MY170481A - Slurry management device for wire saw - Google Patents
Slurry management device for wire sawInfo
- Publication number
- MY170481A MY170481A MYPI2013002082A MYPI2013002082A MY170481A MY 170481 A MY170481 A MY 170481A MY PI2013002082 A MYPI2013002082 A MY PI2013002082A MY PI2013002082 A MYPI2013002082 A MY PI2013002082A MY 170481 A MY170481 A MY 170481A
- Authority
- MY
- Malaysia
- Prior art keywords
- slurry
- tank
- passage
- waste
- wire saw
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/007—Use, recovery or regeneration of abrasive mediums
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/12—Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
First tank (5A) receives slurry waste (3); centrifugal separator (14) separates slurry (2) from slurry waste (3b) from the tank (5A); second tank (5B) receives solid-content- containing slurry (2) from the separator (14); slurry supply passage (26) supplies the slurry (2) from the tank 5B to fixed-abrasive wire saw (1); a controller (41) determines slurry concentration from detected values from specific gravimeter (29) and viscometer (30) incorporated in circulation passage (28) circulates the slurry (2) from the tank (5B); slurry discharge passage (33) discharges part of the slurry (2) from the tank (5B) as waste slurry (31); and new slurry supply passage (38) supplies new slurry (2a) to the tank (5B). Discharge of waste slurry (31) through the passage (33) and supply of new slurry through the passage (38) are conducted to maintain slurry concentration determined by the controller (41) to stipulation concentration.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010280225A JP5624449B2 (en) | 2010-12-16 | 2010-12-16 | Wire saw slurry management device |
Publications (1)
Publication Number | Publication Date |
---|---|
MY170481A true MY170481A (en) | 2019-08-07 |
Family
ID=46244358
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2013002082A MY170481A (en) | 2010-12-16 | 2011-12-14 | Slurry management device for wire saw |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP5624449B2 (en) |
KR (1) | KR101860296B1 (en) |
CN (1) | CN103237628B (en) |
MY (1) | MY170481A (en) |
SG (1) | SG191158A1 (en) |
TW (1) | TWI533973B (en) |
WO (1) | WO2012081239A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6085500B2 (en) * | 2013-03-08 | 2017-02-22 | 株式会社Ihi回転機械 | Wire source slurry coolant recovery system |
JP6819619B2 (en) * | 2018-01-22 | 2021-01-27 | 信越半導体株式会社 | Work cutting method and wire saw |
JP7003897B2 (en) * | 2018-11-16 | 2022-02-04 | 株式会社Sumco | Wafer manufacturing method, quality evaluation method for recycled slurry for wire saw, and quality evaluation method for used slurry for wire saw |
CN111805775B (en) * | 2020-06-09 | 2022-08-26 | 徐州鑫晶半导体科技有限公司 | Mortar supply method, mortar supply equipment and crystal bar cutting system |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5799643A (en) * | 1995-10-04 | 1998-09-01 | Nippei Toyama Corp | Slurry managing system and slurry managing method for wire saws |
JP2000141362A (en) * | 1998-11-11 | 2000-05-23 | Tokyo Seimitsu Co Ltd | Control device in changing working fluid of wire saw |
JP3776675B2 (en) * | 2000-03-30 | 2006-05-17 | 三倉物産株式会社 | Recycling equipment for inorganic abrasive waste liquid |
JP2002144229A (en) * | 2000-11-02 | 2002-05-21 | Nippei Toyama Corp | Wire-saw nd cutting method for wire-saw |
CN101500754A (en) * | 2006-08-16 | 2009-08-05 | 旭硝子株式会社 | Method of recovering abrasive from abrasive slurry waste liquid and apparatus therefor |
MX2009002368A (en) * | 2006-08-30 | 2009-04-24 | Saint Gobain Ceramics | Aqueous fluid compositions for abrasive slurries, methods of production, and methods of use thereof. |
KR100786644B1 (en) * | 2007-06-15 | 2007-12-21 | 주식회사 유스테크코리아 | Regenerating process and regenerating system toregenerate waste slurry from semiconductor wafermanufacturing process |
JP2010029998A (en) * | 2008-07-30 | 2010-02-12 | Japan Fine Steel Co Ltd | Method and device for treating coolant used for fixed abrasive grain wire saw |
JP5399125B2 (en) * | 2009-04-27 | 2014-01-29 | 株式会社Ihi回転機械 | Coolant management method and apparatus for wire saw |
JP2010253621A (en) * | 2009-04-27 | 2010-11-11 | Ihi Compressor & Machinery Co Ltd | Method and device for controlling coolant of wire saw |
CN201573118U (en) * | 2010-01-11 | 2010-09-08 | 湖南湘牛环保实业有限公司 | Grinding fluid centralized purifying and recycling device |
-
2010
- 2010-12-16 JP JP2010280225A patent/JP5624449B2/en active Active
-
2011
- 2011-12-05 TW TW100144656A patent/TWI533973B/en not_active IP Right Cessation
- 2011-12-14 CN CN201180060317.9A patent/CN103237628B/en not_active Expired - Fee Related
- 2011-12-14 WO PCT/JP2011/006964 patent/WO2012081239A1/en active Application Filing
- 2011-12-14 SG SG2013045786A patent/SG191158A1/en unknown
- 2011-12-14 MY MYPI2013002082A patent/MY170481A/en unknown
- 2011-12-14 KR KR1020137015183A patent/KR101860296B1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
JP2012125891A (en) | 2012-07-05 |
JP5624449B2 (en) | 2014-11-12 |
SG191158A1 (en) | 2013-07-31 |
WO2012081239A1 (en) | 2012-06-21 |
TWI533973B (en) | 2016-05-21 |
TW201236815A (en) | 2012-09-16 |
CN103237628A (en) | 2013-08-07 |
CN103237628B (en) | 2016-07-06 |
KR101860296B1 (en) | 2018-05-23 |
KR20130128415A (en) | 2013-11-26 |
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