MY170481A - Slurry management device for wire saw - Google Patents

Slurry management device for wire saw

Info

Publication number
MY170481A
MY170481A MYPI2013002082A MYPI2013002082A MY170481A MY 170481 A MY170481 A MY 170481A MY PI2013002082 A MYPI2013002082 A MY PI2013002082A MY PI2013002082 A MYPI2013002082 A MY PI2013002082A MY 170481 A MY170481 A MY 170481A
Authority
MY
Malaysia
Prior art keywords
slurry
tank
passage
waste
wire saw
Prior art date
Application number
MYPI2013002082A
Inventor
Mikio Takasu
Masaya Tanaka
Hiroaki Ueda
Tsutomu Matsushita
Shinji Kawabuchi
Original Assignee
Ihi Compressor And Machinery Co Ltd
Ihi Rotating Machinery Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ihi Compressor And Machinery Co Ltd, Ihi Rotating Machinery Eng Co Ltd filed Critical Ihi Compressor And Machinery Co Ltd
Publication of MY170481A publication Critical patent/MY170481A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007—Use, recovery or regeneration of abrasive mediums
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/12—Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

First tank (5A) receives slurry waste (3); centrifugal separator (14) separates slurry (2) from slurry waste (3b) from the tank (5A); second tank (5B) receives solid-content- containing slurry (2) from the separator (14); slurry supply passage (26) supplies the slurry (2) from the tank 5B to fixed-abrasive wire saw (1); a controller (41) determines slurry concentration from detected values from specific gravimeter (29) and viscometer (30) incorporated in circulation passage (28) circulates the slurry (2) from the tank (5B); slurry discharge passage (33) discharges part of the slurry (2) from the tank (5B) as waste slurry (31); and new slurry supply passage (38) supplies new slurry (2a) to the tank (5B). Discharge of waste slurry (31) through the passage (33) and supply of new slurry through the passage (38) are conducted to maintain slurry concentration determined by the controller (41) to stipulation concentration.
MYPI2013002082A 2010-12-16 2011-12-14 Slurry management device for wire saw MY170481A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010280225A JP5624449B2 (en) 2010-12-16 2010-12-16 Wire saw slurry management device

Publications (1)

Publication Number Publication Date
MY170481A true MY170481A (en) 2019-08-07

Family

ID=46244358

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013002082A MY170481A (en) 2010-12-16 2011-12-14 Slurry management device for wire saw

Country Status (7)

Country Link
JP (1) JP5624449B2 (en)
KR (1) KR101860296B1 (en)
CN (1) CN103237628B (en)
MY (1) MY170481A (en)
SG (1) SG191158A1 (en)
TW (1) TWI533973B (en)
WO (1) WO2012081239A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6085500B2 (en) * 2013-03-08 2017-02-22 株式会社Ｉｈｉ回転機械 Wire source slurry coolant recovery system
JP6819619B2 (en) * 2018-01-22 2021-01-27 信越半導体株式会社 Work cutting method and wire saw
JP7003897B2 (en) * 2018-11-16 2022-02-04 株式会社Sumco Wafer manufacturing method, quality evaluation method for recycled slurry for wire saw, and quality evaluation method for used slurry for wire saw
CN111805775B (en) * 2020-06-09 2022-08-26 徐州鑫晶半导体科技有限公司 Mortar supply method, mortar supply equipment and crystal bar cutting system

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5799643A (en) * 1995-10-04 1998-09-01 Nippei Toyama Corp Slurry managing system and slurry managing method for wire saws
JP2000141362A (en) * 1998-11-11 2000-05-23 Tokyo Seimitsu Co Ltd Control device in changing working fluid of wire saw
JP3776675B2 (en) * 2000-03-30 2006-05-17 三倉物産株式会社 Recycling equipment for inorganic abrasive waste liquid
JP2002144229A (en) * 2000-11-02 2002-05-21 Nippei Toyama Corp Wire-saw nd cutting method for wire-saw
CN101500754A (en) * 2006-08-16 2009-08-05 旭硝子株式会社 Method of recovering abrasive from abrasive slurry waste liquid and apparatus therefor
MX2009002368A (en) * 2006-08-30 2009-04-24 Saint Gobain Ceramics Aqueous fluid compositions for abrasive slurries, methods of production, and methods of use thereof.
KR100786644B1 (en) * 2007-06-15 2007-12-21 주식회사 유스테크코리아 Regenerating process and regenerating system toregenerate waste slurry from semiconductor wafermanufacturing process
JP2010029998A (en) * 2008-07-30 2010-02-12 Japan Fine Steel Co Ltd Method and device for treating coolant used for fixed abrasive grain wire saw
JP5399125B2 (en) * 2009-04-27 2014-01-29 株式会社Ｉｈｉ回転機械 Coolant management method and apparatus for wire saw
JP2010253621A (en) * 2009-04-27 2010-11-11 Ihi Compressor & Machinery Co Ltd Method and device for controlling coolant of wire saw
CN201573118U (en) * 2010-01-11 2010-09-08 湖南湘牛环保实业有限公司 Grinding fluid centralized purifying and recycling device

Also Published As

Publication number Publication date
JP2012125891A (en) 2012-07-05
JP5624449B2 (en) 2014-11-12
SG191158A1 (en) 2013-07-31
WO2012081239A1 (en) 2012-06-21
TWI533973B (en) 2016-05-21
TW201236815A (en) 2012-09-16
CN103237628A (en) 2013-08-07
CN103237628B (en) 2016-07-06
KR101860296B1 (en) 2018-05-23
KR20130128415A (en) 2013-11-26

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