MY176308A - Surface-treated electrolytic copper foil, laminate, printed circuit board and electronic device - Google Patents
Surface-treated electrolytic copper foil, laminate, printed circuit board and electronic deviceInfo
- Publication number
- MY176308A MY176308A MYPI2015701682A MYPI2015701682A MY176308A MY 176308 A MY176308 A MY 176308A MY PI2015701682 A MYPI2015701682 A MY PI2015701682A MY PI2015701682 A MYPI2015701682 A MY PI2015701682A MY 176308 A MY176308 A MY 176308A
- Authority
- MY
- Malaysia
- Prior art keywords
- copper foil
- electrolytic copper
- laminate
- circuit board
- printed circuit
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention provides a surface-treated electrolytic copper foil capable of adopting fine pitch and excellent in adhesion reliability with resin, a laminate and a printed circuit board. The surface-treated electrolytic copper foil has a roughness Rz of the rough surface of the copper foil of 2.0 ?m or less as measured with a stylus-type roughness meter, and a kurtosis number Sku of the roughness curve of the rough surface of 2 to 4.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012257896 | 2012-11-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY176308A true MY176308A (en) | 2020-07-28 |
Family
ID=50776215
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2015701682A MY176308A (en) | 2012-11-26 | 2013-11-26 | Surface-treated electrolytic copper foil, laminate, printed circuit board and electronic device |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP5710845B2 (en) |
KR (2) | KR20140124402A (en) |
CN (1) | CN104812945B (en) |
MY (1) | MY176308A (en) |
PH (1) | PH12015501174B1 (en) |
TW (1) | TWI509111B (en) |
WO (1) | WO2014081041A1 (en) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017006739A1 (en) * | 2015-07-03 | 2017-01-12 | 三井金属鉱業株式会社 | Roughened copper foil, copper-clad laminate and printed wiring board |
CN107923047B (en) * | 2015-07-29 | 2020-05-01 | 纳美仕有限公司 | Roughened copper foil, copper-clad laminate, and printed wiring board |
TWI732892B (en) * | 2016-07-26 | 2021-07-11 | 日商松下知識產權經營股份有限公司 | Laminate board for see-through electrode, see-through electrode material, component, and method for manufacturing laminate board for see-through electrode |
CN109642338B (en) * | 2016-09-12 | 2021-02-09 | 古河电气工业株式会社 | Copper foil and copper-clad plate with same |
KR101734840B1 (en) * | 2016-11-11 | 2017-05-15 | 일진머티리얼즈 주식회사 | Electrolytic copper foil of secondary battery enhanced for flexibility resistance and manufacturing method thereof |
JP7492808B2 (en) | 2017-03-31 | 2024-05-30 | Jx金属株式会社 | Surface-treated copper foil, surface-treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device |
JP7356209B2 (en) * | 2017-03-31 | 2023-10-04 | Jx金属株式会社 | Surface-treated copper foil, surface-treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring boards, and method for manufacturing electronic devices |
KR102340473B1 (en) * | 2017-04-25 | 2021-12-16 | 후루카와 덴키 고교 가부시키가이샤 | surface treatment copper foil |
JP7166334B2 (en) | 2018-03-30 | 2022-11-07 | 三井金属鉱業株式会社 | copper clad laminate |
US11999112B2 (en) * | 2018-04-10 | 2024-06-04 | Dic Corporation | Composite structure and manufacturing method therefor |
KR102479331B1 (en) * | 2018-04-25 | 2022-12-19 | 후루카와 덴키 고교 가부시키가이샤 | Surface treated copper foil, copper clad laminate, and printed wiring board |
JP7032239B2 (en) * | 2018-05-28 | 2022-03-08 | 古河電気工業株式会社 | Lead frame material and its manufacturing method and semiconductor package |
JP6895936B2 (en) * | 2018-09-28 | 2021-06-30 | 古河電気工業株式会社 | Surface-treated copper foil, and copper-clad laminates and circuit boards using this |
US10581081B1 (en) * | 2019-02-01 | 2020-03-03 | Chang Chun Petrochemical Co., Ltd. | Copper foil for negative electrode current collector of lithium ion secondary battery |
WO2020246467A1 (en) * | 2019-06-07 | 2020-12-10 | 古河電気工業株式会社 | Surface-treated copper foil, copper-clad laminate plate, and printed wiring board |
US11332839B2 (en) | 2019-06-19 | 2022-05-17 | Co-Tech Development Corp. | Advanced electrodeposited copper foil and copper clad laminate using the same |
TWI776168B (en) * | 2019-06-19 | 2022-09-01 | 金居開發股份有限公司 | Advanced reverse-treated electrodeposited copper foil and copper clad laminate using the same |
TWI697574B (en) * | 2019-11-27 | 2020-07-01 | 長春石油化學股份有限公司 | Electrolytic copper foil and electrode and lithium-ion battery comprising the same |
WO2021200874A1 (en) * | 2020-03-30 | 2021-10-07 | 三菱マテリアル株式会社 | Bonded body and insulating circuit board |
JP7053976B1 (en) * | 2020-06-11 | 2022-04-12 | 三井金属鉱業株式会社 | Double-sided copper-clad laminate |
WO2022153580A1 (en) * | 2021-01-15 | 2022-07-21 | Jx金属株式会社 | Surface-treated copper foil, copper-clad laminate, and printed wiring board |
WO2023281759A1 (en) * | 2021-07-09 | 2023-01-12 | Jx金属株式会社 | Surface-treated copper foil, copper-clad laminate, and printed wiring board |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4567360B2 (en) * | 2004-04-02 | 2010-10-20 | 三井金属鉱業株式会社 | Copper foil manufacturing method and copper foil obtained by the manufacturing method |
JP5129642B2 (en) * | 2007-04-19 | 2013-01-30 | 三井金属鉱業株式会社 | Surface treated copper foil, copper clad laminate obtained using the surface treated copper foil, and printed wiring board obtained using the copper clad laminate |
JP5215631B2 (en) * | 2007-10-24 | 2013-06-19 | 三井金属鉱業株式会社 | Surface treated copper foil |
TWI434965B (en) * | 2008-05-28 | 2014-04-21 | Mitsui Mining & Smelting Co | A roughening method for copper foil, and a copper foil for a printed wiring board which is obtained by the roughening method |
US8524378B2 (en) * | 2008-11-25 | 2013-09-03 | Jx Nippon Mining & Metals Corporation | Copper foil for printed circuit |
JP5282675B2 (en) * | 2009-06-23 | 2013-09-04 | 日立電線株式会社 | Copper foil for printed wiring board and method for producing the same |
JP5634103B2 (en) * | 2010-04-06 | 2014-12-03 | 福田金属箔粉工業株式会社 | A treated copper foil for a copper clad laminate, a copper clad laminate obtained by bonding the treated copper foil to an insulating resin substrate, and a printed wiring board using the copper clad laminate. |
JP5885054B2 (en) * | 2010-04-06 | 2016-03-15 | 福田金属箔粉工業株式会社 | A treated copper foil for a copper clad laminate, a copper clad laminate obtained by bonding the treated copper foil to an insulating resin substrate, and a printed wiring board using the copper clad laminate. |
WO2012046804A1 (en) * | 2010-10-06 | 2012-04-12 | 古河電気工業株式会社 | Copper foil and manufacturing method therefor, copper foil with carrier and manufacturing method therefor, printed circuit board, and multilayer printed circuit board |
JP5929220B2 (en) * | 2011-01-26 | 2016-06-01 | 住友ベークライト株式会社 | Printed wiring board and printed wiring board manufacturing method |
-
2013
- 2013-11-26 KR KR1020147025481A patent/KR20140124402A/en active Application Filing
- 2013-11-26 TW TW102143163A patent/TWI509111B/en active
- 2013-11-26 JP JP2014531008A patent/JP5710845B2/en active Active
- 2013-11-26 CN CN201380061468.5A patent/CN104812945B/en active Active
- 2013-11-26 MY MYPI2015701682A patent/MY176308A/en unknown
- 2013-11-26 WO PCT/JP2013/081806 patent/WO2014081041A1/en active Application Filing
- 2013-11-26 KR KR1020167036617A patent/KR102078897B1/en active IP Right Grant
-
2015
- 2015-05-26 PH PH12015501174A patent/PH12015501174B1/en unknown
Also Published As
Publication number | Publication date |
---|---|
JPWO2014081041A1 (en) | 2017-01-05 |
CN104812945A (en) | 2015-07-29 |
JP5710845B2 (en) | 2015-04-30 |
WO2014081041A1 (en) | 2014-05-30 |
KR20170002705A (en) | 2017-01-06 |
TWI509111B (en) | 2015-11-21 |
PH12015501174A1 (en) | 2015-08-10 |
PH12015501174B1 (en) | 2015-08-10 |
CN104812945B (en) | 2018-08-28 |
KR102078897B1 (en) | 2020-02-19 |
KR20140124402A (en) | 2014-10-24 |
TW201428139A (en) | 2014-07-16 |
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