社 Copper foil for printed wiring board and method for producing the same
KR20140009323A (en) * 2011-01-26 2014-01-22 스미토모 베이클리트 컴퍼니 리미티드 Printed wiring board and method for manufacturing printed wiring board
JPWO2013099726A1 (en) * 2011-12-26 2015-05-07 パナソニックＩｐマネジメント株式会社 Transparent touch panel electrode laminate
KR101659841B1 (en) * 2012-03-01 2016-09-26 미쓰이금속광업주식회사 Copper foil with attached carrier foil, method for manufacturing copper foil with attached carrier foil, and copper clad laminate board for laser beam drilling obtained by using copper foil with attached carrier foil
JP2013206315A (en) 2012-03-29 2013-10-07 Toppan Printing Co Ltd Film-shaped touch panel sensor and method for manufacturing the same
CN105008593B (en) * 2013-02-28 2018-08-24 三井金属矿业株式会社 Melanism surface treatment copper foil, the manufacturing method of melanism surface treatment copper foil, copper clad laminate and flexible print circuit board

Also Published As

Publication number Publication date
CN106687623A (en) 2017-05-17
JP6539281B2 (en) 2019-07-03
KR20170028968A (en) 2017-03-14
CN106687623B (en) 2019-07-16
KR101895256B1 (en) 2018-09-05
TWI568894B (en) 2017-02-01
JPWO2016035604A1 (en) 2017-06-15
TW201619448A (en) 2016-06-01
WO2016035604A1 (en) 2016-03-10

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